EPM570GF256C4N - 570 LEs CPLD, 4ns, 212 I/O, FBGA-256 | Intel / Altera
부품 번호: EPM570GF256C4N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.75 | $14.75 |
| 10 | $13.28 | $132.80 |
| 100 | $11.82 | $1,182.00 |
| 500 | $10.5 | $5,250.00 |
| 1,000 | $9.45 | $9,450.00 |
EPM570GF256C4N 개요
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the deterministic timing of PAL/GAL architecture with the integration density of an FPGA. It sits in the programmable logic taxonomy between simple SPLDs (PAL/GAL) and high-density FPGAs, offering instant-on Flash memory and a MultiVolt core/I-O architecture. CPLDs are typically used for I/O expansion, bus bridging, power-up sequencing, and address decoding where deterministic timing and instant-on behavior are required. The MAX II G family extends the original MAX II lineup with higher logic density (up to 2210 LEs) while retaining the same 1.8 V core architecture.
Key features include 8 Kbits of user Flash memory (UFM) block for in-system data storage, MultiVolt I/O support for interfacing between 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic levels, in-system programmability via JTAG (IEEE Std. 1149.1), and a wide operating temperature range of -40 °C to +125 °C. The device operates from a single 1.8 V core supply with I/O banks independently powered.
Architecturally, the EPM570G uses a Logic Array Block (LAB) structure with 570 LEs organized into an interconnect network driven by a non-volatile Flash configuration memory. This eliminates the external boot PROM required by SRAM-based FPGAs and yields true instant-on behavior. The C4 speed grade provides 4 ns tPD (propagation delay) and a 304 MHz internal fMAX, enabling high-speed interface bridging between processors and peripherals.
Typical applications include I/O expansion and bus bridging in industrial controllers, glue logic in networking line cards, power-up sequence controllers, address decoding in MCU/SoC systems, and protocol bridging between legacy 5 V and modern 1.8 V logic domains. The instant-on Flash makes it suitable for boot-time FPGA configuration management.
When designing with this device, ensure that all I/O bank supplies are present before driving signals; the MultiVolt architecture requires each bank VCCIO to match the driven logic level. Use the Quartus II (or Intel Quartus Prime) design software with the MAX II device family library for synthesis and fitting.
This page synthesizes distributor pricing, drop-in MAX II G same-package alternatives, and practical design notes that the manufacturer datasheet does not aggregate in one place.
드롭인 대체품: EPM570GF256C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPM570GF256C4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, RoHS Status, Operating Temperature, Configuration Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPM570GF256C4
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$29.85 / 개
데이터시트 보기 →EPM570GF256C3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$9.4 / 개
데이터시트 보기 →EPM570GF256C3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$10.4 / 개
데이터시트 보기 →EPM1270GF256C4N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPM2210GF256C4N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPM570F256C4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$26.85 / 개
데이터시트 보기 →EPM570GF256C4N 최대 정격 & 전기적 특성
| Family | MAX II G |
| Device Series | EPM570G |
| Logic Elements (LEs) | 570 |
| Macrocells | 440 |
| User I/Os | 212 |
| User Flash Memory (UFM) | 8 Kbits |
| Speed Grade | C4 (tPD = 4 ns) |
| Pin-to-Pin Delay (tPD) | 4 ns |
| Internal fMAX | 304 MHz |
| 패키지 | 256-ball FineLine BGA (FBGA-256) |
| Ball Pitch | 1.0 mm |
| Package Dimensions | 17 x 17 mm |
| Core Voltage | 1.8 V |
| I/O Bank Voltages (MultiVolt) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| 동작 온도 | -40 °C to +125 °C (industrial) |
| Configuration Memory | Flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable |
| Lead-Free / RoHS | Lead-free, FBGA package |
| 실장 유형 | Surface Mount (BGA) |
EPM570GF256C4N 17 x 17 mm 핀 구성 가이드
EPM570GF256C4N(17 x 17 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPM570GF256C4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPM570GF256C4N 적합 용도: 7 애플리케이션s: Industrial I/O Expansion & Bus Bridging, Networking Line-Card Glue Logic, Power-Up Sequencer for Multi-Rail SoC Systems, Address Decoding & Memory Interfacing, Protocol Bridge (Legacy 5V to Modern 1.8V), FPGA Configuration Manager (Watchdog / Multi-Boot), Automotive ECU Glue Logic.
