H58G46AK6PX033 - 16Gb LPDDR5-6400 Automotive DRAM | SK Hynix
MPN: H58G46AK6PX033 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1 | $1.00 |
Drop-in alternatives for H58G46AK6PX033 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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H58G46AK6PX033E
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
H58G46BK6PX033
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
H58G46AK7PX033
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
H58G46AK6PX033 Maximum Ratings & Electrical Characteristics
| Memory Type | LPDDR5 SDRAM |
| Density | 16 Gb (2 GB) |
| Organization | x16 |
| Data Rate | 6400 Mbps/pin |
| Interface | LPDDR5 (JEDEC low-power DRAM interface) |
| Supply Voltage (VDD2) | 1.8 V |
| Supply Voltage (VDD1) | 1.05 V |
| Supply Voltage (VDDQ) | 0.5 V |
| Package | 315-ball FBGA |
| Mounting Type | Surface Mount |
| Application Grade | Automotive |
| Memory Category | DRAM (Dynamic Random Access Memory) |
| Application Domains | Data storage, firmware boot, embedded logging, industrial controllers, computing modules |
H58G46AK6PX033 315-ball fbga Pin Configuration Guide
Complete pinout information for H58G46AK6PX033 (315-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H58G46AK6PX033.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H58G46AK6PX033 is suitable for 6 applications: Automotive ADAS Domain Controllers, Automotive Infotainment and Cockpit Systems, Industrial Controllers and Edge Computing Modules, Firmware Boot and Embedded Data Logging, Mobile and Consumer High-Performance Devices, Telematics and Vehicle Networking Gateways.
Automotive ADAS Domain Controllers
The H58G46AK6PX033 fits ADAS domain controllers because its 6400 Mbps/pin data rate supplies the bandwidth that multi-camera sensor fusion and object-detection SoCs demand, while its automotive qualification addresses the reliability and traceability expectations of vehicle programs. In a typical topology the LPDDR5 is connected point-to-point to the ADAS SoC's LPDDR5 controller, with the 16Gb x16 organization providing 2GB per device and multiple devices stacked in bandwidth or capacity configurations. The 0.5V VDDQ domain keeps IO switching power low, which matters for thermal budgets in sealed enclosures. Performance consideration: signal integrity at 6400 Mbps requires strict length matching and impedance control on the CA and DQ buses, so layout investment is the main engineering cost.
Recommended
Automotive Infotainment and Cockpit Systems
Digital cockpit and infotainment units run rich HMI graphics, navigation, and audio processing concurrently, and the H58G46AK6PX033 supports these workloads with 6400 Mbps/pin bandwidth and 2GB density per device in a compact 315-ball FBGA. Its automotive grade aligns with the extended temperature and quality expectations of in-vehicle platforms, per the SK Hynix product positioning for automotive memory. The device sits on the LPDDR5 bus of the cockpit SoC, providing frame-buffer and application memory with dynamic frequency scaling to save power during idle HMI periods. Performance consideration: the three-rail power tree (1.8V/1.05V/0.5V) must be sequenced correctly, and the SoC's training routines must re-run at every cold boot to guarantee timing margin.
Recommended
Industrial Controllers and Edge Computing Modules
Industrial controllers and compute modules benefit from the H58G46AK6PX033's combination of 16Gb density, 6400 Mbps/pin bandwidth, and the low power that LPDDR5 delivers versus DDR4 at equivalent performance, per the SK Hynix overview that names industrial controllers and computing modules among its target uses. The x16 organization simplifies bus design for compact SOM (system-on-module) form factors, and the FBGA package keeps board area small. In these designs the LPDDR5 connects point-to-point to an edge-AI processor or MCU-class SoC with an LPDDR5 memory controller. Performance consideration: industrial thermal environments may derate the achievable data rate, so designers should validate training margins at maximum ambient temperature rather than relying on room-temperature lab results.
Recommended
Firmware Boot and Embedded Data Logging
The SK Hynix product description explicitly lists firmware boot and embedded logging among the roles for the H58G46AK6PX033. As boot memory support, the LPDDR5 provides the high-speed execution workspace that a processor loads code into during startup, and its 2GB capacity hosts large operating-system images in RAM. As logging memory, the density accommodates embedded event recorders, diagnostic data buffers, and industrial logging controllers that must retain high-rate data streams temporarily. The 6400 Mbps/pin rate ensures that logging pipelines never bottleneck the host processor, and deep-sleep LPDDR5 modes minimize standby drain in always-on recorders. Design consideration: volatile LPDDR5 loses contents at power removal, so logging architectures pair it with nonvolatile storage for persistence.
