EP1SGX25DF1020C6B - Stratix GX FPGA, 25K LE, 1020-BGA | Altera
MPN: EP1SGX25DF1020C6B ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $220 | $22,000.00 |
| 250 | $195 | $48,750.00 |
| 500 | $175 | $87,500.00 |
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View Datasheet →EP1SGX25DF1020C6B Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Family | EP1SGX25 |
| Logic Elements | 25,660 |
| Total Memory Bits | 1,944,576 |
| User I/O Count | 607 |
| Package | 1020-BBGA (33 × 33 mm, 1.0 mm pitch) |
| Supply Voltage (Core) | 1.5 V |
| Operating Temperature | 0 °C to 85 °C (Commercial) |
| Speed Grade | C6 |
| Mounting Type | Surface Mount (BGA) |
| Lead-Free | Yes (per DigiChip package note) |
| Transceivers | Embedded high-speed serial transceivers (multi-gigabit) |
| PLLs | On-chip phase-locked loops for clock management |
| DSP Blocks | Hardware multipliers / DSP blocks |
| External Memory Support | DDR, DDR2, SDR, QDR, QDRII SRAM |
| Hard IP | PCI Express (per Stratix GX family) |
EP1SGX25DF1020C6B 1020-bbga (33 × 33 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for EP1SGX25DF1020C6B (1020-bbga (33 × 33 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF1020C6B.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF1020C6B is suitable for 6 applications: Telecom Backhaul / Line Card Aggregation, Software Defined Radio (SDR) Baseband, High-Performance DSP / Video Imaging Pipeline, ASIC Prototyping and Emulation, Industrial / Defense Ruggedized Systems, PCIe Endpoint / Root Complex Add-In Cards.
Telecom Backhaul / Line Card Aggregation
The EP1SGX25DF1020C6B is well suited for telecom backhaul line cards where multi-gigabit serial aggregation is required. Its embedded transceivers support CPRI, OBSAI, and SONET/SDH protocols at line rates up to 3.1875 Gbps per channel, eliminating external PHY chips. With 25,660 logic elements and 1.9 Mbit of embedded RAM, the fabric can absorb packet header processing, queue management, and timing-and-sync functions alongside the physical layer. Designers typically map one or two transceiver channels to backplane SFP+ cages and dedicate the remaining channels to inter-card links, while DDR2 controller IP provides deep buffering for traffic bursts.
Recommended
Software Defined Radio (SDR) Baseband
Stratix GX devices such as the EP1SGX25DF1020C6B are commonly used as the digital baseband processor in software-defined radio platforms. The hardware multipliers and DSP blocks accelerate FFT, channelization, and modulation/demodulation tasks, while the multi-gigabit transceivers stream digitized IF or RF data from analog front-end ADCs. With 25,660 logic elements and roughly 1.9 Mbit of on-chip RAM, designers can host multiple concurrent channels (Wi-Fi, LTE, custom waveforms) without external memory pressure. The 1020-BBGA package allows dense parallel ADC/DAC interfaces to be broken out directly to FPGA pins, minimizing analog trace lengths.
Recommended
High-Performance DSP / Video Imaging Pipeline
The EP1SGX25DF1020C6B is widely deployed in real-time video processing, medical imaging, and machine-vision systems that demand high pixel throughput. Its DSP blocks deliver hundreds of GMACs of multiply-accumulate throughput for FIR filters, convolution kernels, and DCT/IDCT transforms, while the 1.9 Mbit embedded RAM serves as line buffers for streaming pixel data. With 607 user I/Os, designers can connect multiple camera interfaces (LVDS, sub-LVDS, SLVS) directly to the FPGA without external muxing. The PCIe hard IP block enables the board to plug into host processors as a co-processing accelerator.
Recommended
ASIC Prototyping and Emulation
The EP1SGX25DF1020C6B is an effective vehicle for prototyping mid-complexity ASICs before mask commitment. Its Stratix GX architecture is HDL-compatible with popular ASIC synthesis flows, and 25,660 logic elements provide roughly 2.5-3 million gates of mapped ASIC complexity when accounting for the area penalty of FPGA LUTs versus standard cells. The 607 user I/Os map to dozens of package pins for break-out prototyping headers, while the embedded transceivers model SerDes interfaces in the target ASIC. Designers can use Quartus II's ASIC prototyping flow to partition large ASIC designs across multiple EP1SGX25 devices on a multi-FPGA board.