Industrial I/O Expansion & Bus Bridging
The EPM570GF256C4N is well-suited for industrial I/O expansion and bus bridging in PLC and motor-controller boards where its 212 user I/Os (in FBGA-256) allow direct fan-out from a host MCU to dozens of 24 V digital inputs, encoder channels, and opto-isolated outputs. The 4 ns tPD C4 speed grade delivers deterministic glue-logic timing for SPI-to-parallel address decoding between an ARM Cortex-M host and legacy peripherals. Industrial temp grade (-40 to +125 C) plus MultiVolt I/O banks (1.5 V to 3.3 V) let one CPLD bridge between a 1.8 V SoC and 3.3 V or 5 V-tolerant industrial buses without external level shifters. The non-volatile Flash configuration guarantees deterministic instant-on behavior required for safety-critical machine start-up sequences.
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Networking Line-Card Glue Logic
In networking line cards, the EPM570GF256C4N serves as power-up sequencer and bus arbiter between the switch ASIC, PHY transceivers, and management CPU. Its 4 ns C4 tPD provides deterministic arbitration between multiple Gigabit Ethernet MACs sharing a common SPI or I2C management bus. The 8 Kbit UFM block stores board-ID straps, MAC address backup, and manufacturing data accessible via the JTAG or self-instantiated SPI interface. The instant-on Flash configuration is critical for hot-swap line-card insertion scenarios where the switch fabric must see valid control logic before the management CPU has booted from its larger boot Flash.
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Power-Up Sequencer for Multi-Rail SoC Systems
The EPM570GF256C4N is ideal as a multi-rail power-up sequencer in SoC systems that require strict rail-ordering before the processor can boot. Its non-volatile Flash ensures the sequencing state machine is active within microseconds of 1.8 V core supply presence, even before the main SoC has loaded its firmware. The 212 user I/Os allow direct PG (power-good) feedback from each regulator's TPS or load switch, with dedicated outputs driving each enable pin. Designers can implement complex sequencing rules (time delays, voltage-monitor thresholds, fault latching) that would otherwise require a costly supervisor IC plus discrete logic.
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Address Decoding & Memory Interfacing
In MCU/SoC systems with multiple memory banks (Flash, SRAM, FRAM, peripherals), the EPM570GF256C4N replaces discrete 74-series glue logic with a single chip that decodes the full address range in 4 ns. The MultiVolt I/O banks allow direct connection between a 1.8 V MCU address bus and 3.3 V memories, eliminating external level shifters. The 8 Kbit UFM can store boot-configuration tables, calibration data, or revision identifiers accessed by firmware at startup. Industrial temp grade makes it suitable for automotive under-hood and industrial cabinet deployments.
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Protocol Bridge (Legacy 5V to Modern 1.8V)
The EPM570GF256C4N serves as a protocol bridge between legacy 5 V peripherals (parallel-port ASICs, 5 V sensors, 5 V MCUs) and modern 1.8 V SoCs. With separate VCCIO banks powered at 3.3 V (legacy side) and 1.8 V (modern side), the CPLD performs bidirectional voltage translation plus protocol conversion (parallel-to-SPI, UART-to-SPI, etc.) in a single device. The 212 user I/Os comfortably accommodate 8-bit to 32-bit bus widths. Industrial temp grade supports factory-floor equipment upgrades without replacing the entire control board.
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FPGA Configuration Manager (Watchdog / Multi-Boot)
The EPM570GF256C4N is commonly used as an FPGA configuration watchdog or multi-boot manager, monitoring the FPGA's CONFIG_DONE / nSTATUS pins and toggling nCONFIG to recover from a corrupted bitstream. The CPLD can hold two fallback bitstreams in its 8 Kbit UFM (up to 4 Mbit raw bitstream compressed) and present them via a custom SPI-like interface to the FPGA. With 4 ns tPD, the watchdog reacts within nanoseconds of a failed boot, far faster than any MCU-based supervisor. This is a standard pattern in aerospace, defense, and industrial FPGA designs where deterministic configuration recovery is required.
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Automotive ECU Glue Logic
In automotive ECUs (engine control, transmission control, ADAS sensor fusion), the EPM570GF256C4N provides deterministic glue logic between MCUs, sensor ASICs, and actuator drivers. Its industrial temp grade (-40 to +125 C) handles under-hood thermal stress, and the MultiVolt I/O banks interface with both 3.3 V sensor ICs and 5 V actuator drivers. The 4 ns tPD enables real-time encoder pulse processing and motor commutation logic at high RPM. The non-volatile Flash configuration eliminates boot time, critical for systems that must respond within milliseconds of ignition-on.
