H5TC4G63AFR-G7A - 4Gb DDR3L SDRAM 1.35V | SK Hynix
부품 번호: H5TC4G63AFR-G7A ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $7.2 | $720.00 |
| 500 | $6.8 | $3,400.00 |
| 1,000 | $6.5 | $6,500.00 |
H5TC4G63AFR-G7A 개요
DDR3L (Double Data Rate 3 Low Voltage) SDRAM is a type of synchronous dynamic random-access memory that operates at 1.35V, reducing power consumption by about 20% compared to standard DDR3 (1.5V). It is part of the DDR3 SDRAM family, which uses double data rate signaling to transfer data on both edges of the clock, achieving high bandwidth. DDR3L is commonly used in mobile devices, embedded systems, and servers where power efficiency is critical.
Key features include a 4Gb density, 256M x 16 organization, 1.35V power supply, and a data rate of 1600 Mbps (PC3-12800) as indicated by the -G7A speed grade. The device supports on-die termination (ODT), programmable CAS latency, and burst lengths of 8 and 4. It operates over a temperature range of 0°C to 95°C (case temperature) and is available in a 96-ball FBGA package.
The H5TC4G63AFR-G7A uses a CMOS process technology, ensuring high performance and low power. It features auto refresh and self refresh modes, with a refresh period of 7.8us at 85°C. The device includes a mode register for programming various operating parameters, such as CAS latency and burst length. The 96-ball FBGA package provides excellent thermal and electrical performance, making it suitable for space-constrained designs.
Typical applications include laptops, ultrabooks, embedded systems, networking equipment, and industrial computing. The low voltage operation makes it ideal for battery-powered devices where power consumption is a concern. The high bandwidth supports memory-intensive applications such as video processing and gaming.
When designing with this device, ensure proper decoupling capacitors are placed near the power pins to minimize noise. The VDD and VDDQ should be supplied with 1.35V, and the reference voltage VREF should be set to 0.675V. Follow the PCB layout guidelines in the datasheet to ensure signal integrity at high speeds.
드롭인 대체품: H5TC4G63AFR-G7A — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: H5TC4G63AFR-G7A (동일 폼 팩터 및 풋프린트) — 차이점: Package, Data Rate, Supply Voltage, Burst Length, CAS Latency.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
H5TC4G63AFR-PBR
✅ 드롭인✓ 재고 있음
$5.9091 / 개
데이터시트 보기 →H5TC4G63AFR-PBA
✅ 드롭인✓ 재고 있음
$3.9773 / 개
데이터시트 보기 →H5TC4G63CFR-PBA
✅ 드롭인✓ 재고 있음
$6.23 / 개
데이터시트 보기 →H5TC4G63MFR-PBA
✅ 드롭인✓ 재고 있음
$6.5 / 개
데이터시트 보기 →K4B4G1646D-BYK00
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$7.5 / 개
데이터시트 보기 →MT41K256M16HA-125
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6.3636 / 개
데이터시트 보기 →H5TC4G63AFR-G7A 최대 정격 & 전기적 특성
| 메모리 유형 | DDR3L SDRAM |
| Density | 4Gb |
| 메모리 구성 | 256M x 16 |
| 공급 전압 | 1.35V |
| 데이터 속도 | 1600 Mbps (PC3-12800) |
| 패키지 | 96-ball FBGA |
| 동작 온도 | 0°C to 95°C (case) |
| CAS 레이턴시 | Programmable (e.g., 11) |
| Burst Length | 8 and 4 |
| Refresh Period | 7.8us at 85°C |
| On-Die Termination | Supported |
| RoHS | Compliant |
| Lead-Free | Yes |
| 할로겐 프리 | Yes |
| Process Technology | CMOS |
H5TC4G63AFR-G7A 핀 구성
| 핀 A0-A15 | Address Inputs — Row/column address inputs |
| 핀 BA0-BA2 | Bank Address Inputs — Selects bank for read/write operations |
| 핀 DQ0-DQ15 | Data Input/Output — Bidirectional data bus |
| 핀 CK, /CK | Clock Inputs — Differential clock inputs |
| 핀 /CS | Chip Select — Active low chip select |
| 핀 /RAS | Row Address Strobe — Active low row address strobe |
| 핀 /CAS | Column Address Strobe — Active low column address strobe |
| 핀 /WE | Write Enable — Active low write enable |
| 핀 VDD | Power Supply — 1.35V power supply |
| 핀 VDDQ | DQ Power Supply — 1.35V DQ power supply |
| 핀 VSS | Ground — Ground |
| 핀 VSSQ | DQ Ground — DQ ground |
일반적인 애플리케이션
H5TC4G63AFR-G7A 적합 용도: 6 애플리케이션s: Laptops and Ultrabooks, Embedded Systems, Networking Equipment, Industrial Computing, Mobile Devices, Gaming Consoles.
