EPM240GF100I5N - 240-LE MAX II CPLD, 100-FBGA, Industrial | Intel
부품 번호: EPM240GF100I5N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $11.33 | $11.33 |
| 10 | $10.55 | $105.50 |
| 100 | $9.42 | $942.00 |
| 500 | $8.65 | $4,325.00 |
| 1,000 | $7.9 | $7,900.00 |
EPM240GF100I5N 개요
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between discrete logic gates and FPGAs in the programmable logic hierarchy. Compared with discrete 74-series logic, a CPLD integrates tens to hundreds of gates into a single chip with deterministic timing. Compared with FPGAs, a CPLD offers instant-on non-volatile configuration, lower static power, and deterministic propagation delay - making it ideal for glue logic, bus interface bridging, and power-up sequencing. The MAX II family specifically replaced legacy MAX 7000 with lower power and higher density.
Key features include in-system programmability via JTAG, built-in IEEE 1149.1 boundary-scan support, MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interface levels, and on-chip flash configuration memory that eliminates the external boot PROM required by older MAX devices. The 80 user I/Os are organized across the BGA footprint, and the device supports vertical migration within the MAX II family across packages such as the 100-pin and 256-pin FineLine BGA.
Architecture-wise, the EPM240 uses logic array blocks (LABs) interconnected by a continuous fast-path interconnect, with each macrocell containing a programmable AND/OR array, a flip-flop, and a product-term sharing architecture. The on-die voltage regulator derives the core 1.8 V from the external VCCIO supply, simplifying board design to a single rail.
Typical applications include I/O expansion and bus bridging in industrial controllers, power-sequencing glue logic in networking line cards, address decoding in microprocessor systems, and load-sharing control in power management boards. Designers also deploy the EPM240 for LED driving logic, motor-control peripheral interfacing, and legacy peripheral replacement. Designers should verify Quartus II software support for the specific MAX II device variant before committing the part to production, since Intel has migrated new designs toward MAX V and MAX 10 families.
When designing with this part, allocate at least one JTAG chain and confirm the BSDL file is available for boundary-scan testing. Decoupling should follow the Quartus II device pin connection guidelines: a 0.1 uF capacitor adjacent to every VCCIO bank plus bulk capacitance on the main supply rail.
드롭인 대체품: EPM240GF100I5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPM240GF100I5N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Programming Interface, Operating Temperature, Configuration Memory, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPM240GF100C5N
✅ 드롭인✓ 재고 있음
$8.92 / 개
데이터시트 보기 →EPM240F100I5N
✅ 드롭인✓ 재고 있음
$5.2 / 개
데이터시트 보기 →EPM240F100C5N
✅ 드롭인✓ 재고 있음
$5.2 / 개
데이터시트 보기 →EPM570GF100I5N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$10.35 / 개
데이터시트 보기 →LC4256ZE-7TN100C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPM240GF100I5N 최대 정격 & 전기적 특성
| Series | MAX II |
| Logic Elements / Blocks | 240 LE |
| Number of Macrocells | 192 |
| Maximum User I/O | 80 |
| Propagation Delay (tpd, max) | 4.7 ns |
| Programmable Type | In-System Programmable (ISP) |
| Non-Volatile Memory | On-chip flash configuration |
| Internal Supply Voltage | 1.71 V to 1.89 V (regulated on-chip) |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| 패키지 | 100-ball FBGA (FineLine BGA), 11 mm x 11 mm, 1.0 mm pitch |
| Operating Temperature (TJ) | -40 C to +100 C |
| 실장 유형 | Surface Mount |
| JTAG Support | IEEE 1149.1 / IEEE 1532 compliant |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) |
| Logic Family | CMOS |
| Vertical Migration Family | EPM240 / EPM570 / EPM1270 / EPM2210 in same-package footprint |
EPM240GF100I5N 100-ball fbga (fineline bga), 11 mm x 11 mm, 1.0 mm pitch 핀 구성 가이드
EPM240GF100I5N(100-ball fbga (fineline bga), 11 mm x 11 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPM240GF100I5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPM240GF100I5N 적합 용도: 6 애플리케이션s: Industrial Control I/O Expansion and Bus Bridging, Power-Sequencing and Reset Management in Networking Line Cards, Microprocessor Address Decoding and Chip-Select Logic, Automotive Body Electronics and LED Driver Control, Portable and Battery-Powered Consumer Device Glue Logic, Test & Measurement Equipment Front-End Logic.
