H58G56AK6PX032 - 32Gb LPDDR5-6400 Automotive DRAM | SK Hynix
부품 번호: H58G56AK6PX032 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.2 | $262.00 |
| 100 | $24.1 | $2,410.00 |
| 500 | $22.4 | $11,200.00 |
| 1,000 | $20.9 | $20,900.00 |
H58G56AK6PX032 개요
LPDDR5 (Low Power Double Data Rate 5) is the fifth generation of JEDEC-defined low-power DRAM, designed for battery-powered and thermally constrained systems such as smartphones, vehicles, and edge computing modules. Within the memory hierarchy, DRAM sits between non-volatile storage (NAND flash) and on-chip SRAM caches, providing high-bandwidth working memory for processors. LPDDR5 doubles effective data rate versus LPDDR4X by introducing WCK clocking, 16n/32n prefetch refinements, and per-bank refresh improvements.
Key features of the H58G56AK6PX032 include the 6400 Mbps/pin data rate, which yields up to 51.2 GB/s peak bandwidth on the x64 bus; the 32Gb density in a single package; an automotive-grade qualification level suitable for in-vehicle infotainment, ADAS and telematics platforms; and the compact 315-ball FBGA footprint that enables dense stacked or side-by-side memory arrangements next to the SoC.
Architecturally, the device uses SK Hynix advanced DRAM process technology with LPDDR5 dynamic voltage scaling across VDD2/VDD1/VDDQ rails, deep power-down and self-refresh modes to cut standby power, and link error-checking capabilities demanded by automotive safety workloads.
Typical applications include automotive infotainment head units, ADAS domain controllers, camera-surround computing modules, and high-bandwidth industrial edge platforms that require 4GB of low-power working memory.
When designing this device into a memory subsystem, pay close attention to LPDDR5 fly-by routing, VDDQ termination, and WCK signal integrity; PCB stackup and length matching are the dominant success factors at 6400 Mbps.
This page synthesizes verified distributor stock data, drop-in family alternatives, and practical design guidance not found in the manufacturer datasheet alone.
드롭인 대체품: H58G56AK6PX032 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: H58G56AK6PX032 (동일 폼 팩터 및 풋프린트) — 차이점: Memory Type, Organization, Density, Interface, Data Rate.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
H58G56AK6PX032N
✅ 드롭인✓ 재고 있음
$11.35 / 개
데이터시트 보기 →H58G46AK6PX033
✅ 드롭인✓ 재고 있음
$1 / 개
데이터시트 보기 →H58G46AK6PX033N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →H58G46AK6QX033
✅ 드롭인✓ 재고 있음
$9.75 / 개
데이터시트 보기 →H5CG46AGBDX015
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.95 / 개
데이터시트 보기 →H58G56AK6PX032 최대 정격 & 전기적 특성
| 메모리 유형 | LPDDR5 SDRAM |
| Density | 32Gb (4GB) |
| 메모리 구성 | 512M x 64 |
| 데이터 속도 | 6400 Mbps/pin |
| Bus Width | x16 (x64 per datasheet listing) |
| VDD2 Supply Voltage | 1.8 V |
| VDD1 Supply Voltage | 1.05 V |
| VDDQ Supply Voltage | 0.5 V |
| 패키지 | FBGA-315 |
| 실장 유형 | Surface Mount |
| Grade | Automotive |
| Applications | Automotive infotainment, ADAS, edge computing |
| 수명 주기 상태 | Active |
H58G56AK6PX032 fbga-315 핀 구성 가이드
H58G56AK6PX032(fbga-315 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: H58G56AK6PX032.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
H58G56AK6PX032 적합 용도: 6 애플리케이션s: Automotive ADAS Domain Controller, Automotive Infotainment Head Unit, Surround-View Camera Processing, Telematics and Connectivity Gateway, Industrial Edge AI Computing Module, Data Logging and Event Recorders.
Automotive ADAS Domain Controller
The H58G56AK6PX032's 6400 Mbps/pin LPDDR5 interface delivers approximately 51.2 GB/s of peak bandwidth on the x64 bus, which is the level demanded by modern ADAS perception stacks that must fuse surround-camera, radar, and lidar data in real time. Its 32Gb (4GB) capacity in one package provides the frame-buffer and neural-network scratch-pad memory required by sensor-fusion and object-detection workloads. The device is placed directly adjacent to the automotive SoC with short, length-matched fly-by routing to preserve signal integrity at speed. Unlike LPDDR4X, LPDDR5's WCK clocking architecture reduces clock-tree power, lowering total memory subsystem dissipation in thermally constrained engine-bay-adjacent enclosures.
추천
Automotive Infotainment Head Unit
In-vehicle infotainment platforms run multi-display clusters, navigation, and voice assistants concurrently, requiring 4GB-class working memory. The H58G56AK6PX032 supplies 32Gb of LPDDR5 at 6400 Mbps/pin, giving head-unit SoCs the bandwidth to drive multiple high-resolution displays while keeping response latency low. Its automotive-grade qualification addresses the extended temperature, vibration, and lifetime requirements of cabin electronics. The three-rail power architecture (1.8V VDD2, 1.05V VDD1, 0.5V VDDQ) allows the power tree to scale VDDQ dynamically, cutting standby draw when the vehicle is parked - a key factor for battery-drain compliance in always-connected vehicles.
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Surround-View Camera Processing
Surround-view parking and 360-degree camera systems must capture, stitch, and undistort four or more camera streams simultaneously. The H58G56AK6PX032's high data rate sustains the sustained write bandwidth of multiple concurrent video DMA streams, while its 4GB density holds multiple frames per camera plus the stitching workspace. Placed next to the camera-processing SoC, the FBGA-315 package keeps traces short, preserving eye margins at 6400 Mbps. LPDDR5's per-bank refresh reduces bus contention during isochronous video traffic, and deep power-down modes let the module meet the low quiescent draw demanded when the camera system is off.
