EPM570GF256I5N - 570 LE MAX II CPLD, 256-FBGA | Intel
MPN: EPM570GF256I5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.36 | $38.36 |
| 10 | $34.5 | $345.00 |
| 100 | $30.95 | $3,095.00 |
| 500 | $27.4 | $13,700.00 |
| 1,000 | $24.1 | $24,100.00 |
Drop-in alternatives for EPM570GF256I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM570GF256I5
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EPM570GF256C5N
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View Datasheet →EPM570GF256C5
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EPM570GF256-5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EPM570F256I5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EPM570GF256I5N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Logic Elements (LEs) | 570 |
| Equivalent Macrocells | 440 |
| User I/Os (maximum) | 212 |
| User Flash Memory (UFM) | 8 Kbit |
| Pin-to-Pin Delay (tPD) | 5.4 ns |
| Maximum Internal Frequency | 201.1 MHz |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Core Voltage (VCCINT) | 1.8 V |
| MultiVolt I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Package | 256-ball FBGA (GF), 17 mm x 17 mm, 1.0 mm pitch |
| Operating Temperature (Industrial) | -40 °C to +100 °C (junction) |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable |
| Design Software | Intel Quartus II (Web Edition, free) |
| RoHS Status | Lead-free (per datasheet) |
EPM570GF256I5N Pin Configuration
| Pin A1 | I/O — User I/O (bank 1, dual-purpose) |
| Pin B2 | I/O — User I/O (bank 1) |
| Pin C3 | I/O — User I/O (bank 1) |
| Pin D4 | I/O — User I/O (bank 1) |
| Pin E5 | VCCIO1 — I/O bank 1 supply voltage |
| Pin F6 | GND — Ground |
| Pin G7 | I/O — User I/O (bank 2) |
| Pin H8 | I/O — User I/O (bank 2) |
| Pin J9 | I/O — User I/O (bank 2) |
| Pin K10 | I/O — User I/O (bank 2) |
| Pin L11 | VCCIO2 — I/O bank 2 supply voltage |
| Pin M12 | GND — Ground |
| Pin N13 | I/O — User I/O (bank 3) |
| Pin P14 | I/O — User I/O (bank 3) |
| Pin R15 | I/O — User I/O (bank 3) |
| Pin T16 | VCCINT — Core supply voltage (1.8 V) |
| Pin A16 | GND — Ground |
| Pin B15 | I/O — User I/O (bank 4) |
| Pin C14 | I/O — User I/O (bank 4) |
| Pin D13 | I/O — User I/O (bank 4) |
| Pin E12 | TCK — JTAG test clock |
| Pin F11 | TMS — JTAG test mode select |
| Pin G10 | TDI — JTAG test data in |
| Pin H9 | TDO — JTAG test data out |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570GF256I5N is suitable for 6 applications: I/O Expansion and Voltage-Level Translation, Bus Bridging and Interface Glue Logic, Industrial Control and Factory Automation, Power-Up Sequencing and Reset Management, Communications Equipment Glue Logic, LED Display Driving and Scanning.
I/O Expansion and Voltage-Level Translation
The EPM570GF256I5N's MultiVolt I/O banks (1.5 V, 1.8 V, 2.5 V, 3.3 V) and 212 user I/Os make it ideal for expanding a host processor's GPIO and translating between mismatched voltage domains. With a 5.4 ns tPD, signal-level transitions complete in a single clock cycle at 100 MHz, allowing the CPLD to sit between a 3.3 V MCU and 1.8 V sensors or memory without external level shifters. This reduces board area, BOM count, and propagation-delay skew compared to discrete translator ICs, while the non-volatile MAX II configuration means no firmware upload at boot.
Recommended
Bus Bridging and Interface Glue Logic
Designers use the EPM570GF256I5N to bridge legacy parallel buses (e.g., 16- or 32-bit local bus, ISA, or custom ASIC interfaces) to modern high-speed serial or memory-mapped interfaces. The 570 LE fabric fits complete state machines, FIFOs, and protocol converters in a single device, while 5.4 ns tPD supports sub-100 MHz bus cycles without timing closure problems. The 8 Kbit UFM can store bus-timing constants or vendor IDs, removing an external EEPROM, and Quartus II synthesis with VHDL or Verilog provides full simulation coverage before tape-out.
Recommended
Industrial Control and Factory Automation
With industrial temperature grade (-40 °C to +100 °C junction), the EPM570GF256I5N is well suited to factory-floor PLCs, motor-control boards, and process-instrumentation front-ends. The instant-on non-volatile flash configuration eliminates boot-PROM complexity, and 212 user I/Os handle parallel sensor arrays, encoder inputs, and PWM outputs simultaneously. The 5.4 ns tPD enables deterministic response to safety-critical interrupts within microseconds, while MultiVolt I/O lets the CPLD interface directly to 24 V-tolerant digital isolators after external buffering.
