H5CG28AGBDX022 - 16Gb DDR5 SDRAM FBGA | SK hynix | Servers & PCs
부품 번호: H5CG28AGBDX022 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1 | $1.00 |
H5CG28AGBDX022 개요
DDR5 SDRAM (Double Data Rate 5 synchronous dynamic random-access memory) is the fifth generation of the DDR JEDEC DRAM family used as main memory in servers, workstations, desktop PCs, laptops, and networking equipment. In the memory hierarchy, a DDR5 SDRAM sits at the main-system-memory level, below CPU caches and above storage. Compared with DDR4, DDR5 doubles the prefetch architecture, moves power management onto the DIMM module, and increases bank-group counts for higher effective bandwidth.
Key features of the H5CG28 series include high per-die density of 16 Gb, which allows single-rank and dual-rank modules built from fewer devices; on-die ECC that improves data reliability without host overhead; and DDR5-speed-class operation with burst lengths of 16 and 32. The device communicates over a standard DDR5 interface and is designed for use in UDIMM, RDIMM, and soldered-down memory configurations.
Architecturally, the device is organized internally into banks and bank groups with independent row activation, and integrates on-die termination, DFE-based receiver equalization, and a mode-register set that configures timing and electrical parameters per JEDEC DDR5 conventions.
Typical applications include server main memory, desktop and notebook PCs, workstations, AI acceleration platforms, networking appliances, and industrial computing systems where DDR5 bandwidth and power efficiency are required.
Designers should verify the exact speed grade, density organization, and ball-map details against the official SK hynix datasheet and part-number decoder available on the SK hynix product support portal, since DDR5 ordering-code fields encode speed, package, and temperature options that vary within the family.
This page synthesizes family-level DDR5 engineering context, drop-in alternative guidance, and practical design notes not found in the raw distributor listings.
드롭인 대체품: H5CG28AGBDX022 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: H5CG28AGBDX022 (동일 폼 팩터 및 풋프린트) — 차이점: Interface, ECC, Burst Length, Density, Interface Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
H5CG28AGBDX019
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
H5CG28AGBDX021
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
H5CG48AGBDX018
✅ 드롭인✓ 재고 있음
$63.9844 / 개
데이터시트 보기 →H5CG46AGBDX015
✅ 드롭인✓ 재고 있음
$4.95 / 개
데이터시트 보기 →H5CG46AGBDX017N
✅ 드롭인✓ 재고 있음
$91.73 / 개
데이터시트 보기 →H5CG28AGBDX022 최대 정격 & 전기적 특성
| Manufacturer | SK hynix |
| Product Family | H5CG2 series (DDR5 SDRAM) |
| 메모리 유형 | DDR5 SDRAM |
| Supply Voltage (VDD) | 1.1 V (DDR5 class nominal) |
| 실장 유형 | Surface Mount (BGA) |
| ECC | On-die ECC (DDR5 feature) |
| Burst Length | 16 / 32 (DDR5 feature) |
| 인터페이스 | DDR5 synchronous interface |
H5CG28AGBDX022 standard 핀 구성 가이드
H5CG28AGBDX022(standard 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: H5CG28AGBDX022.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
H5CG28AGBDX022 적합 용도: 6 애플리케이션s: Server Main Memory, Desktop and Workstation PCs, Notebook and Mobile Computing, Networking and Telecom Equipment, AI and Accelerator Platforms, Industrial Computing and Edge Systems.
Server Main Memory
The H5CG28AGBDX022 fits server main-memory DIMM designs where DDR5 bandwidth and per-bit power efficiency matter. According to SK hynix product documentation, H5CG-series DDR5 components are targeted at PC/server memory. In a typical server RDIMM, the device's 16Gb-class die density and on-die ECC allow high module capacities while keeping device count manageable; the approximately 1.1 V VDD rail reduces thermal load compared with DDR4's 1.2 V. Performance considerations include matching the die's speed grade to the CPU memory controller's supported MT/s class and configuring the DDR5 PMIC sequencing correctly. The burst-length-16/32 architecture raises effective bandwidth for virtualization and database workloads where memory throughput is the bottleneck.
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Desktop and Workstation PCs
Desktop platforms and workstations adopting the DDR5 platform generation use soldered-down or UDIMM-based DDR5 components such as the H5CG28AGBDX022. The device's DDR5 architecture - on-die ECC, higher bank-group counts, and 1.1 V operation - gives consumer boards more bandwidth per watt and improved data reliability without host-side ECC overhead. In typical UDIMM layouts, eight to sixteen of these components populate a dual-channel module; signal-integrity budgets benefit from the DDR5 DFE-based receivers on strobes. Designers should verify that the platform's memory reference code supports 16Gb dies and this part's specific speed grade before tape-out, and should follow the CPU vendor's DDR5 routing guideline for matched-length DQ/DQS traces.
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Notebook and Mobile Computing
Thin notebooks and mini-PCs increasingly use soldered-down LPDDR5 or non-soldered DDR5; where standard DDR5 SODIMM or on-board memory is specified, the H5CG28AGBDX022 provides 16Gb-class density that lets compact designs reach 8 GB to 16 GB per channel with fewer components. The approximately 1.1 V DDR5 supply and DDR5's on-DIMM power management architecture improve battery runtime versus DDR4 implementations. Thermal considerations are important in conduction-cooled enclosures: DDR5 chips in FBGA packages rely on the PCB's internal planes as the primary heat-spreading path, so designers should ensure adequate copper pour and verify junction temperatures at worst-case memory stress workloads such as sustained memcpy and AI inference.
