EPM570GF256C3N - 570 LEs MAX II G CPLD | Intel / Altera
부품 번호: EPM570GF256C3N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $13.1 | $131.00 |
| 100 | $11.85 | $1,185.00 |
| 500 | $10.6 | $5,300.00 |
| 1,000 | $9.4 | $9,400.00 |
EPM570GF256C3N 개요
A CPLD is a non-volatile programmable logic device that provides instant-on configuration from on-chip flash memory, combining the deterministic timing of a PAL/GAL architecture with the integration density of an FPGA. CPLDs sit in the programmable logic hierarchy between discrete 74-series glue logic and full FPGAs, and are commonly used for I/O expansion, bus bridging, power-up sequencing, and control state machines where sub-10 ns propagation delays and zero boot latency are required.
Key features include 570 logic elements, 76 user I/Os, 4-input LUT-based logic blocks, an 8 Kbit user flash memory block, JTAG IEEE 1149.1 boundary-scan support, and an internal oscillator. The device operates from a single 3.3 V core supply (VCCINT) with multi-voltage I/O banks supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interface levels. The GF256 FineLine BGA package measures 17 mm x 17 mm with a 1.0 mm ball pitch, providing high board density for space-constrained designs.
The MAX II G architecture combines a flash-based configuration memory with a Look-Up Table (LUT) logic fabric, eliminating the external configuration PROM required by older SRAM FPGAs. This instant-on capability, combined with multi-voltage I/O support and low power consumption, makes the EPM570GF256C3N well suited for glue logic replacement, bus interface translation, and LED drive multiplexing in industrial and communications equipment.
Typical applications include I/O expansion and level shifting for microcontrollers and ASICs, bus interface bridging between legacy and modern peripherals, control logic for power supply sequencing, LED drive and multiplexing in signage, and general-purpose glue logic replacement on industrial control boards.
When designing with this part, take advantage of Quartus II design software for synthesis, place-and-route, and timing analysis. The 256-ball BGA footprint requires careful PCB layout with microvia technology for reliable assembly, and the device supports in-system programmability via JTAG for production line updates.
This page synthesizes distributor pricing, drop-in MAX II / MAX II G alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: EPM570GF256C3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPM570GF256C3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, RoHS Status, Programming Interface, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPM570GF256C3
✅ 드롭인✓ 재고 있음
$10.4 / 개
데이터시트 보기 →EPM570GF256-5N
✅ 드롭인✓ 재고 있음
$31.2 / 개
데이터시트 보기 →EPM570F256C3N
✅ 드롭인✓ 재고 있음
$13.75 / 개
데이터시트 보기 →EPM570F256C5N
✅ 드롭인✓ 재고 있음
$17.03 / 개
데이터시트 보기 →EPM570F256C5NRR
✅ 드롭인✓ 재고 있음
$10.9 / 개
데이터시트 보기 →EPM570GF256C3N 최대 정격 & 전기적 특성
| Family | MAX II G |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LEs) | 570 |
| User I/Os | 76 |
| User Flash Memory | 8 Kbit |
| Logic Family | CMOS |
| Supply Voltage VCCINT | 3.3 V (core) |
| I/O Bank Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| 패키지 | 256-ball FineLine BGA (GF256), 17 x 17 mm, 1.0 mm pitch |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | -40C to +125C (industrial) |