Recommended
Mobile and Consumer High-Performance Devices
Although positioned as automotive, the H58G46AK6PX033's LPDDR5-6400 x16 architecture matches the memory needs of flagship mobile devices and consumer electronics, which is consistent with distributor descriptions citing mobile devices, consumer electronics, and computing systems as target applications. The 0.5V VDDQ rail and LPDDR5 deep-sleep states directly extend battery life in smartphones, tablets, and premium consumer devices, while 6400 Mbps/pin keeps the SoC fed during gaming and imaging bursts. The 315-ball FBGA supports the stacked-package (PoP-adjacent) and tight board layouts typical of handsets. Performance consideration: consumer BOM costs are aggressive, so buyers should compare the automotive premium of this part against standard mobile LPDDR5 alternatives when automotive qualification is not required.
Recommended
Telematics and Vehicle Networking Gateways
Telematics control units and vehicle gateways process connectivity stacks (4G/5G, V2X, Ethernet backbones) plus OTA update staging, workloads that the H58G46AK6PX033 handles with its 6400 Mbps/pin bandwidth and 2GB-per-device capacity. Automotive qualification of the part matches the extended lifecycle and quality requirements of vehicle electronics, per SK Hynix's automotive product positioning. In the platform, the LPDDR5 provides working memory for the connectivity SoC and buffering for firmware-over-the-air image validation before commit to flash. The 315-ball FBGA fits the compact PCBs typical of TCU modules. Design consideration: OTA staging paths benefit from RAM-based CRC verification, and designers should size memory for the largest expected update image with margin.
Recommended
Recommended Products Summary
Engineering reference data for H58G46AK6PX033 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H58G46AK6PX033E | H58G46BK6PX033 | H58G46AK7PX033 |
|---|---|---|---|---|
| Package | 315-ball FBGA | 315-ball FBGA - same | 315-ball FBGA - same | 315-ball FBGA - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Density | 16 Gb (2 GB) | 16 Gb (2 GB) | 16 Gb (2 GB) | 16 Gb (2 GB) |
| Data Rate | 6400 Mbps/pin | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Organization | x16 | x16 | x16 | x16 |
| Supply Rails | 1.8 V / 1.05 V / 0.5 V | 1.8 V / 1.05 V / 0.5 V | 1.8 V / 1.05 V / 0.5 V | 1.8 V / 1.05 V / 0.5 V |
| Application Grade | Automotive | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Lifecycle Status | Active | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Automotive qualification in a mobile-class LPDDR5 die (vs Standard mobile LPDDR5 SKUs)
- 6400 Mbps/pin bandwidth (vs LPDDR4X alternatives)
- 16Gb single-die density (vs Lower-density LPDDR5 SKUs)
Design Notes
At 6400 Mbps/pin, LPDDR5 signal integrity is the dominant design risk. Route CK and WCK as tightly coupled differential pairs, length-match all DQ/DM/DQS traces within the controller's per-byte skew budget, and maintain continuous reference planes under every high-speed bus. Avoid stubs; escape the inner FBGA balls with via-in-pad. Run read/write training at the maximum intended operating temperature, not just room temperature, because trace delay and eye margins shift with temperature. Consult the SK Hynix LPDDR5 system design guide for target impedances and skew limits.
The H58G46AK6PX033 uses three supply rails: 1.8V, 1.05V, and 0.5V (VDDQ). Implement a power tree with proper sequencing per the manufacturer datasheet, and include VDDQ termination regulation as required by the LPDDR5 specification. Dynamic frequency scaling means rail current varies widely between idle deep-sleep and full 6400 Mbps traffic; size DC-DC converters for peak current but optimize light-load efficiency for battery-powered or always-on automotive applications.
Do not assume cross-brand LPDDR5 interchangeability. Micron's own DRAM cross-reference tool states its equivalences are based on competitor published data and are unverified; LPDDR5 ball maps differ across vendors, so any cross-brand substitution is a redesign requiring pinout comparison, controller retraining, and board requalification. Also confirm RoHS and temperature-grade documentation directly from SK Hynix environmental files rather than distributor summaries before committing an automotive BOM.
Compliance Information
Automotive product designation per SK Hynix datasheet overview; explicit RoHS/REACH/AEC-Q100 status not present in retrieved data and must be confirmed from official SK Hynix environmental documentation.