Industrial Control I/O Expansion and Bus Bridging
The EPM240GF100I5N is a strong fit for industrial control I/O expansion because it offers 80 user I/Os and 4.7 ns propagation delay, deterministic glue-logic timing that MCUs and FPGAs cannot match at this BOM cost. The MultiVolt I/O banks support 1.5/1.8/2.5/3.3 V interface levels, enabling the CPLD to bridge between a 1.8 V ARM Cortex MCU and a 3.3 V peripheral bus without external level shifters. Industrial temperature rating (-40 C to +100 C junction) is essential for factory-floor controllers, motor drives, and PLCs. On-chip flash configuration eliminates external boot PROMs, reducing PCB area. The 100-FBGA package is well-suited to densely-routed multi-rail designs, and Quartus II fitter reports deliver deterministic propagation delay for safety-critical timing.
추천
Power-Sequencing and Reset Management in Networking Line Cards
The EPM240GF100I5N is widely deployed for power-sequencing logic on networking line cards and routers where deterministic reset behavior is mandatory. Each macrocell provides a programmable flip-flop and product-term sum, allowing the designer to implement watchdog, voltage-rail sequencing, and I2C address-decoding glue in a single 100-FBGA device. The 4.7 ns tpd ensures reset and gate-drive signals propagate well within sub-microsecond supervisory windows. MultiVolt I/O lets the CPLD interface to 1.8 V switch ASICs and 3.3 V hot-swap controllers without external translators. Industrial temperature grade supports the ATCA and NEBS-compliant chassis ambient of 55-70 C. Quartus II software supports BSDL generation for IEEE 1149.1 boundary-scan coverage during line-card manufacturing test.
추천
Microprocessor Address Decoding and Chip-Select Logic
The EPM240GF100I5N fits address-decoding and chip-select generation in legacy microprocessor systems, replacing discrete 74FCT or 74LS glue with a single programmable device. 192 macrocells provide enough product terms to decode 24-32 address lines plus read/write strobes into 4-8 chip-select outputs. The 4.7 ns propagation delay keeps chip-select-to-access latency well within typical 70-100 ns memory bus budgets. Non-volatile configuration means the decode map is permanent at power-on with no boot loader delay. Industrial temperature and 100-FBGA package make it suitable for embedded single-board computers, point-of-sale terminals, and industrial printers. Quartus II supports graphical state-machine and truth-table entry that compiles directly to product-term logic.
추천
Automotive Body Electronics and LED Driver Control
The EPM240GF100I5N is a fit for automotive body-electronics modules where deterministic timing and high I/O count outweigh the need for processor-class compute. With 80 user I/Os, the CPLD can drive multi-channel LED arrays, scan key matrices, and sequence relays in body-control modules, mirror controllers, and headlamp leveling systems. The MultiVolt I/O banks support 3.3 V and 5 V interface levels common in 12 V automotive buses. Industrial temperature rating (-40 C to +100 C) covers most cabin and under-hood ambient zones; for 125 C under-hood designs, designers should evaluate AEC-Q100 qualified automotive variants. The 100-FBGA footprint supports miniaturized ECUs where the CPLD replaces 4-6 discrete logic packages.
추천
Portable and Battery-Powered Consumer Device Glue Logic
The EPM240GF100I5N is selected for portable consumer devices where low static power and instant-on configuration outweigh FPGAs. The on-chip voltage regulator draws microamp-level quiescent current from the VCCIO rail, which lets a coin-cell or Li-ion source keep the device configured even in deep-sleep states. The 4.7 ns tpd enables fast wake-up to I2C/SPI peripheral enable, key-scan debouncing, and battery-management auxiliary logic. The MultiVolt I/O banks interface directly to 1.8 V application processors and 3.3 V sensors without external translators. The 100-FBGA 11 mm x 11 mm footprint is small enough for wearable and handheld enclosures. On-chip flash configuration means no external boot device, lowering total BOM and standby drain.
