H5CG48MEBDX018 - DDR5 16Gb 4800Mbps DRAM | SK Hynix
부품 번호: H5CG48MEBDX018 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $52.1 | $52.10 |
| 10 | $49.5 | $495.00 |
| 100 | $46.9 | $4,690.00 |
| 500 | $44.55 | $22,275.00 |
| 1,000 | $42.32 | $42,320.00 |
H5CG48MEBDX018 개요
DDR5 SDRAM is the fifth generation of Double Data Rate synchronous dynamic random access memory, the dominant main-memory technology in servers, workstations, desktops, and embedded compute modules. Within the memory hierarchy, DDR5 sits above LPDDR (low-power variants for mobile) and GDDR (graphics variants), and is the standard JEDEC-defined DRAM interface for high-bandwidth compute systems.
Key features include the 16 Gbit density per die (2G x16 x 8 organization equivalent, 2G x8 bus), a 4800 Mbps data rate, and the DDR5 on-die ECC (ODECC) architecture that improves reliability versus DDR4. The 1.1V core supply reduces per-bit power consumption compared with the 1.2V DDR4 generation, while the on-PDIMM power management architecture moves PMIC functions off the DRAM die, improving signal integrity and efficiency.
Technically, the H5CG48MEBDX018 belongs to SK hynix DDR5 SDRAM family; part numbering indicates an M-die generation at the 4800 class speed grade with an 8-bit bus width. The DDR5 interface uses two independent 32-bit sub-channels per module, improving effective concurrency versus the single 64-bit channel of DDR4.
Typical applications include PC and workstation DIMMs/Ultra-DIMMs, embedded compute and edge-AI modules, networking equipment line cards, and industrial systems requiring high-density main memory.
A key design consideration: DDR5 routing requires careful length matching of DQ/CA and DQS byte lanes, and on-die ECC must be enabled at the memory controller level.
This page synthesizes distributor pricing, drop-in alternatives within the SK hynix DDR5 family, and practical sourcing guidance not found in the manufacturer datasheet.
드롭인 대체품: H5CG48MEBDX018 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: H5CG48MEBDX018 (동일 폼 팩터 및 풋프린트) — 차이점: Interface, Data Rate, Package, Organization, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
H5CG48MEBDX014N
✅ 드롭인✓ 재고 있음
$41.68 / 개
데이터시트 보기 →H5CG48AGBDX018N
✅ 드롭인✓ 재고 있음
$87.42 / 개
데이터시트 보기 →H5CG48AGBDX014N
✅ 드롭인✓ 재고 있음
$70 / 개
데이터시트 보기 →H5CG48AGBDX018
✅ 드롭인✓ 재고 있음
$63.9844 / 개
데이터시트 보기 →H5CG46AGBDX017N
✅ 드롭인✓ 재고 있음
$91.73 / 개
데이터시트 보기 →H5CG46AGBDX015
✅ 드롭인✓ 재고 있음
$4.95 / 개
데이터시트 보기 →H5CG48MEBDX018 최대 정격 & 전기적 특성
| 메모리 유형 | DDR5 SDRAM |
| Density | 16 Gbit |
| 메모리 구성 | 2G x8 |
| 데이터 속도 | 4800 Mbps (MT/s) |
| 공급 전압 | 1.1 V |
| Bus Width | 8 bit |
| 인터페이스 | DDR5 SDRAM, double data rate |
| 패키지 | FCBGA, 78-ball (FBGA-78) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0 C to +85 C |
| On-Die ECC | Yes (DDR5 ODECC) |
| Generation / Die | M-die, 4800 class per SK hynix part numbering |
| Application Class | PC, server, embedded compute main memory |
| RoHS 상태 | Compliant (per JLCPCB listing) |
| Package Dimensions | Approx. 11 x 10 mm (per JLCPCB BGA-82 11x10 listing) |
H5CG48MEBDX018 approx. 11 x 10 mm (per jlcpcb bga-82 11x10 listing) 핀 구성 가이드
H5CG48MEBDX018(approx. 11 x 10 mm (per jlcpcb bga-82 11x10 listing) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: H5CG48MEBDX018.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
H5CG48MEBDX018 적합 용도: 6 애플리케이션s: PC and Workstation Main Memory, Server and Data Center Memory, Embedded Compute and Edge-AI Modules, Networking and Communication Equipment, Industrial Computing and Vision Systems, Consumer Electronics and Set-Top Platforms.
PC and Workstation Main Memory
The H5CG48MEBDX018 is a primary candidate for desktop and workstation DDR5 UDIMM/SODIMM main memory. Its 16Gb density in a 2G x8 organization allows module builders to reach 16 GB on a single-rank x8 module using sixteen components, and its 4800 Mbps data rate matches mainstream Intel and AMD DDR5 memory-controller speed bins. The 1.1V core supply lowers module power versus DDR4-3200 at comparable bandwidth, and on-die ECC reduces soft-error-driven crashes on the die itself. Components are soldered to module PCBs with fly-by CA routing and per-byte DQ termination per JEDEC DDR5 module rules; speed-bin validation against the platform QVL is the main performance consideration.
추천
Server and Data Center Memory
Server platforms benefit from the H5CG48MEBDX018's 16Gb density and DDR5-4800 bandwidth when populated in RDIMM or motherboard-down memory configurations. The 2G x8 organization is the standard building block for high-capacity channels, and DDR5 on-die ECC plus controller link ECC delivers the reliability levels data center operators require. With 1.1V operation, per-GB power drops versus DDR4, directly reducing data center cooling overhead. In server layouts, multiple ranks per channel stress DQ/DQS length matching and CA routing; following the DDR5 fly-topology rules and per-die ZQ calibration keeps eye diagrams open at 4800 Mbps across all populated slots.
