H5CG48AGBDX014N - SK Hynix DDR5 16Gb DRAM Chip
부품 번호: H5CG48AGBDX014N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $87.42 | $87.42 |
| 10 | $83.05 | $830.50 |
| 100 | $78.68 | $7,868.00 |
| 500 | $74.3 | $37,150.00 |
| 1,000 | $70 | $70,000.00 |
H5CG48AGBDX014N 개요
DDR5 SDRAM is the fifth generation of Double Data Rate memory defined by JEDEC, and it is the dominant system-memory technology hierarchy path: DRAM -> DDR SDRAM -> DDR5 SDRAM -> main memory subsystem. Compared with DDR4, DDR5 lowers the per-channel bit width to 16 bits with two independent 8-bit sub-channels, doubles the bank groups, and moves the power-management IC (PMIC) onto the module rather than the CPU. On-die ECC (ODT-driven decision-feedback equalization and DFE receivers) improves signal integrity at high data rates.
Key features of the H5CG family include 16 Gbit density per component (2G x 8 organization), high-speed DDR5 signaling with on-die termination and command/address training, low operating voltage consistent with the DDR5 1.1 V class, and the industry-standard 78-ball FBGA footprint that keeps PCB land patterns interchangeable across speed-grade and die-revision siblings within the same package family.
Architecturally, the A-die generation H5CG48AGB parts implement DDR5 bank-group interleaving and per-sub-channel operation, enabling the memory controller to issue commands to two sub-channels independently. This raises effective bandwidth and reduces command conflicts in server, desktop, and embedded hosts. The x8 organization supports 8-bit ECC-protected single-rank or dual-rank module topologies.
Typical applications include server and workstation main memory, desktop DIMMs, embedded computing and industrial controller boards, FPGA-based compute and prototyping platforms, and networking line cards where high bandwidth per watt is required.
Design considerations: DDR5 routing requires length-matched DQ/DQS/CA groups, on-die termination tuning, and VDDQ/VDDCA rail sequencing; verify the exact speed grade suffix (014 vs 018) against your memory controller's supported data rate before BOM substitution.
This page synthesizes distributor pricing, cross-reference guidance, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: H5CG48AGBDX014N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: H5CG48AGBDX014N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Density, Data Rate, Interface, Organization.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
H5CG48AGBDX014
✅ 드롭인✓ 재고 있음
$86 / 개
데이터시트 보기 →H5CG48AGBDX018N
✅ 드롭인✓ 재고 있음
$87.42 / 개
데이터시트 보기 →H5CG48AGBDX018
✅ 드롭인✓ 재고 있음
$63.9844 / 개
데이터시트 보기 →H5CG48MEBDX014N
✅ 드롭인✓ 재고 있음
$41.68 / 개
데이터시트 보기 →H5CG48AGBDX014N 최대 정격 & 전기적 특성
| Manufacturer | SK Hynix |
| Product Type | DDR5 SDRAM |
| Density | 16 Gb (2G x 8) |
| 메모리 구성 | x8 (2G x 8) |
| Memory Family | DDR5 (H5CG A-die generation) |
| 패키지 | 78-ball FBGA |
| 실장 유형 | Surface Mount |
| 인터페이스 | DDR5, 2 independent 8-bit sub-channels |
| ECC | On-die ECC (ODE) |
| On-Die Termination | Yes (ODT) |
| Bank Groups | 8 (DDR5 architecture) |
| RoHS 상태 | unknown |
| 수명 주기 상태 | Active |
H5CG48AGBDX014N 78-ball fbga 핀 구성 가이드
H5CG48AGBDX014N(78-ball fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: H5CG48AGBDX014N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
H5CG48AGBDX014N 적합 용도: 6 애플리케이션s: Server Main Memory (RDIMM/LRDIMM), Desktop DDR5 UDIMM, Embedded Computing and Industrial Controllers, FPGA-Based Compute and Prototyping Platforms, Networking and Communication Line Cards, Mobile-Adjacent Consumer and Client Devices.
