EP3SL70F780C2G - Stratix III L FPGA 67.5K LE 780-FCBGA | Intel
부품 번호: EP3SL70F780C2G ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1675 | $16,750.00 |
| 100 | $1485 | $148,500.00 |
| 500 | $1320 | $660,000.00 |
| 1,000 | $1185 | $1,185,000.00 |
EP3SL70F780C2G 개요
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as DSP blocks, block RAM (BRAM), PLLs, and high-speed serializer/deserializer (SerDes) transceivers. Within the broader taxonomy, an FPGA sits inside the programmable logic -> logic IC -> integrated circuit hierarchy, and is used to implement arbitrary digital hardware without the cost and lead time of an ASIC. Stratix III L parts were engineered for high-throughput signal processing and high-speed I/O while reducing power relative to the original Stratix III series.
Key features of the EP3SL70F780C2G include 67,500 logic elements, 2,699,264 embedded memory bits, 488 user I/O, dedicated DSP blocks, programmable power technology with hot-socketing capability, and support for external memory interfaces including DDR3, DDR2, QDR II+, and RLDRAM II. The device operates from a 0.9 V core supply (VCC) with auxiliary supplies for I/O banks and transceivers, and supports commercial (0 C to 85 C) junction temperature grades under the C2 speed grade designation.
Architecturally, the part uses ALM-based logic elements (Adaptive Logic Modules), real-time fractional PLLs for clock management, and hard PCIe Gen1/Gen2 IP blocks. The C2 speed grade places it in the medium-performance bin relative to other Stratix III L devices, balancing timing margin against achievable Fmax. The 780-ball FCBGA package integrates the silicon, decoupling, and high-pin-count escape routing required for the 488 user I/Os plus transceiver and supply balls.
Typical applications include high-speed data acquisition, medical imaging front-ends, wireless baseband processing, software-defined radio, broadcast video processing, and ASIC prototyping where 67.5K logic elements are sufficient. Designers select this part when they need Stratix III's transceiver and DSP capability at lower static power than the standard Stratix III series.
When designing with this part, engineers should use Intel Quartus II design software (version 9.1 SP2 or later Stratix III service packs), follow the Stratix III PowerPlay early power estimator guidance, and observe PCB layout rules for FCBGA packages including via-in-pad and microvia stackups. The C2 speed grade affects timing closure; lower temperature grades (-40 C to 100 C, I-suffix) are recommended for industrial applications.
This page synthesizes distributor pricing, Stratix III L family drop-in alternatives with matching FCBGA-780 footprint, and practical PCB design notes not consolidated in any single manufacturer document.
드롭인 대체품: EP3SL70F780C2G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL70F780C2G (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Process Technology, Operating Temperature, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL70F780C2
✅ 드롭인✓ 재고 있음
$1245.75 / 개
데이터시트 보기 →EP3SL70F780I4N
✅ 드롭인✓ 재고 있음
$875.4 / 개
데이터시트 보기 →EP3SL50F780C2G
✅ 드롭인✓ 재고 있음
$264.9 / 개
데이터시트 보기 →EP3SL50F780C2
✅ 드롭인✓ 재고 있음
$199.95 / 개
데이터시트 보기 →EP3SL70F484C2G
✅ 드롭인✓ 재고 있음
$240 / 개
데이터시트 보기 →EP3SL70F780C2G 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Logic Elements | 67,500 |
| Embedded Memory | 2,699,264 bits |
| User I/O Count | 488 |
| 패키지 | 780-ball FCBGA (FineLine BGA) |
| Speed Grade | C2 (medium) |
| Temperature Grade | Commercial (0 C to 85 C) |
| Process Node | 40 nm low-power CMOS |
| Core Voltage (VCC) | 0.9 V |
| DSP Blocks | Yes (dedicated) |
| Memory Interfaces Supported | DDR3, DDR2, QDR II+, RLDRAM II |
| PCIe Hard IP | Gen1/Gen2 |
| PLLs | Fractional PLLs |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
EP3SL70F780C2G 780-ball fcbga (fineline bga) 핀 구성 가이드
EP3SL70F780C2G(780-ball fcbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL70F780C2G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL70F780C2G 적합 용도: 7 애플리케이션s: High-Speed Data Acquisition Systems, Wireless Baseband Processing, Medical Imaging Front-Ends, Broadcast Video Processing, Software-Defined Radio (SDR), ASIC Prototyping, Industrial Control and Motor Drive.
