EP3SL50F484I4L - 50K LE Stratix III L FPGA, 484-FBGA | Intel
부품 번호: EP3SL50F484I4L ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $822.83 | $822.83 |
| 10 | $781.69 | $7,816.90 |
| 100 | $740.55 | $74,055.00 |
| 500 | $699.41 | $349,705.00 |
| 1,000 | $658.26 | $658,260.00 |
EP3SL50F484I4L 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device that sits between fixed-function ASICs and general-purpose processors in the silicon hierarchy: FPGAs -> programmable logic -> semiconductor. Engineers instantiate custom digital circuits in LUTs (look-up tables), route them through a programmable interconnect fabric, and accelerate parallel datapaths that would otherwise force a CPU or DSP into cycle-bound execution. The Stratix III L sub-family specifically targets power-sensitive applications such as wireless baseband, software-defined radio, and high-end image processing, where static and dynamic power must both be tightly controlled.
Key features include 47,500 logic elements, 2,184,192 bits of embedded RAM (~273 KB), 296 user I/O pins, on-chip transceivers (per Stratix III family architecture), DSP blocks, and Stratix III's signature programmable power technology that lets unused tiles enter a near-zero static state. The device supports external memory interfaces including DDR3, DDR2, and QDR II+, and integrates hard IP for PCI Express Gen1/Gen2 endpoints. Speed grade 4 is a mid-bandwidth bin, while the industrial temperature rating permits operation in chassis and outdoor enclosures.
Architecturally, the EP3SL50F484I4L uses TSMC's 65 nm low-power process with Altera's adaptive logic modules (ALMs), each containing two combined LUTs and two dedicated adders. TriMatrix embedded memory provides three port widths and depths per block, and the MultiTrack interconnect fabric delivers predictable timing closure for large fan-out datapaths. The 'L' core statically saves 50% of dynamic power compared to the standard Stratix III core at equivalent performance.
Typical applications include software-defined radio baseband processing, LTE / WCDMA channel-card line-rate processing, military secure communications, ASIC prototyping, and high-throughput industrial imaging pipelines. The wide I/O count (296) is suitable for parallel LVDS or DDR3 memory interfaces where many lanes are required simultaneously.
When designing with this device, always supply all Stratix III core, I/O, and auxiliary rails (VCCINT, VCCD_PLL, VCCIO per bank, VCCAUX, VCCPGM) with proper decoupling. Configuration via passive serial, fast passive parallel, or JTAG is supported; route CONF_DONE and nSTATUS to a pull-up so the FPGA does not remain in an undefined state after power-up. Use the Quartus II / Quartus Prime design suite for synthesis, place-and-route, and power estimation.
This page combines distributor pricing, same-family drop-in alternatives, and practical design notes drawn from Intel's Stratix III handbook and Quartus II device documentation, providing context not available on the manufacturer product page alone.
드롭인 대체품: EP3SL50F484I4L — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL50F484I4L (동일 폼 팩터 및 풋프린트) — 차이점: Package, Embedded Memory, Series, Process Technology, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL50F484I4G
✅ 드롭인✓ 재고 있음
$165 / 개
데이터시트 보기 →EP3SL50F484I4
✅ 드롭인✓ 재고 있음
$558 / 개
데이터시트 보기 →EP3SL50F484I3N
✅ 드롭인✓ 재고 있음
$552.3 / 개
데이터시트 보기 →EP3SL50F484I3G
✅ 드롭인✓ 재고 있음
$215 / 개
데이터시트 보기 →EP3SL50F484C4N
✅ 드롭인✓ 재고 있음
$325 / 개
데이터시트 보기 →EP3SL50F484C4L
✅ 드롭인✓ 재고 있음
$651.25 / 개
데이터시트 보기 →EP3SL50F484I4L 최대 정격 & 전기적 특성
| Series | Stratix III L (Low Power) |
| Family | Stratix III |
| Logic Elements (LE) | 47,500 |
| Embedded Memory Bits | 2,184,192 bits (~273 KB) |
| User I/O Pins | 296 |
| 패키지 | 484-ball FBGA (FCBGA) |
| Speed Grade | 4 |
| 동작 온도 | 0 °C to 85 °C (commercial, per DigiKey listing) |
| 공급 전압 | 0.9 V core (family-typical) |
| Process Technology | 65 nm low-power CMOS |
| 실장 유형 | Surface Mount |
| Lead-Free / RoHS | Yes (RoHS compliant) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
| Transceivers | Family supports up to 4 transceivers per family datasheet |
| DSP Blocks | Family supports up to 384 18x18 multipliers (family-level) |
EP3SL50F484I4L 484-ball fbga (fcbga) 핀 구성 가이드
EP3SL50F484I4L(484-ball fbga (fcbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL50F484I4L.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL50F484I4L 적합 용도: 6 애플리케이션s: Software-Defined Radio (SDR) Baseband, ASIC Prototyping and Emulation, High-Throughput Industrial Imaging, Military / Aerospace Secure Communications, High-Speed Network Packet Processing, Medical Imaging and Diagnostics.