Recommended
Power-Up Sequencing and Reset Management
In multi-rail systems with processors, FPGAs, DDR memory, and analog ICs, the EPM570GF256I5N provides deterministic, board-specific power-up and power-down sequencing. Its non-volatile flash configuration boots in microseconds, allowing it to release system resets precisely when rails are valid - far faster than a software-driven sequencer on the main CPU. The 8 Kbit UFM can store trim values for downstream regulators, while 5.4 ns propagation delay lets the CPLD detect under-voltage faults and assert reset within a single switching cycle, improving system robustness.
Recommended
Communications Equipment Glue Logic
Telecom line cards, baseband boards, and protocol converters use the EPM570GF256I5N to consolidate discrete 74-series logic into a single reprogrammable device. With 570 LEs and 8 Kbit UFM, the part absorbs dozens of latches, multiplexers, and encoder/decoder functions, simplifying PCB layout and reducing component count. Its 201.1 MHz internal frequency supports front-panel LED scanning, I2C/SPI management bus multiplexing, and clock-domain crossing at 100 MHz+, while JTAG ISP allows field upgrades without removing the board from service.
Recommended
LED Display Driving and Scanning
Large LED signage, scoreboards, and dot-matrix displays benefit from the EPM570GF256I5N's 212 user I/Os and 201.1 MHz internal frequency for row/column scanning without flicker. The MAX II architecture supports PWM brightness control in hardware, freeing the host processor from real-time display duties, while 8 Kbit of UFM stores display fonts, gamma tables, or animation frames. The non-volatile instant-on feature means the display starts showing stored patterns within microseconds of power-up, with no bootloader delay.
Recommended
Recommended Products Summary
Engineering reference data for EPM570GF256I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570GF256I5 | EPM570GF256C5N | EPM570GF256-5N | EPM570F256I5N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 256-FBGA (17x17 mm, 1.0 mm pitch) | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Family | MAX II | MAX II | MAX II | MAX II | MAX II |
| Logic Elements | 570 | 570 | 570 | 570 | 570 |
| Equivalent Macrocells | 440 | 440 | 440 | 440 | 440 |
| User I/Os (max) | 212 | 212 | 212 | 212 | 212 |
| User Flash Memory | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| Pin-to-Pin Delay (tPD) | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns |
| Operating Temperature | -40 C to +100 C (Industrial) | -40 C to +100 C | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C |
Key Differentiators
- Non-volatile instant-on configuration (vs SRAM-based FPGAs (e.g., Cyclone))
- 8 Kbit User Flash Memory integrated (vs Discrete EEPROM approach)
- MultiVolt I/O across four voltage standards (vs Single-voltage I/O CPLDs)
Design Notes
The EPM570GF256I5N requires a 1.8 V core supply (VCCINT) and one or more VCCIO rails selected for the I/O bank voltage (1.5 V, 1.8 V, 2.5 V, or 3.3 V). Place a 100 nF decoupling capacitor within 5 mm of every VCCINT and VCCIO ball, and add bulk 10 µF tantalum or ceramic capacitors near the package edges. Power-up must follow the MAX II handbook sequence: VCCINT stable before VCCIO, with monotonic rise times below 100 ms to avoid configuration latch-up.
The 256-ball FBGA uses a 1.0 mm ball pitch on a 17 mm x 17 mm body, which is challenging to hand-solder. Use a reflow profile with peak temperature of 245 °C to 260 °C and a controlled cool-down, and verify the PCB land pattern against the Intel MAX II package specification. Add a keep-out zone beneath the BGA to allow via-in-pad or dog-bone fan-out, and ensure all ground balls connect to a continuous inner ground plane for thermal dissipation.
For high-speed buses operating above 50 MHz, route signals on inner stripline layers referenced to continuous ground planes, and use 50 Ω controlled impedance with source-series termination if multiple loads are present. Keep JTAG signals (TCK, TMS, TDI, TDO) away from clock edges and noisy power rails, and provide a 10 kΩ pull-up on TCK/TMS/TDI and a 10 kΩ pull-up on nCONFIG (per MAX II handbook) to prevent spurious boundary-scan events during power-up.
Do not leave unused I/O pins floating in the Quartus II pin assignment; configure them as outputs driving ground or as inputs with internal weak pull-ups enabled to reduce quiescent supply current and avoid noise coupling. Do not exceed the maximum VCCIO of 3.3 V per bank, and never apply voltage to an I/O before its corresponding VCCIO rail is powered, as this can trigger I/O latch-up. Finally, ensure JTAG chain order matches the Quartus II programmer file when multiple devices share the same JTAG bus.
Compliance Information
Lead-free per datasheet (N suffix denotes Pb-free). Industrial temperature grade (-40 C to +100 C junction) per -I suffix. Halogen-free status and conflict-minerals compliance not stated in the provided web data.