Recommended
Industrial / Defense Ruggedized Systems
Industrial and defense applications value the EP1SGX25DF1020C6B's commercial temperature range, BGA ruggedization, and embedded PCIe for ruggedized SBC backplane interconnects. While the part itself is commercial grade (0 °C to 85 °C), the 1020-BBGA package provides strong solder joint reliability under shock and vibration, and the Stratix GX family is widely used in defense electronics. Designers can pair the device with industrial-grade companion FPGAs from the same family (e.g., EP1SGX25DF1020I6N for -40 °C to 100 °C) when temperature margin is required, while keeping the same board layout and bitstream flow.
Recommended
PCIe Endpoint / Root Complex Add-In Cards
The EP1SGX25DF1020C6B integrates a hard PCI Express IP block, allowing designers to implement Gen1/Gen2 endpoints without consuming fabric logic. With 25,660 logic elements and 607 user I/Os, the device can host a complete PCIe add-in card including DMA engines, scatter-gather controllers, and application-layer payload interfaces to DSP blocks or memory. The 1020-BBGA package exposes enough I/Os for parallel memory buses and external PHY interfaces alongside the PCIe lanes. Designers targeting higher line rates than Gen2 should migrate to Stratix IV GX or Arria V GX families, which support Gen3.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF1020C6B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF1020C6 | EP1SGX25DF1020C5N | EP1SGX25DF1020C5ES | EP1SGX25DF1020C5 | EP1SGX25DF1020C4 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-BBGA | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Memory Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| User I/Os | 607 | 607 | 607 | 607 | 607 | 607 |
| Speed Grade | C6 | C6 | C5 | C5 | C5 | C4 |
| Temperature Grade | Commercial (0 °C to 85 °C) | Commercial | Commercial | Commercial (extended screening) | Commercial | Commercial |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Estimated Unit Price (USD, qty 1, as of 2026-09-07) | 285.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest I/O-count 1020-BBGA option in the EP1SGX25 family (vs EP1SGX25DF1020C5N)
- Pin-compatible with entire EP1SGX25 1020-BBGA family (vs EP1SGX25CF672I6N)
- Hard PCI Express IP block integrated (vs Non-Altera FPGAs of similar vintage)
Design Notes
Estimated: a 12-layer stack-up with matched 50 Ω differential traces is recommended for the EP1SGX25DF1020C6B's multi-gigabit transceiver channels. Use 0.1 µF X7R ceramic bypass capacitors within 5 mm of every power pin, plus 10 µF bulk capacitors per supply rail. The 1020-BBGA's 1.0 mm ball pitch requires laser-drilled micro-vias or sequential lamination; ensure your PCB fab house supports the EP1SGX25 BGA escape routing pattern before commit. Source guidance: Altera Stratix GX Hardware Reference Manual.
Estimated: transceiver channel performance depends critically on maintaining differential trace impedance of 100 Ω ±10% and intra-pair skew below 1 ps per cm. Use length-matched serpentine routing on all PCIe, XAUI, or SerialLite II links. For DDR2 interfaces, place series-termination resistors at the FPGA driver end and tune ODT settings in the Quartus II pin planner. Source guidance: Altera Stratix GX Transceiver User Guide.
Estimated: at full fabric utilization (25,660 LE toggle rate ~12.5%) and active transceivers, the EP1SGX25DF1020C6B can dissipate between 5 W and 8 W depending on toggle and clock rates. The 1020-BBGA package has a θJA of roughly 10 °C/W with 25 mm² of internal copper, so a heat sink or forced-air cooling is recommended for sealed enclosures. Designers should thermal-couple the BGA lid to a chassis plate via thermal pads for improved dissipation. Source guidance: Stratix GX Packaging and Thermal datasheet.
Common pitfalls include failing to enable CRC checking on incoming transceiver data, neglecting to power-cycle VCCPD before VCCINT during hot-plug, and routing transceiver reference clocks across noisy power planes. Designers should also avoid using LVDS inputs on pins adjacent to high-speed transceivers without proper isolation, and must configure MSEL pins correctly for the desired POR (power-on reset) configuration scheme. Source guidance: Altera Stratix GX Configuration Handbook.
Compliance Information
Lead-free per DigiChip package description (FBGA-1020 LEAD FREE). RoHS, REACH, halogen-free, and conflict-mineral status not explicitly stated in distributor excerpts — marked unknown.