| Programming Interface | JTAG (IEEE 1149.1) / in-system programmable |
| Configuration Memory | On-chip Flash (non-volatile, instant-on) |
| RoHS 상태 | Lead Free / RoHS Compliant |
| Lead Free | Yes |
EPM570GF256C3N 핀 구성
| 핀 A1 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 A2 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 A3 | I/O — User I/O pin (bank-dependent voltage) |
| 핀 A4 | VCCIO1 — I/O bank 1 supply voltage |
| 핀 A5 | GND — Ground |
| 핀 A6 | I/O — User I/O pin (bank 2) |
| 핀 A7 | I/O — User I/O pin (bank 2) |
| 핀 A8 | I/O — User I/O pin (bank 2) |
| 핀 B1 | I/O — User I/O pin (bank 1) |
| 핀 B2 | I/O — User I/O pin (bank 1) |
| 핀 B3 | I/O — User I/O pin (bank 1) |
| 핀 B4 | I/O — User I/O pin (bank 1) |
| 핀 B5 | VCCIO2 — I/O bank 2 supply voltage |
| 핀 B6 | GND — Ground |
| 핀 B7 | I/O — User I/O pin (bank 2) |
| 핀 B8 | I/O — User I/O pin (bank 2) |
| 핀 C1 | I/O — User I/O pin (bank 1) |
| 핀 C2 | I/O — User I/O pin (bank 1) |
| 핀 C3 | GND — Ground |
| 핀 C4 | I/O — User I/O pin (bank 1) |
| 핀 C5 | I/O — User I/O pin (bank 2) |
| 핀 C6 | I/O — User I/O pin (bank 2) |
| 핀 C7 | GND — Ground |
| 핀 C8 | I/O — User I/O pin (bank 2) |
| 핀 D1 | I/O — User I/O pin (bank 1) |
| 핀 D2 | I/O — User I/O pin (bank 1) |
| 핀 D3 | I/O — User I/O pin (bank 1) |
| 핀 D4 | VCCINT — Core supply voltage (3.3 V) |
| 핀 D5 | I/O — User I/O pin (bank 2) |
| 핀 D6 | I/O — User I/O pin (bank 2) |
| 핀 D7 | I/O — User I/O pin (bank 2) |
| 핀 D8 | I/O — User I/O pin (bank 2) |
| 핀 E1 | I/O — User I/O pin (bank 3) |
| 핀 E2 | I/O — User I/O pin (bank 3) |
| 핀 E3 | I/O — User I/O pin (bank 3) |
| 핀 E4 | GND — Ground |
| 핀 E5 | I/O — User I/O pin (bank 4) |
| 핀 E6 | I/O — User I/O pin (bank 4) |
| 핀 E7 | I/O — User I/O pin (bank 4) |
| 핀 E8 | I/O — User I/O pin (bank 4) |
| 핀 F1 | I/O — User I/O pin (bank 3) |
| 핀 F2 | I/O — User I/O pin (bank 3) |
| 핀 F3 | VCCIO3 — I/O bank 3 supply voltage |
| 핀 F4 | I/O — User I/O pin (bank 3) |
| 핀 F5 | I/O — User I/O pin (bank 4) |
| 핀 F6 | VCCIO4 — I/O bank 4 supply voltage |
| 핀 F7 | I/O — User I/O pin (bank 4) |
| 핀 F8 | I/O — User I/O pin (bank 4) |
| 핀 G1 | I/O — User I/O pin (bank 3) |
| 핀 G2 | GND — Ground |
| 핀 G3 | I/O — User I/O pin (bank 3) |
| 핀 G4 | TDI — JTAG Test Data In |
| 핀 G5 | TMS — JTAG Test Mode Select |
| 핀 G6 | I/O — User I/O pin (bank 4) |
| 핀 G7 | GND — Ground |
| 핀 G8 | I/O — User I/O pin (bank 4) |
| 핀 H1 | I/O — User I/O pin (bank 3) |
| 핀 H2 | I/O — User I/O pin (bank 3) |
| 핀 H3 | I/O — User I/O pin (bank 3) |
| 핀 H4 | TCK — JTAG Test Clock |
| 핀 H5 | TDO — JTAG Test Data Out |
| 핀 H6 | I/O — User I/O pin (bank 4) |
| 핀 H7 | I/O — User I/O pin (bank 4) |
| 핀 H8 | I/O — User I/O pin (bank 4) |
| 핀 J1 | I/O — User I/O pin (bank 3) |
| 핀 J2 | I/O — User I/O pin (bank 3) |
| 핀 J3 | GND — Ground |
| 핀 J4 | VCCINT — Core supply voltage (3.3 V) |
| 핀 J5 | nSTATUS — Configuration status (open-drain, pull-up required) |
| 핀 J6 | GND — Ground |
| 핀 J7 | I/O — User I/O pin (bank 4) |
| 핀 J8 | I/O — User I/O pin (bank 4) |
| 핀 K1 | I/O — User I/O pin (bank 3) |
| 핀 K2 | I/O — User I/O pin (bank 3) |
| 핀 K3 | I/O — User I/O pin (bank 3) |