High-Speed Data Acquisition Systems
The EP3SL70F780C2G's 67,500 logic elements, dedicated DSP blocks, and 488 user I/Os make it well-suited for high-channel-count data acquisition front-ends in test and measurement equipment. Its dedicated DDR3/QDR II+ controllers handle high-throughput ADC buffering, while the 40 nm low-power CMOS process reduces thermal load in dense multi-channel chassis. Designers typically pair it with high-speed ADCs and use the PCIe Gen2 hard IP for host transfer. Compared with smaller Cyclone family parts, the Stratix III L device supports deeper on-chip buffering and more parallel DSP pipelines without external co-processors.
추천
Wireless Baseband Processing
The EP3SL70F780C2G's DSP blocks and high-speed transceiver support make it a fit for wireless baseband processing in LTE and WiMAX reference designs of its era. Its 67.5K logic elements accommodate multi-channel FFT/iFFT blocks, channel estimators, and MAC-layer state machines within a single device. The 780-ball FCBGA package provides the I/O density needed to interface with multiple RF front-ends, while the Stratix III L sub-family's reduced static power helps in chassis designs with constrained airflow.
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Medical Imaging Front-Ends
Medical imaging systems such as ultrasound beamformers and CT reconstruction boards benefit from the EP3SL70F780C2G's parallel DSP capability and abundant block RAM. The 488 user I/Os accommodate multi-channel transducer arrays, while DDR2/DDR3 controllers buffer raw ADC data streams in real time. The C2 speed grade provides deterministic timing closure for beamforming algorithms, and the Stratix III L device's reduced power dissipation supports thermally constrained cart-mounted and portable systems.
추천
Broadcast Video Processing
Broadcast video processing designs for SD/HD/UHD up/down/cross-conversion and frame-rate conversion leverage the EP3SL70F780C2G's parallel DSP and 488 user I/Os. The device supports multiple parallel video processing pipelines, while dedicated memory controllers feed DDR3 SDRAM buffers for frame storage. The C2 commercial speed grade and 0 C to 85 C junction range suit studio and headend equipment, and the FCBGA-780 package integrates cleanly into 12-layer video switcher boards.
추천
Software-Defined Radio (SDR)
Software-defined radio platforms use the EP3SL70F780C2G to implement digital down/up-conversion (DDC/DUC), channelization, and protocol stack processing in a single device. The 67.5K logic elements plus DSP blocks fit mid-tier waveforms such as wideband tactical radios, while the transceiver support and PCIe Gen2 IP provide flexible host connectivity. Compared with DSP-only processor solutions, the FPGA implementation delivers lower latency and deterministic timing for real-time SDR workloads.
추천
ASIC Prototyping
The EP3SL70F780C2G serves as a mid-density target for ASIC prototyping where 67.5K logic elements, dedicated DSP blocks, and 488 user I/Os fit designs mapping from gate-level ASIC netlists. Quartus II Design Assistant for ASIC prototyping supports gate-level mapping and clock-domain conversion. The 780-ball FCBGA package exposes sufficient I/O to emulate real-world ASIC pin behavior, and the C2 commercial speed grade offers adequate timing margin for verification at near-target clock rates.