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추천 제품 요약
엔지니어링 참조 데이터: EPM570GF256C4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPM570GF256C4 | EPM570GF256C3N | EPM570GF256C3 | EPM1270GF256C4N | EPM2210GF256C4N | EPM570F256C4N |
|---|---|---|---|---|---|---|---|
| Package | FBGA-256 (17x17 mm, 1.0 mm pitch) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Family | MAX II G | MAX II G | MAX II G | MAX II G | MAX II G | MAX II G | MAX II (non-G) |
| Logic Elements | 570 | 570 | 570 | 570 | 1270 | 2210 | 570 |
| User I/Os | 212 | 212 | 212 | 212 | 212 | 212 | 212 |
| Speed Grade (tPD) | C4 (4 ns) | C4 (4 ns) | C3 (3 ns) | C3 (3 ns) | C4 (4 ns) | C4 (4 ns) | C4 (4 ns) |
| Operating Temperature | -40 to +125 C (industrial) | 0 to +85 C (commercial) | -40 to +125 C (industrial) | 0 to +85 C (commercial) | -40 to +125 C (industrial) | -40 to +125 C (industrial) | -40 to +125 C (industrial) |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | None (non-G) |
주요 차별점
- 570 LEs vs EPM1270G / EPM2210G in identical FBGA-256 footprint (vs EPM2210GF256C4N)
- MAX II G family with UFM block vs non-G MAX II (EPM570F) (vs EPM570F256C4N)
- C4 speed grade (4 ns tPD) for latency-critical glue logic (vs EPM570GF256C5N)
설계 노트
Estimated: The EPM570GF256C4N requires a clean 1.8 V core supply (VCCINT) and four independent VCCIO bank supplies (typically 3.3 V, 2.5 V, 1.8 V, 1.5 V depending on interface needs). A bulk 100 uF tantalum plus 10 uF ceramic per VCC rail, with 0.1 uF and 0.01 uF ceramic bypass capacitors placed within 5 mm of each BGA supply ball, is recommended. Power sequencing of VCCINT before VCCIO prevents I/O latch-up; the MAX II Device Handbook recommends VCCINT reaching 90% of nominal before any VCCIO bank exceeds 0.5 V.
The FBGA-256 package with 1.0 mm ball pitch requires a 4-layer PCB minimum with a continuous ground plane on layer 2 directly beneath the BGA for return-path integrity. Microvia technology (laser-drilled 0.1 mm vias in pad) is recommended for breakout routing; dog-bone fan-out is acceptable but consumes more board area. Total BGA land pattern area is 17 x 17 mm, leaving room for eight signal layers in a typical 4-layer stack-up. Maintain 50 ohm controlled impedance on all high-speed clock and JTAG signals.
The EPM570GF256C4N C4 grade provides 4 ns pin-to-pin delay, but actual propagation on the PCB depends heavily on signal integrity. Series-terminate clock outputs (CLK0-CLK3) with 33 ohm resistors if trace length exceeds 50 mm or if the load is more than four inputs. Avoid routing clock signals parallel to JTAG or high-speed I/O for more than 25 mm to prevent crosstalk. The MAX II I/O buffers support programmable drive strength (default 12 mA); use 4 mA or 8 mA settings on bussed signals to reduce SSO noise.
Three pitfalls are common when migrating from non-G MAX II (EPM570F) to MAX II G (EPM570G): (1) the G family adds a User Flash Memory (UFM) block accessible via dedicated interface pins - if unused, leave the UFM interface pins in their default Quartus-assigned state; (2) the JTAG TDO pin drive strength may differ - verify with Quartus pin-report before PCB layout; (3) the C4 speed grade in MAX II G is 4 ns tPD, while MAX II non-G C4 is also 4 ns - same speed grade, same package, but verify I/O standard support for MultiVolt banks matches your design before substitution.
Dedicate the top PCB layer beneath the FBGA-256 to a solid ground pour stitched with 0.5 mm-pitch ground vias around the entire BGA perimeter. This serves both as thermal dissipation (CPLD can dissipate up to 0.5 W under full I/O toggle at industrial temp) and as a low-impedance return path. Avoid routing signals through the BGA field; use inner layers for breakout. Reserve layer 4 for additional ground stitching or slow control signals (I2C, JTAG).
규정 준수 정보
FBGA-256 package is lead-free per FindIC datasheet excerpt; RoHS status confirmed by distributor listings. Not AEC-Q100 qualified - the MAX II family does not target automotive-grade certification. Use MAX V or Cyclone families for AEC-Q100 CPLD/FPGA applications.