추천
Test & Measurement Equipment Front-End Logic
The EPM240GF100I5N fits the front-end logic of test and measurement equipment such as bench multimeters, oscilloscope front panels, and signal-generator mode switches. With 80 user I/Os and 4.7 ns propagation delay, the CPLD can scan rotary encoders, debounce key matrices, drive seven-segment or OLED displays, and route analog MUX select lines from a single device. Non-volatile configuration ensures the instrument boots to the correct mode within microseconds, with no user-visible FPGA configuration latency. MultiVolt I/O connects directly to 1.8 V DSP or MCU and 3.3 V display drivers. Industrial temperature rating supports lab and light-industrial ambient. Quartus II BSDL output accelerates IEEE 1149.1 boundary-scan coverage during in-circuit test.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPM240GF100I5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPM240GF100C5N | EPM240F100I5N | EPM240F100C5N | EPM570GF100I5N | LC4256ZE-7TN100C |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Lattice Semiconductor |
| Package | 100-FBGA (11x11 mm, 1.0 mm pitch) | 100-FBGA (same footprint) | 100-FBGA (same footprint) | 100-FBGA (same footprint) | 100-FBGA (same vertical-migration footprint) | 100-TQFP (different package style, same pin count) |
| Logic Elements / Blocks | 240 LE | 240 LE | 240 LE | 240 LE | 570 LE | 256 macrocells |
| Number of Macrocells | 192 | 192 | 192 | 192 | 440 | 256 |
| Maximum User I/O | 80 | 80 | 80 | 80 | 76-80 (100-FBGA migration) | 64-80 (TQFP-100) |
| Propagation Delay (tpd max) | 4.7 ns | 4.7 ns | 4.7 ns | 5.4 ns (C5 speed grade) | 5.4 ns | 7.5 ns |
| Operating Temperature | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | 0 C to +90 C (commercial) |
| Lead-Free / RoHS | Yes (G suffix) | Yes | No (legacy lead) | No (legacy lead) | Yes | Yes |
| Internal Core Voltage | 1.71 V to 1.89 V (regulated on-chip) | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.8 V nominal |
주요 차별점
- Industrial temperature grade in a lead-free 100-FBGA (vs EPM240GF100C5N)
- G-suffix lead-free compliance (vs EPM240F100I5N)
- On-chip non-volatile flash configuration (vs LC4256ZE-7TN100C)
- Higher logic density in same package (vs EPM240F100C5N)
설계 노트
The EPM240GF100I5N integrates an on-die voltage regulator that derives the 1.8 V core from the VCCIO rail, so designers only need to supply one external rail. Per Quartus II pin connection guidelines, place a 0.1 uF decoupling capacitor adjacent to every VCCIO ball and a 10 uF bulk capacitor on the main VCCIO rail. Estimate: at room temperature with all 80 I/Os toggling at 100 MHz, peak supply current stays below 50 mA, well within the on-chip regulator's 100 mA continuous rating.
The 100-FBGA package at 1.0 mm pitch requires 4-layer PCB with microvia stackups for fan-out; do not attempt 6-mil traces on outer layers - escape routing will fail. Use the MAX II device pin connection guidelines file from Intel to verify unused-pin termination; unconfigured I/O pins default to tri-stated input, which can float and cause shoot-through if left driving a bus. Tie unused JTAG TCK/TMS pins through 10 kohm pull-ups to avoid spurious boundary-scan entry during power-up.
MultiVolt I/O supports 1.5 V, 1.8 V, 2.5 V, and 3.3 V interface levels, but each VCCIO bank must be tied to a single voltage - mixing 1.8 V and 3.3 V within the same bank is not allowed. Plan bank assignments during schematic capture before PCB layout to avoid re-spinning the BGA escape. For high-speed LVDS or DDR interfaces, add 33 ohm series-termination resistors close to the CPLD output to dampen reflections on the 100-FBGA escape traces.
Do not attempt to migrate a MAX II design to MAX V without recompile and PCB review - the MAX V family is not pin-compatible. When migrating from EPM240 to EPM570 in the same 100-FBGA, the Quartus II fitter must re-assign pin locations if the EPM240 I/O map used bank-3 pins that the EPM570 repurposes for JTAG or configuration. Estimate: vertical migration typically requires 1-2 days of fitter iteration before bitstream and pinout converge.
규정 준수 정보
G-suffix denotes lead-free / RoHS compliant finish. Not AEC-Q100 qualified - the standard I5N part is industrial-grade, not automotive-grade; review dedicated AEC-Q100 variants for under-hood 125 C operation. Halogen-free status not stated in the verified datasheet - marked unknown.