Laptops and Ultrabooks
The H5TC4G63AFR-G7A is ideal for laptops and ultrabooks due to its low voltage operation (1.35V) and high density (4Gb). It provides high bandwidth and low power consumption, which is critical for battery-powered devices. The 96-ball FBGA package is compact and suitable for the thin PCB layouts in modern laptops. Its 1600 Mbps data rate supports fast boot times and smooth multitasking, while the low power consumption extends battery life. The device's on-die termination and programmable CAS latency allow for optimized signal integrity in the tight spaces of a laptop motherboard.
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Embedded Systems
The H5TC4G63AFR-G7A is well-suited for embedded systems such as networking equipment, industrial controllers, and single-board computers. Its 1.35V operation reduces power consumption, making it ideal for always-on devices. The 4Gb density provides ample memory for complex applications, and the 1600 Mbps data rate ensures fast data processing. The 96-ball FBGA package is robust and reliable for industrial environments. The device's support for on-die termination and programmable CAS latency allows for flexible system design, and its wide operating temperature range (0°C to 95°C) ensures reliable operation in harsh conditions.
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Networking Equipment
The H5TC4G63AFR-G7A is used in networking equipment such as routers, switches, and firewalls. Its high bandwidth (1600 Mbps) supports fast packet processing and data throughput. The low voltage operation (1.35V) reduces power consumption, which is important for devices that run 24/7. The 4Gb density provides sufficient memory for routing tables and buffering. The 96-ball FBGA package is suitable for the compact PCBs in networking hardware. The device's on-die termination and programmable CAS latency help maintain signal integrity at high speeds, ensuring reliable data transmission.
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Industrial Computing
The H5TC4G63AFR-G7A is suitable for industrial computing applications such as HMI panels, PLCs, and industrial PCs. Its wide operating temperature range (0°C to 95°C) ensures reliable operation in factory environments. The low voltage operation (1.35V) reduces heat generation, which is critical in sealed enclosures. The 4Gb density provides ample memory for industrial software, and the 1600 Mbps data rate supports real-time data processing. The 96-ball FBGA package is durable and resistant to vibration, making it ideal for industrial settings.
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Mobile Devices
The H5TC4G63AFR-G7A is used in mobile devices such as tablets and high-end smartphones. Its low voltage operation (1.35V) is essential for battery life, and the 4Gb density provides sufficient memory for multitasking and multimedia. The 1600 Mbps data rate supports smooth video playback and gaming. The 96-ball FBGA package is compact and thin, fitting into the slim profiles of modern mobile devices. The device's low power consumption also reduces heat, which is important for handheld devices. Its support for self-refresh mode helps save power when the device is idle.
추천
Gaming Consoles
The H5TC4G63AFR-G7A is used in gaming consoles and handheld gaming devices. Its high bandwidth (1600 Mbps) supports fast loading times and smooth graphics rendering. The 4Gb density provides ample memory for game data and textures. The low voltage operation (1.35V) reduces power consumption, which is important for portable gaming devices. The 96-ball FBGA package is compact and suitable for the tight spaces inside gaming hardware. The device's on-die termination and programmable CAS latency help maintain signal integrity at high speeds, ensuring stable performance during intense gaming sessions.
추천
추천 제품 요약
엔지니어링 참조 데이터: H5TC4G63AFR-G7A — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | H5TC4G63AFR-PBR | H5TC4G63AFR-PBA | H5TC4G63CFR-PBA | H5TC4G63MFR-PBA | K4B4G1646D-BYK0 | MT41K256M16HA-125 |
|---|---|---|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | Samsung | Micron |
| Density | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | 1600 Mbps | 1066 Mbps | 1066 Mbps | 1066 Mbps | 1066 Mbps | 1600 Mbps | 1600 Mbps |
| Operating Temperature | 0°C to 95°C | 0°C to 95°C | 0°C to 95°C | 0°C to 95°C | 0°C to 95°C | 0°C to 95°C | 0°C to 95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
주요 차별점
- Higher data rate (1600 Mbps) compared to PBA/PBR variants (vs H5TC4G63AFR-PBA)
- Same package and pinout as other SK Hynix DDR3L variants (vs H5TC4G63CFR-PBA)
- Cross-brand compatibility with Samsung and Micron DDR3L (vs K4B4G1646D-BYK0)
설계 노트
Ensure VDD and VDDQ are supplied with 1.35V and VREF is set to 0.675V. Use low-impedance decoupling capacitors (e.g., 0.1uF and 1uF) placed close to the VDD and VDDQ pins to minimize power supply noise. The low voltage operation reduces power consumption, but proper decoupling is essential for stable operation at high speeds.
Follow the PCB layout guidelines in the SK Hynix datasheet to ensure signal integrity at 1600 Mbps. Keep the data and address traces matched in length and impedance (typically 50 ohms). Use ground planes to provide a low-inductance return path. Place the device close to the memory controller to minimize trace lengths.
The H5TC4G63AFR-G7A operates over a temperature range of 0°C to 95°C (case temperature). Ensure adequate airflow or heatsinking in high-power applications to keep the case temperature within limits. The 96-ball FBGA package has a thermal resistance that should be considered in the design. Monitor the temperature in industrial environments to prevent overheating.
규정 준수 정보
Lead-free and halogen-free, RoHS compliant per SK Hynix datasheet. REACH and conflict minerals status not specified in the provided data.