추천
Industrial Control and Motor Drive
Industrial motion controllers benefit from the EP3SL70F780C2G's combination of 67.5K logic elements, dedicated DSP blocks for current/voltage loop computation, and 488 user I/Os to interface with multi-axis servo drives. The DDR3 controllers support high-bandwidth feedback loops, while the 40 nm low-power CMOS process keeps chassis thermals manageable in 24/7 factory automation. The Stratix III L sub-family suits designs that must operate continuously without active heatsinking.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL70F780C2G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL70F780C2 | EP3SL70F780I4N | EP3SL50F780C2G | EP3SL50F780C2 | EP3SL70F484C2G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FCBGA | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same | 484-ball FCBGA - different |
| Logic Elements | 67,500 | 67,500 | 67,500 | 50,000 | 50,000 | 67,500 |
| Speed Grade | C2 (commercial medium) | C2 (same) | I4 (industrial medium) | C2 (same) | C2 (same) | C2 (same) |
| Temperature Grade | Commercial 0 C to 85 C | Commercial 0 C to 85 C | Industrial -40 C to 100 C | Commercial 0 C to 85 C | Commercial 0 C to 85 C | Commercial 0 C to 85 C |
| User I/O Count | 488 | 488 | 488 | 488 | 488 | 296 |
| Embedded Memory (bits) | 2,699,264 | 2,699,264 | 2,699,264 | 2,106,624 | 2,106,624 | 2,699,264 |
| RoHS / Pb-Free | Yes (G suffix) | No G suffix - verify | Yes | Yes (G suffix) | No G suffix - verify | Yes (G suffix) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Higher logic density than EP3SL50F780C2G at same FCBGA-780 footprint (vs EP3SL50F780C2G)
- Commercial C2 speed grade vs industrial I4 grade (vs EP3SL70F780I4N)
- Pb-free RoHS-compliant terminal finish (G suffix) (vs EP3SL70F780C2)
설계 노트
The 780-ball FCBGA package uses a fine-pitch BGA (typically 1.0 mm pitch for Stratix III L). PCB layout requires microvia stack-up construction, via-in-pad plating for the BGA escape, and high-density interconnect (HDI) layers. Reference Intel's Stratix III Board Design Guidelines for via diameters, antipad dimensions, and breakout routing rules. Skipping microvia stack-up will force dog-bone fan-out routing that breaks escape routing under the BGA and risks signal-integrity failures on high-speed memory interfaces.
Estimated: At full utilization of 67.5K logic elements plus active DSP blocks at a typical 200 MHz operation, the device may dissipate 3 to 5 W of power. The FCBGA package relies on PCB copper pour and bottom-side thermal vias for heat removal, not an integrated heatsink. Designers should provide at least 4 thermal via arrays under the center thermal pad and follow Intel's PowerPlay Early Power Estimator guidance to validate junction temperature remains under 85 C with the commercial temperature grade.
Stratix III family has independent VCC (core, 0.9 V), VCCAUX (auxiliary), VCCPD (I/O pre-driver), and per-bank VCCIO supplies. Power sequencing requirements differ between Stratix III and Stratix III L and across hot-socketing-capable variants - consult the Stratix III handbook before modifying a reference design. Misordering VCC ramp-up can cause latch-up during power-up. The C2 speed grade may not match timing closure expectations when migrating an I4 design without re-running TimeQuest timing analysis.
For DDR3 interfaces, follow Intel's external memory interface pin-out guidelines to ensure DQS/DQ byte lane matching, and use the Stratix III memory controller IP with calibrated termination. Series resistors or on-chip termination (OCT) settings should match the topology selected in Quartus II. Skipping OCT calibration causes setup/hold failures that are intermittent and difficult to debug. PCIe Gen2 interfaces require 100 ohm differential routing with 5 mil trace width on top of the reference stack-up.
규정 준수 정보
RoHS compliance inferred from G suffix per distributor listings; halogen-free status not stated in available data and set to unknown. AEC-Q100 not applicable for industrial/commercial FPGAs. Conflict minerals compliance per Intel corporate policy.