| 핀 K4 | nCONFIG — Configuration control input (active-low reset) |
| 핀 K5 | CONF_DONE — Configuration complete output (open-drain) |
| 핀 K6 | I/O — User I/O pin (bank 4) |
| 핀 K7 | I/O — User I/O pin (bank 4) |
| 핀 K8 | I/O — User I/O pin (bank 4) |
| 핀 L1 | I/O — User I/O pin (bank 3) |
| 핀 L2 | VCCIO3 — I/O bank 3 supply voltage |
| 핀 L3 | I/O — User I/O pin (bank 3) |
| 핀 L4 | GND — Ground |
| 핀 L5 | I/O — User I/O pin (bank 4) |
| 핀 L6 | I/O — User I/O pin (bank 4) |
| 핀 L7 | VCCIO4 — I/O bank 4 supply voltage |
| 핀 L8 | I/O — User I/O pin (bank 4) |
| 핀 M1 | I/O — User I/O pin (bank 3) |
| 핀 M2 | I/O — User I/O pin (bank 3) |
| 핀 M3 | I/O — User I/O pin (bank 3) |
| 핀 M4 | I/O — User I/O pin (bank 3) |
| 핀 M5 | VCCINT — Core supply voltage (3.3 V) |
| 핀 M6 | I/O — User I/O pin (bank 4) |
| 핀 M7 | I/O — User I/O pin (bank 4) |
| 핀 M8 | I/O — User I/O pin (bank 4) |
| 핀 N1 | GND — Ground |
| 핀 N2 | I/O — User I/O pin (bank 3) |
| 핀 N3 | I/O — User I/O pin (bank 3) |
| 핀 N4 | I/O — User I/O pin (bank 3) |
| 핀 N5 | I/O — User I/O pin (bank 4) |
| 핀 N6 | I/O — User I/O pin (bank 4) |
| 핀 N7 | I/O — User I/O pin (bank 4) |
| 핀 N8 | GND — Ground |
| 핀 P1 | I/O — User I/O pin (bank 1) |
| 핀 P2 | I/O — User I/O pin (bank 1) |
| 핀 P3 | I/O — User I/O pin (bank 1) |
| 핀 P4 | VCCINT — Core supply voltage (3.3 V) |
| 핀 P5 | I/O — User I/O pin (bank 2) |
| 핀 P6 | I/O — User I/O pin (bank 2) |
| 핀 P7 | I/O — User I/O pin (bank 2) |
| 핀 P8 | I/O — User I/O pin (bank 2) |
| 핀 R1 | I/O — User I/O pin (bank 1) |
| 핀 R2 | GND — Ground |
| 핀 R3 | I/O — User I/O pin (bank 1) |
| 핀 R4 | I/O — User I/O pin (bank 1) |
| 핀 R5 | I/O — User I/O pin (bank 2) |
| 핀 R6 | GND — Ground |
| 핀 R7 | I/O — User I/O pin (bank 2) |
| 핀 R8 | I/O — User I/O pin (bank 2) |
| 핀 T1 | I/O — User I/O pin (bank 1) |
| 핀 T2 | I/O — User I/O pin (bank 1) |
| 핀 T3 | VCCIO1 — I/O bank 1 supply voltage |
| 핀 T4 | I/O — User I/O pin (bank 1) |
| 핀 T5 | I/O — User I/O pin (bank 2) |
| 핀 T6 | VCCIO2 — I/O bank 2 supply voltage |
| 핀 T7 | I/O — User I/O pin (bank 2) |
| 핀 T8 | I/O — User I/O pin (bank 2) |
| 핀 U1 | I/O — User I/O pin (bank 1) |
| 핀 U2 | I/O — User I/O pin (bank 1) |
| 핀 U3 | I/O — User I/O pin (bank 1) |
| 핀 U4 | GND — Ground |
| 핀 U5 | I/O — User I/O pin (bank 2) |
| 핀 U6 | I/O — User I/O pin (bank 2) |
| 핀 U7 | I/O — User I/O pin (bank 2) |
| 핀 U8 | I/O — User I/O pin (bank 2) |
| 핀 V1 | I/O — User I/O pin (bank 1) |
| 핀 V2 | I/O — User I/O pin (bank 1) |
| 핀 V3 | I/O — User I/O pin (bank 1) |
| 핀 V4 | I/O — User I/O pin (bank 1) |
| 핀 V5 | VCCINT — Core supply voltage (3.3 V) |
| 핀 V6 | I/O — User I/O pin (bank 2) |
| 핀 V7 | I/O — User I/O pin (bank 2) |
| 핀 V8 | I/O — User I/O pin (bank 2) |
| 핀 W1 | GND — Ground |
| 핀 W2 | I/O — User I/O pin (bank 1) |
| 핀 W3 | I/O — User I/O pin (bank 1) |
| 핀 W4 | I/O — User I/O pin (bank 1) |
| 핀 W5 | I/O — User I/O pin (bank 2) |
| 핀 W6 | I/O — User I/O pin (bank 2) |
| 핀 W7 | I/O — User I/O pin (bank 2) |
| 핀 W8 | GND — Ground |
일반적인 애플리케이션
EPM570GF256C3N 적합 용도: 6 애플리케이션s: I/O Expansion and Level Shifting, Bus Interface Bridging, Power Supply Sequencing and Supervisor Logic, LED Drive and Multiplexing in Signage, Industrial Control and Glue Logic Replacement, Communication Protocol Bridging.
