H58G46AK6PX033 - 16Gb LPDDR5-6400 Automotive DRAM | SK Hynix
부품 번호: H58G46AK6PX033 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1 | $1.00 |
H58G46AK6PX033 개요
LPDDR5 (Low Power Double Data Rate 5) is the fifth generation of JEDEC low-power SDRAM, defined by the JEDEC JESD209-5 standard. As a class of dynamic random access memory, LPDDR devices sit within the memory IC hierarchy alongside DDR SDRAM and GDDR, but prioritize power efficiency and space savings for mobile, edge computing, and embedded platforms. LPDDR5 introduces bank group architecture, deep sleep mode, and advanced refresh management to cut idle and active power versus LPDDR4X.
Key features of the H58G46AK6PX033 include the 6400 Mbps/pin data rate, delivering high aggregate bandwidth on a x16 bus; the 16Gb density in a single-die package for compact BOM designs; automotive-grade qualification supporting AEC-aligned automotive programs; and a low-voltage VDDQ domain of 0.5V that reduces IO switching power. The device supports multiple supply rails (1.8V VDD2, 1.05V VDD1, 0.5V VDDQ) typical of the LPDDR5 power architecture.
Architecturally, the device uses LPDDR5 bank group organization with dynamic frequency scaling support, allowing the host controller to throttle the clock between traffic bursts to minimize power. WCK and CK differential clocking sustain the 6400 Mbps transfer rate, while on-die termination and training modes maintain signal integrity across the FBGA interface.
Typical applications include automotive infotainment and ADAS domain controllers, telematics and dashboard units, industrial controllers and computing modules, embedded logging systems, and high-performance mobile/consumer platforms. The 2GB-per-device density suits both main-memory and firmware/data logging roles.
Design consideration: LPDDR5 routing demands strict length matching, reference-plane continuity, and controller-side training; consult the manufacturer datasheet for skew and impedance targets before layout signoff.
This page synthesizes distributor sourcing data, drop-in alternative analysis, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: H58G46AK6PX033 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: H58G46AK6PX033 (동일 폼 팩터 및 풋프린트) — 차이점: Memory Type, Organization, Density, Mounting Type, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
H58G46AK6PX033E
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
H58G46BK6PX033
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
H58G46AK7PX033
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
H58G46AK6PX033 최대 정격 & 전기적 특성
| 메모리 유형 | LPDDR5 SDRAM |
| Density | 16 Gb (2 GB) |
| 메모리 구성 | x16 |
| 데이터 속도 | 6400 Mbps/pin |
| 인터페이스 | LPDDR5 (JEDEC low-power DRAM interface) |
| Supply Voltage (VDD2) | 1.8 V |
| Supply Voltage (VDD1) | 1.05 V |
| Supply Voltage (VDDQ) | 0.5 V |
| 패키지 | 315-ball FBGA |
| 실장 유형 | Surface Mount |
| Application Grade | Automotive |
| Memory Category | DRAM (Dynamic Random Access Memory) |
| Application Domains | Data storage, firmware boot, embedded logging, industrial controllers, computing modules |
H58G46AK6PX033 315-ball fbga 핀 구성 가이드
H58G46AK6PX033(315-ball fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: H58G46AK6PX033.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
H58G46AK6PX033 적합 용도: 6 애플리케이션s: Automotive ADAS Domain Controllers, Automotive Infotainment and Cockpit Systems, Industrial Controllers and Edge Computing Modules, Firmware Boot and Embedded Data Logging, Mobile and Consumer High-Performance Devices, Telematics and Vehicle Networking Gateways.
Automotive ADAS Domain Controllers
The H58G46AK6PX033 fits ADAS domain controllers because its 6400 Mbps/pin data rate supplies the bandwidth that multi-camera sensor fusion and object-detection SoCs demand, while its automotive qualification addresses the reliability and traceability expectations of vehicle programs. In a typical topology the LPDDR5 is connected point-to-point to the ADAS SoC's LPDDR5 controller, with the 16Gb x16 organization providing 2GB per device and multiple devices stacked in bandwidth or capacity configurations. The 0.5V VDDQ domain keeps IO switching power low, which matters for thermal budgets in sealed enclosures. Performance consideration: signal integrity at 6400 Mbps requires strict length matching and impedance control on the CA and DQ buses, so layout investment is the main engineering cost.
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Automotive Infotainment and Cockpit Systems
Digital cockpit and infotainment units run rich HMI graphics, navigation, and audio processing concurrently, and the H58G46AK6PX033 supports these workloads with 6400 Mbps/pin bandwidth and 2GB density per device in a compact 315-ball FBGA. Its automotive grade aligns with the extended temperature and quality expectations of in-vehicle platforms, per the SK Hynix product positioning for automotive memory. The device sits on the LPDDR5 bus of the cockpit SoC, providing frame-buffer and application memory with dynamic frequency scaling to save power during idle HMI periods. Performance consideration: the three-rail power tree (1.8V/1.05V/0.5V) must be sequenced correctly, and the SoC's training routines must re-run at every cold boot to guarantee timing margin.
