EPM570GF256C5 - 570 LE MAX II CPLD, 256-FBGA | Intel
부품 번호: EPM570GF256C5 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.95 | $289.50 |
| 100 | $24.85 | $2,485.00 |
| 500 | $21.5 | $10,750.00 |
| 1,000 | $18.95 | $18,950.00 |
EPM570GF256C5 개요
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device positioned between simple SPLDs and larger FPGAs in the programmable logic hierarchy. Unlike SRAM-based FPGAs, CPLDs use flash or EEPROM configuration cells that retain the bitstream across power cycles, providing instant-on behavior in single-digit milliseconds. CPLDs typically offer predictable timing, deterministic I/O response, and high-drive outputs ideal for board-level glue logic, address decoding, and bus bridging.
The EPM570GF256C5 features a MultiVolt core with on-chip voltage regulator supporting 3.3V, 2.5V, or 1.8V external VCCIO supply per I/O bank, plus a 1.8V internal core. Its MultiTrack interconnect and UFM (User Flash Memory) block provide flexible state-machine implementation and on-chip parameter storage. The device includes JTAG (IEEE 1149.1) and ISP (In-System Programming) support via the standard Altera/Intel Quartus II toolchain.
Architecturally, the MAX II family uses a look-up table (LUT)-based logic element array combined with non-volatile flash configuration, eliminating the external boot PROM required by legacy SRAM FPGAs. The internal 1.8V LDO regulator allows single 3.3V or 2.5V board rails, simplifying power tree design in cost-sensitive industrial and consumer systems.
Typical applications include I/O expansion and level translation between 3.3V MCUs and 1.8V peripherals, power-up sequencing for multi-rail systems, address decoding in legacy microcontroller designs, glue logic between processors and peripherals, and state-machine controllers in industrial automation. The 256-FBGA package supports designs with high I/O density on a compact board footprint.
When designing, ensure thermal vias are placed under the BGA thermal pad to dissipate the ~0.5W typical power budget. Programming requires Quartus II software and a JTAG download cable such as the Altera USB-Blaster or compatible programmer. Pin migration within the 256-pin FineLine BGA package allows upgrade to EPM1270 or EPM2210 density points without board redesign.
드롭인 대체품: EPM570GF256C5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPM570GF256C5 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, RoHS Status, Programming Interface, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPM570GF256C4N
✅ 드롭인✓ 재고 있음
$9.45 / 개
데이터시트 보기 →EPM570GF256C4
✅ 드롭인✓ 재고 있음
$29.85 / 개
데이터시트 보기 →EPM570GF256C3N
✅ 드롭인✓ 재고 있음
$9.4 / 개
데이터시트 보기 →EPM570GF256C3
✅ 드롭인✓ 재고 있음
$10.4 / 개
데이터시트 보기 →EPM570GF256-5N
✅ 드롭인✓ 재고 있음
$31.2 / 개
데이터시트 보기 →EPM1270GF256C5
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPM570GF256C5 최대 정격 & 전기적 특성
| Family | MAX II |
| Logic Elements (LE) | 570 |
| Macrocells | 440 |
| Maximum User I/Os | 76 |
| User Flash Memory (UFM) | 8 Kbits |
| Pin-to-Pin Logic Delay | 5.4 ns (tPD1, -5 speed grade) |
| Maximum Operating Frequency | 201.1 MHz (fCNT, internal) |
| Supply Voltage - Core | 1.8 V (internal LDO) |
| Supply Voltage - I/O (VCCIO) | 3.3 V / 2.5 V / 1.8 V (MultiVolt) |
| 동작 온도 | -40 C to +125 C |
| 패키지 | 256-ball FineLine BGA, 11 x 11 mm, 1.0 mm pitch |
| Process Technology | 0.18 micron flash CMOS |
| Configuration | Non-volatile flash, instant-on (ISP) |
| Program Memory Type | Flash (internal) |
| JTAG Support | Yes (IEEE 1149.1) |
| RoHS 상태 | Compliant (lead-free FBGA) |
| Logic Family | CMOS |
EPM570GF256C5 256-ball fineline bga, 11 x 11 mm, 1.0 mm pitch 핀 구성 가이드
EPM570GF256C5(256-ball fineline bga, 11 x 11 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPM570GF256C5.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPM570GF256C5 적합 용도: 6 애플리케이션s: Board-Level Glue Logic and Address Decoding, I/O Expansion and Voltage Level Translation, Industrial Automation and Motor Control Sequencing, Power-Up and Power-Down Sequencing, Legacy Bus Interfacing and Protocol Bridging, Display and Imaging Interface Aggregation.