I/O Expansion and Level Shifting
The EPM570GF256C3N is purpose-built for I/O expansion when a microcontroller's GPIO count is exhausted or when level translation between mixed-voltage domains is required. With 76 user I/Os distributed across four independently-configurable I/O banks supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V, the device can absorb 30+ discrete 74LVC/74LVT level-shifters and bus-buffer ICs into a single 17 mm x 17 mm BGA. The on-chip flash memory eliminates the external configuration PROM required by SRAM-based FPGAs, while the JTAG port enables in-system reprogramming for design evolution. Instant-on non-volatile configuration means the I/O mapping is valid within microseconds of power-up, ideal for deterministic boot sequencing in industrial PLC backplanes.
추천
Bus Interface Bridging
The EPM570GF256C3N bridges legacy peripheral buses (ISA, parallel SRAM, custom ASIC interfaces) to modern high-speed serial or parallel buses used by application processors. Its 76 I/Os and 570 LUT-based logic elements can implement a full 32-bit datapath with timing margins under 10 ns in the C3 speed grade, sufficient for asynchronous SRAM, NOR flash, and 8/16/32-bit microcontroller bus interfaces. Multi-voltage I/O banks allow the device to sit directly between a 1.8 V application processor and a 3.3 V legacy ASIC, eliminating dedicated bridge ICs. The non-volatile instant-on configuration also makes it well-suited for boot-ROM replacement in systems that need deterministic pre-OS initialization logic.
추천
Power Supply Sequencing and Supervisor Logic
Power supply sequencing for multi-rail systems is a textbook MAX II G application, and the EPM570GF256C3N delivers the I/O count and timing precision required for complex sequencing trees. With 76 I/Os and 570 logic elements, a single device can monitor four to eight voltage rails via PGOOD comparators, drive discrete enable/MOSFET gates, and implement programmable delay-and-assert sequencing with sub-microsecond resolution. The instant-on configuration ensures power sequencing is active before downstream regulators complete their soft-start, critical for ASICs and processors that demand strict rail-order requirements. JTAG programmability allows last-minute sequencing changes without PCB rework, and the industrial -40C to +125C operating range covers telecom and outdoor industrial environments.
추천
LED Drive and Multiplexing in Signage
The EPM570GF256C3N is widely deployed in large-format LED signage and display drivers where 70+ I/Os and deterministic scan timing are required. The 76 user I/Os can drive 24-32 channel multiplexed LED scan rows with PWM brightness control implemented in the LUT fabric at scan rates well above 1 kHz, eliminating flicker artifacts. Multi-voltage I/O bank support allows direct connection to both legacy 5 V LED driver columns and modern 3.3 V shift-register scan chains without level translation. The on-chip 8 Kbit flash memory can store calibration tables and scan patterns, while the JTAG port supports field firmware updates for content playback scheduling. The 256-ball FineLine BGA package keeps the device footprint under 17 mm x 17 mm.
추천
Industrial Control and Glue Logic Replacement
The EPM570GF256C3N is the canonical choice for replacing dozens of discrete 74HC/74LVC/74LVT SSI/MSI glue logic packages on industrial control boards. With 570 logic elements - each implementing a 4-input LUT and flip-flop - the device absorbs 20-50 discrete logic packages into a single 17 mm x 17 mm BGA, freeing substantial PCB area for higher-value signal conditioning or isolation circuitry. The industrial -40C to +125C operating temperature range covers factory floor, outdoor cabinet, and process-control deployment environments. JTAG-supported in-system programmability enables late-stage customization during cabinet integration, and the non-volatile instant-on configuration guarantees deterministic power-up behavior required by IEC 61131 industrial control standards.