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Industrial Controllers and Edge Computing Modules
Industrial controllers and compute modules benefit from the H58G46AK6PX033's combination of 16Gb density, 6400 Mbps/pin bandwidth, and the low power that LPDDR5 delivers versus DDR4 at equivalent performance, per the SK Hynix overview that names industrial controllers and computing modules among its target uses. The x16 organization simplifies bus design for compact SOM (system-on-module) form factors, and the FBGA package keeps board area small. In these designs the LPDDR5 connects point-to-point to an edge-AI processor or MCU-class SoC with an LPDDR5 memory controller. Performance consideration: industrial thermal environments may derate the achievable data rate, so designers should validate training margins at maximum ambient temperature rather than relying on room-temperature lab results.
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Firmware Boot and Embedded Data Logging
The SK Hynix product description explicitly lists firmware boot and embedded logging among the roles for the H58G46AK6PX033. As boot memory support, the LPDDR5 provides the high-speed execution workspace that a processor loads code into during startup, and its 2GB capacity hosts large operating-system images in RAM. As logging memory, the density accommodates embedded event recorders, diagnostic data buffers, and industrial logging controllers that must retain high-rate data streams temporarily. The 6400 Mbps/pin rate ensures that logging pipelines never bottleneck the host processor, and deep-sleep LPDDR5 modes minimize standby drain in always-on recorders. Design consideration: volatile LPDDR5 loses contents at power removal, so logging architectures pair it with nonvolatile storage for persistence.
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Mobile and Consumer High-Performance Devices
Although positioned as automotive, the H58G46AK6PX033's LPDDR5-6400 x16 architecture matches the memory needs of flagship mobile devices and consumer electronics, which is consistent with distributor descriptions citing mobile devices, consumer electronics, and computing systems as target applications. The 0.5V VDDQ rail and LPDDR5 deep-sleep states directly extend battery life in smartphones, tablets, and premium consumer devices, while 6400 Mbps/pin keeps the SoC fed during gaming and imaging bursts. The 315-ball FBGA supports the stacked-package (PoP-adjacent) and tight board layouts typical of handsets. Performance consideration: consumer BOM costs are aggressive, so buyers should compare the automotive premium of this part against standard mobile LPDDR5 alternatives when automotive qualification is not required.
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Telematics and Vehicle Networking Gateways
Telematics control units and vehicle gateways process connectivity stacks (4G/5G, V2X, Ethernet backbones) plus OTA update staging, workloads that the H58G46AK6PX033 handles with its 6400 Mbps/pin bandwidth and 2GB-per-device capacity. Automotive qualification of the part matches the extended lifecycle and quality requirements of vehicle electronics, per SK Hynix's automotive product positioning. In the platform, the LPDDR5 provides working memory for the connectivity SoC and buffering for firmware-over-the-air image validation before commit to flash. The 315-ball FBGA fits the compact PCBs typical of TCU modules. Design consideration: OTA staging paths benefit from RAM-based CRC verification, and designers should size memory for the largest expected update image with margin.
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추천 제품 요약
엔지니어링 참조 데이터: H58G46AK6PX033 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | H58G46AK6PX033E | H58G46BK6PX033 | H58G46AK7PX033 |
|---|---|---|---|---|
| Package | 315-ball FBGA | 315-ball FBGA - same | 315-ball FBGA - same | 315-ball FBGA - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Density | 16 Gb (2 GB) | 16 Gb (2 GB) | 16 Gb (2 GB) | 16 Gb (2 GB) |
| Organization | x16 | x16 | x16 | x16 |
| Supply Rails | 1.8 V / 1.05 V / 0.5 V | 1.8 V / 1.05 V / 0.5 V | 1.8 V / 1.05 V / 0.5 V | 1.8 V / 1.05 V / 0.5 V |
주요 차별점
- Automotive qualification in a mobile-class LPDDR5 die (vs Standard mobile LPDDR5 SKUs)
- 6400 Mbps/pin bandwidth (vs LPDDR4X alternatives)
- 16Gb single-die density (vs Lower-density LPDDR5 SKUs)
설계 노트
At 6400 Mbps/pin, LPDDR5 signal integrity is the dominant design risk. Route CK and WCK as tightly coupled differential pairs, length-match all DQ/DM/DQS traces within the controller's per-byte skew budget, and maintain continuous reference planes under every high-speed bus. Avoid stubs; escape the inner FBGA balls with via-in-pad. Run read/write training at the maximum intended operating temperature, not just room temperature, because trace delay and eye margins shift with temperature. Consult the SK Hynix LPDDR5 system design guide for target impedances and skew limits.
The H58G46AK6PX033 uses three supply rails: 1.8V, 1.05V, and 0.5V (VDDQ). Implement a power tree with proper sequencing per the manufacturer datasheet, and include VDDQ termination regulation as required by the LPDDR5 specification. Dynamic frequency scaling means rail current varies widely between idle deep-sleep and full 6400 Mbps traffic; size DC-DC converters for peak current but optimize light-load efficiency for battery-powered or always-on automotive applications.
Do not assume cross-brand LPDDR5 interchangeability. Micron's own DRAM cross-reference tool states its equivalences are based on competitor published data and are unverified; LPDDR5 ball maps differ across vendors, so any cross-brand substitution is a redesign requiring pinout comparison, controller retraining, and board requalification. Also confirm RoHS and temperature-grade documentation directly from SK Hynix environmental files rather than distributor summaries before committing an automotive BOM.
규정 준수 정보
Automotive product designation per SK Hynix datasheet overview; explicit RoHS/REACH/AEC-Q100 status not present in retrieved data and must be confirmed from official SK Hynix environmental documentation.