추천
Telematics and Connectivity Gateway
Connected-vehicle gateways handle LTE/5G modems, V2X radios, and edge analytics, combining bursty network traffic with sustained data processing. The H58G56AK6PX032 provides 4GB of LPDDR5 working memory whose 6400 Mbps/pin rate absorbs modem bursts and TLS session buffering without stalling the gateway CPU. Automotive qualification makes it suitable for always-powered installations where the module must survive cold-crank and load-dump supply events through the host power design. The 0.5V VDDQ rail minimizes I/O power during sustained wireless transfers, and self-refresh mode retains session state through brief host sleeps, enabling fast resume for over-the-air update windows.
추천
Industrial Edge AI Computing Module
Industrial edge-AI modules for machine vision, predictive maintenance, and robotics inference need memory bandwidth comparable to automotive SoCs but in rugged fanless enclosures. The H58G56AK6PX032's 51.2 GB/s-class bandwidth feeds on-device CNN inference accelerators, while its LPDDR5 dynamic voltage scaling keeps module thermal budgets manageable without heatsinks or fans in sealed housings. Its FBGA-315 footprint supports dense memory placement beside the compute SoC on small SoM form factors. Designers should allocate PCB layers for length-matched LPDDR5 routing and use the manufacturer's layout guidelines; at 6400 Mbps, controlled-impedance stackup and reference-plane continuity are the primary determinants of pass/fail signal integrity.
추천
Data Logging and Event Recorders
Event data recorders and forensic vehicle loggers must buffer high-rate sensor streams in volatile memory before committing them to NAND storage. The H58G56AK6PX032's 32Gb capacity provides seconds of full-rate buffer headroom, absorbing NAND write-latency stalls without dropping samples, and its 6400 Mbps interface keeps the buffer drain time short so the logger is ready for the next event window. Automotive-grade construction suits recorders that must operate across the full vehicle temperature envelope and retain reliability for the vehicle lifetime. Deep power-down minimizes drain on the battery-backed supply rail when the recorder is in standby.
추천
추천 제품 요약
엔지니어링 참조 데이터: H58G56AK6PX032 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | H58G56AK6PX032N | H58G46AK6PX033 | H58G46AK6PX033N | H58G46AK6QX033 |
|---|---|---|---|---|---|
| Package | FBGA-315 | FBGA-315 - same | FBGA-315 - same | FBGA-315 - same | FBGA-315 - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Density | 32Gb (4GB) | 32Gb (4GB) | 16Gb (2GB) | 16Gb (2GB) | 16Gb (2GB) |
| Memory Type | LPDDR5 | LPDDR5 | LPDDR5 | LPDDR5 | LPDDR5 |
| Supply Rails | 1.8V / 1.05V / 0.5V | 1.8V / 1.05V / 0.5V | 1.8V / 1.05V / 0.5V (LPDDR5 standard) | 1.8V / 1.05V / 0.5V (LPDDR5 standard) | 1.8V / 1.05V / 0.5V (LPDDR5 standard) |
| Grade | Automotive | Automotive | Automotive | Automotive | Automotive |
주요 차별점
- Full 32Gb (4GB) density in a single package (vs H58G46AK6PX033)
- 6400 Mbps/pin automotive LPDDR5 (vs H58G46AK6QX033)
- Identical footprint to packing-code variant (vs H58G56AK6PX032N)
설계 노트
At 6400 Mbps/pin, LPDDR5 signal integrity dominates design success. Keep CA and DQ traces length-matched within the tolerance specified in the SK Hynix LPDDR5 design guide, route over continuous reference planes, and control single-ended impedance near 40 ohms for DQ. Minimize via transitions on WCK and DQS lines; each via adds impedance discontinuity. Simulate the full channel (SoC die, package, PCB) rather than PCB-only, and follow the SoC vendor's memory-training validation plan across temperature before releasing the layout.
LPDDR5 uses three rails: VDD2 1.8V, VDD1 1.05V, and VDDQ 0.5V. The VDDQ rail carries the highest transient currents during burst writes, so place a dedicated buck converter or LDO close to the ball with bulk capacitance sized per the datasheet and local high-frequency decoupling on every supply ball. Estimated: at 6400 Mbps with sustained traffic, VDDQ transient currents can reach amperes; verify with the DRAM current-profile model from SK Hynix and ensure the regulator's load-transient response keeps VDDQ within its tolerance window.
Reserve at least two internal routing layers for the LPDDR5 bus and place the H58G56AK6PX032 within approximately 10-15 mm of the SoC to minimize fly-by skew. Follow the package pin-map breakout pattern to avoid necking traces between balls. Use ground-stitch vias along bus routing return paths and avoid splitting the reference plane under the memory bus. For automotive platforms, add the manufacturer-recommended ESD protection on externally accessible lines and review the layout against the SoC vendor's LPDDR5 reference design before fabrication.
Do not assume cross-brand LPDDR5 compatibility: Micron MT53E-series parts match performance but use different FBGA ball counts, so the footprint must be redesigned. Also confirm the N-suffixed ordering code (H58G56AK6PX032N) is covered by your controller qualification and approved-vendor list before production substitution. Finally, obtain the official RoHS/material declarations from SK Hynix under NDA - distributor pages do not carry authoritative environmental data for automotive memory.
규정 준수 정보
Public distributor data does not state RoHS/REACH status. The device is marketed as automotive-grade per GlobalSpec listing. Obtain official material declarations from SK Hynix (IPC-1752A or equivalent) before release.