Software-Defined Radio (SDR) Baseband
The EP3SL50F484I4L is well suited for software-defined radio baseband processing because its 47,500 logic elements and 2,184,192 bits of embedded memory provide enough capacity to implement multi-carrier LTE or WCDMA physical-layer datapaths in a single device. The Stratix III L low-power core uses programmable power technology to gate unused ALMs, which is critical when the line card dissipates tens of watts and must stay within thermal envelopes. The 296 user I/O pins support parallel LVDS interfaces to wideband ADCs/DACs operating at hundreds of MSPS, while on-chip transceivers handle chip-to-chip links to RF front-end modules. Quartus II reference designs for SDR are available in the Stratix III handbook.
추천
ASIC Prototyping and Emulation
The EP3SL50F484I4L is widely deployed as an ASIC prototyping engine because its 47,500 logic elements and TriMatrix embedded memory can hold large synthesizable netlists while preserving signal-level debug visibility. Multi-FPGA partitioning tools from Intel and Synopsys let designers split million-gate ASICs across multiple Stratix III boards connected via the 296 user I/O pins, achieving near-real-time ASIC verification. The low-power 'L' core reduces multi-FPGA chassis cooling requirements compared to the 'E' core, and JTAG-based configuration simplifies incremental bitstream loads during debug iterations.
추천
High-Throughput Industrial Imaging
In machine-vision and print-inspection systems, the EP3SL50F484I4L processes parallel image data streams from multiple high-resolution Camera Link or CoaXPress sensors. The 47,500 logic elements and 296 I/O pins allow simultaneous interfacing with 4–8 image sensors, while the 2,184,192 bits of embedded memory buffer line-scan data between sensor and DMA transfer. The industrial temperature rating (–40 °C to +100 °C case) supports deployment in factory-floor enclosures without forced-air cooling. Low-power Stratix III L operation also simplifies IEC 61850 EMC compliance in industrial environments.
추천
Military / Aerospace Secure Communications
The EP3SL50F484I4L's industrial temperature range (–40 °C to +100 °C case), radiation-tolerant design rules, and built-in AES bitstream encryption make it a candidate for secure tactical radio and signal-intelligence platforms. The Stratix III L low-power core limits thermal load in sealed enclosures, while the 296 I/O pins support parallel LVDS links to RF upconverters and high-speed ADCs. Designers should implement multi-bit error correction in user logic to mitigate single-event upsets, since commercial-grade Stratix III parts are not radiation-hardened by default.
추천
High-Speed Network Packet Processing
The EP3SL50F484I4L is used in 10G/40G Ethernet line cards where 296 user I/O pins can drive multiple SFP+ cages while 2,184,192 bits of embedded memory buffer packet descriptors. The Stratix III L core's programmable power technology lets idle ALMs enter low-leakage state, an advantage in chassis with constrained airflow. On-chip transceivers (per Stratix III family architecture) handle multi-gigabit serial links to switch fabrics and backplanes. Quartus II IP cores for 10G MAC, Interlaken, and PCI Express Gen2 are available to accelerate time-to-market.