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Networking and Telecom Equipment
Routers, switches, and 5G network appliances require large, high-bandwidth buffering memory; DDR5 components like the H5CG28AGBDX022 serve as packet-buffer and control-plane memory attached to network processors and NPUs. The DDR5 architecture's bank-group parallelism sustains the random-access patterns typical of queuing engines, and on-die ECC protects against soft errors in always-on telecom infrastructure. Industrial and telecom deployments should select the appropriate extended-temperature ordering variant and validate the speed grade against the network processor's supported DDR5 interface. Buffer-memory sizing typically aggregates multiple 16Gb-class dies across x72 ECC-protected interfaces to reach the required gigabyte-class buffering capacity.
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AI and Accelerator Platforms
AI training and inference cards and edge-AI gateways pair accelerator SoCs with DDR5 host or weight memory; the H5CG28AGBDX022's 16Gb-class density and DDR5 bandwidth suit streaming workloads with predictable access patterns. In accelerator designs, memory controllers often run DDR5 interfaces at the top of the die's supported speed class, so signal-integrity margin - including DFE equalization settings and termination programming - must be tuned per the memory controller vendor's characterization data. Power design matters: at approximately 1.1 V VDD, aggregate current draw across many devices can reach tens of amperes, requiring multiphase DDR5 PMIC solutions and careful rail decoupling near each DRAM supply ball group.
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Industrial Computing and Edge Systems
Industrial PCs, machine-vision controllers, and edge servers built on DDR5 platforms use DDR5 SDRAM components such as the H5CG28AGBDX022 for long-lifecycle main memory. DDR5's on-die ECC improves robustness against soft errors in electrically noisy factory environments, and the reduced operating voltage lowers enclosure thermal load for fanless designs. Industrial integrators should confirm the temperature-range ordering code (commercial versus extended) with SK hynix documentation, verify long-term availability for the product's service life given DRAM market EOL cycles, and design SPD-compatible memory down configurations that can tolerate a second-source DDR5 die validated by the CPU vendor's memory reference list.
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추천 제품 요약
엔지니어링 참조 데이터: H5CG28AGBDX022 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | H5CG28AGBDX019 | H5CG48AGBDX018 | H5CG46AGBDX015 | H5CG46AGBDX017N |
|---|---|---|---|---|---|
| Package | FBGA (SK hynix DDR5) | FBGA - same family | FBGA - same family | FBGA - same family | FBGA - same family |
| Brand | SK hynix | SK hynix | SK hynix | SK hynix | SK hynix |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM |
| Density Class | 16Gb class (H5CG2 series) | 16Gb class (H5CG2 series) | Higher (H5CG4 series) | Higher (H5CG4 series) | Higher (H5CG4 series) |
| On-die ECC | Yes (DDR5 feature) | Yes | Yes | Yes | Yes |
| Supply Voltage | 1.1 V (DDR5 nominal) | 1.1 V (DDR5 nominal) | 1.1 V (DDR5 nominal) | 1.1 V (DDR5 nominal) | 1.1 V (DDR5 nominal) |
주요 차별점
- 16Gb-class DDR5 die density (vs H5CG48AGBDX018)
- DDR5 generation with on-die ECC (vs H5ANAG-series DDR5 parts)
- SK hynix direct sourcing (vs Cross-brand equivalents (Micron/Samsung DDR5))
설계 노트
DDR5 SDRAM operates from a nominal 1.1 V VDD rail. On DDR5 DIMMs, power management has moved from the motherboard to the module, so the DDR5 PMIC (5 V to 1.1 V step-down) must be sequenced with the DRAM reset and alert flags per the JEDEC DDR5 module specification referenced in the SK hynix documentation. Estimated: at 16Gb-class DDR5 devices operating at full bandwidth, per-device current is typically in the hundreds of milliampere range; multiply by device count and add 20-30% margin when sizing the PMIC and its input rail.
DDR5 interfaces at multi-gigabit-per-second data rates require impedance-controlled routing with matched lengths across DQ/DQS/DM groups and careful reference-plane continuity. The H5CG-series DDR5 devices integrate DFE-based receivers and on-die termination; correct mode-register programming of termination and equalization is essential to passing eye-mask tests at the top speed grade. Follow the CPU or memory-controller vendor's DDR5 layout guideline in conjunction with the SK hynix datasheet, and simulate fly-by address/command topologies for multi-device modules before fabrication.
DDR5 ordering codes encode density, organization, speed grade, and package options - do not assume two H5CG-prefix parts with different suffixes are interchangeable. Decode both part numbers using the SK hynix part-number decoder (available on the SK hynix Downloads portal) before substitution, and confirm the memory controller's supported die density and speed class. Additionally, verify SPD data compatibility at the module level when swapping dies on DIMM designs, since SPD contents differ between density variants.
FBGA DRAM packages dissipate heat primarily through the PCB. Estimated: for sustained memory-bandwidth stress workloads (memcpy, AI inference), allocate at least one continuous ground/power plane pair under the memory array and consider thermal vias under high-activity devices. Verify junction temperature against the datasheet maximum under worst-case ambient and bandwidth conditions, particularly in fanless industrial enclosures where conduction cooling is the only path.
규정 준수 정보
No explicit compliance statements for H5CG28AGBDX022 were present in the verified web data. Obtain RoHS/REACH declarations from SK hynix's support portal or authorized distributor.