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Embedded Compute and Edge-AI Modules
COM Express, SMARC, and custom edge-AI carrier designs increasingly adopt DDR5, and the H5CG48MEBDX018 provides 16Gb per component at 4800 Mbps - enough to reach 4-8 GB of soldered-down memory with only two to four packages. Its FCBGA package suits dense soldered-down (memory-on-package-adjacent) layouts typical of edge-AI accelerators, and the 1.1V rail integrates cleanly into embedded power trees. On-die ECC improves long-term reliability in always-on industrial edge deployments. Designers should enable controller ODECC support and validate DDR5 training firmware across the target temperature range of the enclosure.
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Networking and Communication Equipment
Switch, router, and 5G baseband line cards use DDR5 components like the H5CG48MEBDX018 for packet buffering, flow tables, and control-plane memory. The 4800 Mbps rate provides the read/write bandwidth required by high-throughput forwarding engines, while 16Gb density supports large flow and FIB tables in a compact BGA footprint. The 0C to +85C commercial range suits controlled telecom environments; equipment targeting harsh outdoor cabinets should verify ambient derating. Layout discipline around DQS strobe matching and clean VDDQ planes is essential to sustain 4800 Mbps traffic patterns under continuous load in multi-rank configurations.
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Industrial Computing and Vision Systems
Industrial PCs, machine-vision controllers, and test-and-measurement platforms use the H5CG48MEBDX018 where high memory bandwidth feeds image sensors and analytics pipelines. DDR5's dual sub-channel architecture and 4800 Mbps per-pin rate give frame-buffer headroom for multi-camera machine vision, and on-die ECC protects against bit errors during 24/7 operation. The RoHS-compliant FCBGA package supports standard reflow assembly used in industrial PCBA lines. Engineers should confirm enclosure temperature keeps the component within its 0C to +85C window, and select 1% or better termination networks per the DDR5 layout guidelines to maintain signal integrity.
추천
Consumer Electronics and Set-Top Platforms
High-end set-top boxes, smart displays, and gaming-adjacent consumer devices adopt DDR5 components such as the H5CG48MEBDX018 for main memory, benefiting from 16Gb single-die density that reduces component count versus stacked lower-density DDR4. The 4800 Mbps rate supports 4K video decode pipelines and responsive UI workloads, while 1.1V operation contributes to energy-star style power budgets. Consumer designs typically solder the FCBGA directly on the main PCB near the SoC; short, tightly length-matched DQ runs at this data rate are achievable even on cost-sensitive 6-layer boards, making this component practical for volume consumer platforms.
추천
추천 제품 요약
엔지니어링 참조 데이터: H5CG48MEBDX018 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | H5CG48MEBDX014N | H5CG48AGBDX018N | H5CG48AGBDX014N | H5CG46AGBDX017N |
|---|---|---|---|---|---|
| Package | FCBGA (FBGA-78), ~11 x 10 mm | FBGA-78 - same | FBGA-78 - same | FBGA-78 - same | FBGA-78 - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Density | 16 Gbit | 16 Gbit | 16 Gbit | 16 Gbit | 16 Gbit |
| Organization | 2G x8 | 2G x8 | 2G x8 | 2G x8 | 2G x8 |
| Data Rate | 4800 Mbps | 4800 Mbps | 5600 Mbps (down-bin usable at 4800) | 4800 Mbps | 4600/4800 class |
| Supply Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Die Generation | M-die (MEBD) | M-die (MEBD) | A-die (AGBD) | A-die (AGBD) | A-die (AGBD) |
| On-Die ECC | Yes (DDR5 ODECC) | Yes (DDR5 ODECC) | Yes (DDR5 ODECC) | Yes (DDR5 ODECC) | Yes (DDR5 ODECC) |
주요 차별점
- Newest M-die generation within SK hynix DDR5 family (vs H5CG48AGBDX018N)
- 16Gb density in single x8 die (vs Lower-density DDR4 components (e.g., 8Gb class))
- DDR5-4800 speed class with 1.1V operation (vs H5CG46AGBDX017N)
설계 노트
At 4800 Mbps, DDR5 DQ/DQS traces require tight intra-byte-lane length matching (typically within a few mils) and controlled-impedance routing (40 ohm for DQ, CA per the DDR5 layout guidelines). Use fly-by CA routing for multi-rank designs and per-die termination as specified in the SK hynix DDR5 component datasheet. Simulate eye diagrams at the corner speed bins before freezing the stack-up; DDR5's higher data rate makes marginal DDR4-era stack-ups fail at 4800 Mbps.
The H5CG48MEBDX018 operates at 1.1V VDD/VDDQ (with VPP for word-line bootstrapping per DDR5 architecture - verify exact rail values in the official datasheet). In soldered-down designs, provide solid VDDQ planes with dense via stitching to the BGA power balls and bulk + 0.1uF/0.01uF decoupling close to each package corner. Estimated: at typical x8 DDR5-4800 operating currents of several hundred mA per component, plan the power tree regulator for at least 0.5 A per die with margin for refresh bursts.
Do not assume DDR4 controller compatibility - DDR5 requires a DDR5 memory controller, different training firmware, and ODECC/link-ECC enablement at the controller level. Also, verify speed-bin suffix coding (X014/X015/X017/X018) against your platform's validated vendor list before swapping die generations: A-die (AGBD) and M-die (MEBD) parts are validated drop-ins per public cross-reference guides, but controller firmware whitelists may need re-testing. Always obtain the official SK hynix datasheet rather than relying on distributor summary tables.
규정 준수 정보
RoHS compliant per JLCPCB listing. Other compliance statuses not stated in provided web data.