추천
Medical Imaging and Diagnostics
In ultrasound, CT, and MRI front-end systems, the EP3SL50F484I4L performs beamforming and image reconstruction at sample rates above 100 MSPS. The 47,500 logic elements and DSP blocks can implement 64-channel digital beamformers with precise phase and gain control, while the 296 user I/O pins stream digitized RF data to back-end processors. The low-power 'L' core reduces patient-probe thermal dissipation, and the industrial temperature range supports continuous-duty diagnostic equipment. Designers should verify IEC 60601 EMC compliance at the system level.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL50F484I4L — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL50F484I4G | EP3SL50F484I4 | EP3SL50F484I3N | EP3SL50F484I3G | EP3SL50F484C4N | EP3SL50F484C4L |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (FCBGA) | 484-FBGA (FCBGA) - same | 484-FBGA (FCBGA) - same | 484-FBGA (FCBGA) - same | 484-FBGA (FCBGA) - same | 484-FBGA (FCBGA) - same | 484-FBGA (FCBGA) - same |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Embedded Memory (bits) | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 |
| User I/O Pins | 296 | 296 | 296 | 296 | 296 | 296 | 296 |
| Speed Grade | 4 | 4 | 4 | 3 (faster) | 3 (faster) | 4 | 4 |
| Temperature Range | Industrial –40 °C to +100 °C | Industrial –40 °C to +100 °C | Industrial –40 °C to +100 °C | Industrial –40 °C to +100 °C | Industrial –40 °C to +100 °C | Commercial 0 °C to 85 °C | Commercial 0 °C to 85 °C |
| Lead-Free / RoHS | Yes (RoHS, L suffix) | Yes (RoHS, G suffix) | No (SnPb, no suffix) | No (SnPb) | Yes (RoHS) | No (SnPb) | Yes (RoHS) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Lowest-power Stratix III variant in a 484-FBGA package (vs EP3SE50F484I4L)
- Pin-compatible Pb-free terminal-finish variant available (vs EP3SL50F484I4G)
- Industrial temperature grade vs commercial variants in same footprint (vs EP3SL50F484C4N)
- Speed grade 4 vs faster speed grade 3 (vs EP3SL50F484I3N)
설계 노트
Stratix III L devices require five separate power rails: VCCINT (0.9 V core), VCCD_PLL (1.2 V PLL digital), VCCIO (per I/O bank, 1.2–3.3 V), VCCAUX (2.5 V), and VCCPGM (1.8–3.3 V configuration). Use a sequenced power supply such as the LTC3612 or LTM4676 with proper Power-On-Reset (POR) tracking — VCCINT must ramp before VCCIO and VCCAUX per Intel's Stratix III Device Handbook. Decoupling caps: 0.1 µF + 1 µF ceramic at every VCCINT ball, bulk 220 µF + 470 µF low-ESR tantalum near the package edge. Estimated: a fully populated EP3SL50 at 50% toggle rate draws ~6–9 W core power, requiring a 9 W thermal budget.
The 484-FBGA uses 0.8 mm ball pitch — escape routing requires microvia (HDI) stack-up with laser-drilled vias on 0.4 mm pitch. Use a 6-layer minimum stack-up with two inner ground planes directly under the package to control return paths. Per the Stratix III handbook, all VCCINT and GND balls must connect to planes with via-in-pad or via-on-pad techniques; dog-bone fan-out is not recommended above 200 MHz. Maintain 100 Ω differential impedance for LVDS pairs and 50 Ω single-ended for general-purpose I/O.
Do not leave the configuration pins (nCONFIG, nSTATUS, CONF_DONE) floating during power-up — pull nCONFIG high through 10 kΩ and nSTATUS through 10 kΩ to VCCIO. An undefined state can prevent the FPGA from entering user mode. Also, do not apply I/O voltages before VCCINT ramps up — it can cause latch-up. Configuration via JTAG requires the USB-Blaster or ByteBlaster II cable and the Quartus II Programmer; passive serial mode requires a serial configuration memory (EPCS16, EPCS64, or EPCQ16/64/128). Use MSEL pin settings correctly: 00 = AS, 01 = PS, 10 = FPP, 11 = JTAG.
Stratix III L parts use programmable power technology — use PowerPlay Power Analyzer in Quartus II to estimate junction temperature. Estimated: at full 296-I/O utilization with 50% toggle rate and 1.0 V VCCINT, the EP3SL50 dissipates approximately 6–9 W. With a typical 484-FBGA θJA of 12–15 °C/W (4-layer JEDEC test board), the junction temperature rises ~100 °C above ambient. Provide at least 400 LFM airflow for industrial-temperature operation, or attach a heatsink via thermal interface material if airflow is limited. Do not exceed 100 °C case temperature for industrial-grade operation.
규정 준수 정보
RoHS compliant per the L suffix in MPN. NRND (Not Recommended for New Designs) per Intel's Stratix III product lifecycle notice. Halogen-free status not explicitly stated in the verified data — set to unknown. AEC-Q100 is not_applicable because this is an FPGA, not an automotive-qualified IC.