Board-Level Glue Logic and Address Decoding
The EPM570GF256C5 is well-suited for board-level glue logic in systems that combine microcontrollers, memory, and peripherals. Its 5.4 ns pin-to-pin delay and 76 user I/Os provide deterministic decoding and chip-select generation that CPLDs handle more predictably than discrete 74-series logic. Engineers place the device between a host MCU and SRAM, Flash, or peripherals to decode address ranges into individual CE lines. The 256-FBGA package concentrates the logic on a compact footprint, while instant-on non-volatile configuration eliminates boot delay versus SRAM-based FPGAs in industrial controller boards. The on-chip 8 Kbit User Flash Memory block can store board ID, calibration constants, or revision tags readable by the host MCU over JTAG or via a user-defined register interface.
추천
I/O Expansion and Voltage Level Translation
The EPM570GF256C5's MultiVolt I/O architecture makes it ideal for voltage translation between 3.3V MCUs and 1.8V or 2.5V peripherals. Each I/O bank can be independently powered at 3.3V, 2.5V, or 1.8V, eliminating external level-shifters when bridging logic domains on mixed-voltage boards. With 76 user I/Os, a single device can replace multiple discrete translator chips in industrial gateways or display controllers. The 5.4 ns propagation delay preserves timing margins in SPI, I2C, UART, or GPIO expansion paths, and the -40 to +125 C operating range supports factory-floor deployments where reliability across temperature excursions is mandatory.
추천
Industrial Automation and Motor Control Sequencing
In industrial PLCs and motor-control boards, the EPM570GF256C5 functions as a deterministic state-machine controller that runs independently of any host processor. Its instant-on flash configuration guarantees known I/O states at power-up, critical for safety interlocks and motor-driver enable sequencing. The 76 I/Os support multiple encoder inputs, PWM gating, and fault-flag aggregation in a single chip, replacing discrete logic arrays. The industrial -40 to +125 C temperature grade and lead-free 256-FBGA package with thermal vias handle the elevated ambient temperatures inside sealed control cabinets. The on-chip UFM block can store motor calibration tables or firmware revision data readable by the supervisory MCU for diagnostics.
추천
Power-Up and Power-Down Sequencing
The EPM570GF256C5 is widely deployed as a multi-rail power sequencer in telecom and server infrastructure. Its non-volatile flash-based configuration powers up with deterministic output states within about 1 ms, enabling precise timing of enable signals to downstream DC-DC converters, LDOs, and ASICs. The 440 macrocells support complex state machines with multiple timing branches, while the 76 I/Os can gate more than a dozen rails simultaneously. Unlike a microcontroller-based sequencer, the CPLD runs without firmware, so a watchdog MCU failure does not prevent safe rail bring-up. The MAX II family's 1.8V internal LDO also reduces external supply complexity on 3.3V-only boards.
추천
Legacy Bus Interfacing and Protocol Bridging
The EPM570GF256C5 excels at bridging legacy parallel buses (ISA, SRAM, FIFO) to modern processors without requiring an FPGA. The 5.4 ns propagation delay maintains cycle timing for 50 MHz-class interfaces, while 440 macrocells accommodate state machines for handshaking and byte-swapping logic. The MultiVolt I/O allows direct connection to 5V-tolerant or 1.8V cores when configured with the appropriate bank voltage. Designers use the UFM block to store protocol constants or vendor IDs that the host reads at boot. The 256-FBGA footprint suits ATCA, VME, or CompactPCI adapter cards where board real estate is constrained.