Server Main Memory (RDIMM/LRDIMM)
DDR5 16Gb x8 components like the SK Hynix H5CG48AGBDX014N are the fundamental density building blocks of registered and load-reduced DIMMs for data center servers. The 2G x 8 organization allows 16 chips to populate a 16 GB rank at 64 data bits plus 8 ECC bits, and the DDR5 sub-channel architecture doubles effective concurrent command streams versus DDR4. On-die ECC (ODE) adds an internal correction layer that reduces uncorrected-bit risk across large fleet deployments. Placed on a module behind an SPD hub and PMIC (e.g., a RA88 series PMIC on RDIMMs), the chip runs at the controller-trained data rate; for the 018N sibling that reaches 5600 Mbps, delivering roughly 44.8 GB/s per 64-bit channel. Design trade-off: higher data rates demand stricter PCB length matching and DFE training support in the host CPU memory controller.
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Desktop DDR5 UDIMM
Consumer and workstation platforms based on Intel Core 12th-gen-and-later or AMD Ryzen 7000-and-later memory controllers use x8 16Gb DDR5 components like the H5CG48AGBDX014N on unbuffered DIMMs. The 78-ball FBGA footprint keeps the same land pattern across A-die and M-die sourcing, allowing module makers to dual-source without PCB respin. The dual 8-bit sub-channels let a desktop controller service two threads with fewer command conflicts, improving average latency in gaming and content-creation workloads. With two of these chips per 32-bit sub-channel group, a standard 16 GB UDIMM is built from sixteen 16Gb components. XMP/EXPO overclock profiles above JEDEC speed bins require the faster 018 variants; the 014 bin is suited to standard JEDEC-profile provisioning where cost and availability take priority.
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Embedded Computing and Industrial Controllers
Solder-down DDR5 deployments in industrial PCs, edge AI gateways, and networking appliances mount the H5CG48AGBDX014N directly beside the processor or SoC. The x8 organization maps cleanly to 64-bit controllers with ECC, and DDR5's lower 1.1 V-class rail reduces memory subsystem power versus DDR4 at equivalent bandwidth. Industrial benefit comes from the identical 78-ball FBGA footprint across the A-die (AGB) and M-die (MEB) generations: a validated solder stencil, reflow profile, and fly-by CA routing survive die migration and allocation-driven second sourcing without hardware change. Design care is required for length-matched DQ/DQS fly-by topology and VDDQ/VDDCA decoupling (typically 0.1 uF per two balls plus bulk capacitance); confirm operating temperature range from the datasheet for extended-temperature industrial builds.
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FPGA-Based Compute and Prototyping Platforms
FPGA memory controllers supporting DDR5 use 16Gb x8 components such as the H5CG48AGBDX014N for validation boards and high-bandwidth acceleration cards. DDR5 calibration in modern FPGA hard memory controllers handles CA training, write leveling, and read DQS gate training automatically, and the 78-ball x8 footprint aligns with standard DDR4 x8 FPGA board layouts upgraded for DDR5 routing rules. The dual sub-channel interface can be driven independently, letting one FPGA implement two simple controllers or one dual-channel controller. Practical consideration: FPGA I/O banks must meet DDR5 VDDQ signaling; verify the speed bin (014 vs 5600 Mbps 018) against the FPGA soft/hard PHY timing closure, since the 014 bin relaxes timing budgets for slower PHY implementations. On-die ECC runs transparently without host intervention.
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Networking and Communication Line Cards
Routers, switches, and 5G infrastructure line cards use soldered DDR5 components like the H5CG48AGBDX014N for packet buffers, flow tables, and control-plane memory. The DDR5 sub-channel architecture provides two independent command streams, which suits the alternating read/write access patterns of packet buffering and reduces turnaround penalties versus DDR4 single-channel operation. x8 organization with on-die ECC protects long-lifetime flow state in carrier-grade systems. The standard 78-ball FBGA footprint permits board-level dual sourcing between the A-die H5CG48AGBDX014N and the pin-identical M-die H5CG48MEBDX014N, a documented mitigation for the DDR5 allocation cycles affecting network OEMs. Verify the 014 speed bin meets line-rate buffering bandwidth (e.g., 4800 MT/s class yields ~38.4 GB/s per 64-bit channel) against your pipeline budget.