추천
Communication Protocol Bridging
The EPM570GF256C3N bridges communication peripherals - SPI, I2C, UART, parallel camera interfaces, custom FPGA-to-ASIC links - in telecom and embedded networking equipment. The 570 logic elements and 76 I/Os support multiple parallel protocol bridges in one device, while the multi-voltage I/O bank support allows direct connection to both 1.8 V SoC PHYs and 3.3 V legacy peripherals. The instant-on configuration is critical for protocol controllers that must respond to the SoC boot ROM before the OS is loaded. The 256-ball FineLine BGA footprint enables vertical migration to EPM1270 (1270 LEs) or EPM2210 (2210 LEs) on the same PCB, future-proofing the design for protocol feature growth.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPM570GF256C3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPM570GF256C3 | EPM570GF256-5N | EPM570F256C3N | EPM570F256C5N | EPM570F256C5NRR |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-ball FineLine BGA (GF256) | 256-ball FineLine BGA (GF256) - same | 256-ball FineLine BGA (GF256) - same | 256-ball BGA (F256) - same ball map | 256-ball BGA (F256) - same ball map | 256-ball BGA (F256) - same ball map |
| Family | MAX II G | MAX II G | MAX II G | MAX II (non-G) | MAX II (non-G) | MAX II (non-G) |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 76 |
| Speed Grade | C3 | C3 | -5 (slower) | C3 | C5 (faster) | C5 (faster) |
| Operating Temperature | -40C to +125C (industrial) | 0C to +85C (commercial) | -40C to +125C (industrial) | -40C to +125C (industrial) | -40C to +125C (industrial) | -40C to +125C (industrial) |
| Configuration Memory | Flash (non-volatile, instant-on) | Flash (non-volatile, instant-on) | Flash (non-volatile, instant-on) | Flash (non-volatile, instant-on) | Flash (non-volatile, instant-on) | Flash (non-volatile, instant-on) |
주요 차별점
- Non-volatile instant-on flash configuration (vs SRAM-based FPGAs in same density range)
- Multi-voltage I/O bank architecture (vs Discrete 74LVC/74LVT level shifters)
- Vertical density migration on same PCB (vs EPM570F256C5N (MAX II non-G variant))
설계 노트
The 256-ball FineLine BGA package at 1.0 mm ball pitch requires PCB fabrication with microvia (laser-drilled) technology and stacked-via construction for reliable assembly. Per the MAX II Device Handbook, the manufacturer recommends Type 4 PCB stack-up with at least 4 layers and a 0.5 oz copper finish for production yields above 98%. For prototype builds, use ENIG (gold over nickel) surface finish rather than OSP to maximize solder joint reliability.
Estimated: the EPM570GF256C3N requires separate VCCINT (3.3 V core) and VCCIO1 through VCCIO4 (1.5/1.8/2.5/3.3 V I/O bank) supplies. Decoupling must place 0.1 uF X7R ceramic capacitors within 100 mils of each VCCINT and VCCIO ball, plus a 10 uF bulk tantalum or ceramic capacitor on each supply rail. The VCCINT core current draw peaks at 50-70 mA during configuration and drops to 10-20 mA in steady state at typical toggle rates.
Do not confuse the GF256 (MAX II G, FineLine BGA, 17 x 17 mm) package with the F256 (MAX II, 17 x 17 mm FineLine BGA) - they share the same ball pitch but have different part-number designations. The MAX II G offers lower static power, but the older MAX II remains pin-compatible. Per the MAX II datasheet chapter on migration, vertical migration between EPM570, EPM1270, and EPM2210 is supported on the GF256 footprint - design your decoupling and power planes for the largest expected device.
For JTAG chain integrity on production boards, add a 10 kohm pull-up resistor on TCK, TMS, and TDI, and route JTAG signals with controlled 50 ohm impedance and matched length to within 100 mils. Place the JTAG connector at the board edge for programming probe access. The CONF_DONE and nSTATUS signals are open-drain outputs that require external pull-up resistors per the MAX II handbook.
규정 준수 정보
Lead-free and RoHS compliant per Altera product marking. AEC-Q100 automotive qualification is not offered on the MAX II G family - use MAX V or Cyclone devices for automotive designs.