추천
Display and Imaging Interface Aggregation
In LCD panel controllers, camera sensor aggregators, and projector light-engine boards, the EPM570GF256C5 collects multiple parallel data streams, generates timing signals, and dispatches pixel data to a back-end processor. The 76 I/Os handle RGB888 or LVDS-pair fan-out, while the 5.4 ns delay maintains pixel-clock-to-data alignment at common display rates. The non-volatile instant-on behavior guarantees the panel initializes correctly without waiting for an MCU firmware load. Quartus II IP libraries for I2C, SPI, and DisplayPort aux channels accelerate development, and the 256-FBGA package's central thermal pad supports continuous operation in thermally constrained consumer electronics enclosures.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPM570GF256C5 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPM570GF256C4N | EPM570GF256C4 | EPM570GF256C3N | EPM1270GF256C5 |
|---|---|---|---|---|---|
| Package | 256-FBGA (11x11 mm, 1.0 mm pitch) | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 570 | 570 | 570 | 570 | 1270 |
| Macrocells | 440 | 440 | 440 | 440 | 980 |
| Maximum User I/Os | 76 | 76 | 76 | 76 | 76 |
| Speed Grade (tPD) | 5.4 ns (-5) | ~7.5 ns (-4) | ~7.5 ns (-4) | ~9 ns (-3) | 5.4 ns (-5) |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
| Configuration Memory | Non-volatile flash (instant-on) | Non-volatile flash (instant-on) | Non-volatile flash (instant-on) | Non-volatile flash (instant-on) | Non-volatile flash (instant-on) |
주요 차별점
- Highest speed grade available in 570 LE density (vs EPM570GF256C4)
- Non-volatile flash instant-on configuration (vs SRAM-based FPGAs)
- Vertical migration to EPM1270 / EPM2210 in same footprint (vs EPM1270GF256C5)
설계 노트
The 256-ball FineLine BGA package concentrates up to ~0.5W typical dissipation into a 11x11 mm footprint. Place an array of thermal vias (0.3 mm diameter, 1.0 mm pitch) directly under the central thermal pad and stitch them to inner ground planes. Without thermal vias, junction temperature can exceed 100 C in enclosed industrial cabinets and cause logic errors. Estimated: at 0.5W dissipation with 30 C/W theta_JA on a 4-layer board with thermal vias, junction rise is approximately 15 C above ambient.
Route all four JTAG signals (TDI, TDO, TMS, TCK) with 50 ohm controlled impedance and keep total length under 50 mm to avoid programming failures with the USB-Blaster. Place a 10 kohm pull-up on TCK and TMS, and a 10 kohm pull-up on TDI as recommended in the Altera MAX II handbook. Add a 4.7 kohm pull-up on nCONFIG if used for multi-device JTAG chains to prevent spurious configuration during board power-up.
The MAX II VCCIO banks are NOT 5V-tolerant; applying 5V signals to any I/O while VCCIO is 3.3V or lower will permanently damage the device. Always verify bank voltage before connecting legacy 5V peripherals, or use external 5V-to-3.3V level shifters. The on-chip 1.8V LDO requires a 0.1 uF decoupling capacitor on VCCINT and a 4.7 uF bulk capacitor within 5 mm of the VCCD_PLL pin per the datasheet.
Place all VCCIO and GND balls on short, wide traces directly to their respective decoupling capacitors. Use 0.1 uF X7R 0402 capacitors within 1 mm of every VCCIO ball, and a single 10 uF bulk capacitor per VCCIO bank. Separate analog and digital grounds are not required (no PLL analog pins in MAX II), but stitch the inner ground plane with 1.0 mm via fencing around high-speed clock signals to reduce EMI.
규정 준수 정보
RoHS-compliant lead-free FineLine BGA package per Altera product page. Not AEC-Q100 qualified - for automotive safety-critical applications, verify with Intel. Halogen-free status not explicitly stated in available data.