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Mobile-Adjacent Consumer and Client Devices
Client computing, set-top, gaming, and smart-display platforms that adopt socketed or soldered DDR5 main memory use 16Gb x8 DRAM such as the H5CG48AGBDX014N where bandwidth per watt matters more than ultra-low standby power of LPDDR families. The DDR5 1.1 V-class operation and on-die termination reduce idle power, and the standard discrete-DDR5 footprint is compatible with the broad ecosystem of host memory controllers. For designs where the 018 sibling's 5600 Mbps is unnecessary, the 014 speed bin lowers qualification cost while keeping the same PCB footprint, giving product managers an upgrade path to faster bins without respin. Reference designs pair these components with DDR5-qualified PMICs and SPD hubs; confirm suffix-specific JEDEC timing tables from the official SK Hynix datasheet during bring-up.
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추천 제품 요약
엔지니어링 참조 데이터: H5CG48AGBDX014N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | H5CG48AGBDX014 | H5CG48AGBDX018N | H5CG48AGBDX018 | H5CG48MEBDX014N |
|---|---|---|---|---|---|
| Package | 78-ball FBGA | 78-ball FBGA - same | 78-ball FBGA - same | 78-ball FBGA - same | 78-ball FBGA - same (identical ballout per cross-ref guide) |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Density | 16 Gb (2G x 8) | 16 Gb (2G x 8) | 16 Gb (2G x 8) | 16 Gb (2G x 8) | 16 Gb (2G x 8) |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM |
| Die Generation | A-die (AGB) | A-die (AGB) | A-die (AGB) | A-die (AGB) | M-die (MEB) |
| Organization | x8 (2G x 8) | x8 (2G x 8) | x8 (2G x 8) | x8 (2G x 8) | x8 (2G x 8) |
| On-Die ECC | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Lower speed bin reduces cost while keeping identical footprint (vs H5CG48AGBDX018N)
- A-die generation with established ecosystem support (vs H5CG48MEBDX014N)
- Trade-off: not the fastest bin in the family (vs H5CG48AGBDX018N)
설계 노트
DDR5 routing at the H5CG48AGBDX014N speed class requires length-matched fly-by CA routing and tightly matched DQ/DQS groups per nibble. Maintain controlled impedance (40 ohm single-ended for DQ is a common starting point; follow your stackup tool). The dual 8-bit sub-channel architecture means CA and CK routing must serve both sub-channels; verify eye diagrams at the exact data rate bin (014 vs 5600 Mbps 018) with the host controller's DFE/equalization settings. Because the 78-ball FBGA footprint is shared across the A-die and M-die siblings, layout rules validated on one die carry to the other without change.
DDR5 moves the PMIC to the module or board, so plan a dedicated DDR5 PMIC (5 V in to 1.1 V VDD class rails for VDD, VDDQ, VDDCA) with proper sequencing relative to the host. Estimated: a 16Gb x8 DDR5 component draws on the order of 0.5-1 W under sustained traffic at the 4800-5600 Mbps class; budget decoupling of 0.1 uF ceramic per pair of power balls plus local bulk capacitance near the PMIC. These are engineering estimates, not datasheet figures - confirm IDD currents from the SK Hynix datasheet for your specific traffic model and junction temperature target.
The most common DDR5 sourcing pitfall is substituting across speed-grade suffixes without controller validation. H5CG48AGBDX018N (verified 5600 Mbps) and the 014 bin share the identical package and pinout, but a controller trained at the faster bin profile may fail training or violate timing on the slower part. Always re-run memory training and confirm the suffix-specific JEDEC timing table from the official datasheet. Second pitfall: 'N' vs non-N suffixes are packaging-region variants, not electrical variants - do not respin a BOM for the suffix alone; verify availability instead.
규정 준수 정보
Compliance data not explicitly stated in verified web data. Request SK Hynix Green Data sheet / compliance certificates with RFQ.