M1AFS1500-1FG676I - Fusion FPGA 1.5M Gates 676FBGA | Microchip
MPN: M1AFS1500-1FG676I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425.73 | $425.73 |
| 10 | $404.44 | $4,044.40 |
| 100 | $383.16 | $38,316.00 |
| 500 | $361.87 | $180,935.00 |
| 1,000 | $340.59 | $340,590.00 |
Drop-in alternatives for M1AFS1500-1FG676I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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M1AFS1500-2FG676I
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View Datasheet →M1AFS1500-FG676I
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View Datasheet →M1AFS1500-1FGG676
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View Datasheet →M1AFS1500-FGG676I
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View Datasheet →M1AFS1500-1FG676I Maximum Ratings & Electrical Characteristics
| Manufacturer Part Number | M1AFS1500-1FG676I |
| Manufacturer | Microchip Technology (Microsemi) |
| Product Type | Fusion Mixed-Signal FPGA |
| Number of Gates | 1.5 M |
| Number of I/O | 252 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Speed Grade | -1 |
| Package / Case | 676-Pin FBGA |
| Mounting Style | SMD/SMT |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +85 C |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Peak Reflow Time | 30 s |
| Packaging | Tray |
| RoHS Status | RoHS Non-Compliant |
| Lead Free Status | Contains Lead |
M1AFS1500-1FG676I 676-pin fbga Pin Configuration Guide
Complete pinout information for M1AFS1500-1FG676I (676-pin fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS1500-1FG676I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS1500-1FG676I is suitable for 6 applications: Industrial Automation Control, Power Supply and Battery Management Monitoring, Military and Aerospace Embedded Control, Test and Measurement Instrumentation, Medical Diagnostic Equipment Monitoring, Networking and Communication Line Cards.
Industrial Automation Control
The M1AFS1500-1FG676I fits industrial automation because its 1.5M-gate flash fabric and 252 user I/O consolidate PLC I/O logic, sensor aggregation, and supervisory sequencing in one die, while the -40C to +85C industrial grade covers unconditioned factory cabinets. The Fusion integrated analog subsystem reads voltage, current, and temperature channels directly, removing external monitor ADCs from the control board. In use, the non-volatile flash configuration makes the controller live at power-up with no boot PROM delay, and clock management circuitry synchronizes fieldbus and backplane timing. The trade-off is the 130nm fabric clock ceiling, which suits deterministic control rather than high-throughput datapaths.
Recommended
Power Supply and Battery Management Monitoring
Fusion FPGAs were explicitly designed for intelligent power management: the M1AFS1500-1FG676I integrates configurable analog channels for voltage, current, temperature, and gate-drive monitoring alongside 1.5M gates of sequencing logic, so a single device supervises multi-rail power supplies and battery stacks. The 252 I/O drive fets, alarms, and PMBus-style interfaces, while the -40C to +85C rating suits telecom rectifiers and outdoor energy cabinets. Because configuration is flash-based, protection policies are active the instant power appears - critical for fault response in hot-swap systems. Designers should budget for the leaded-package RoHS exemption scope in commercial power products.
Recommended
Military and Aerospace Embedded Control
The leaded construction of M1AFS1500-1FG676I, typically supplied under defense exemptions, aligns with military and aerospace procurement where RoHS restrictions do not apply. Its non-volatile flash fabric offers inherent bitstream security and instant-on operation valued in avionics and unmanned platforms, and the industrial -40C to +85C range supports unheated compartments. The 1.5M-gate fabric implements sensor interface glue logic, telemetry framing, and safety interlocks, while the Fusion analog subsystem monitors rail health and board temperature in flight. The monolithic integration of analog, flash, and logic reduces piece-part count - a reliability advantage for high-altitude and vibration-prone environments.
Recommended
Test and Measurement Instrumentation
Bench and rack instruments benefit from the M1AFS1500-1FG676I's mix of 1.5M gates for trigger engines, acquisition decoders, and bus interfaces, plus on-chip analog monitors for self-calibration telemetry. The 252 I/O connect to front-panel buttons, display buses, and high-pin-count capture paths, while integrated clock management generates synchronized sample and interface clocks without extra PLL chips. Flash configuration gives instant-on readiness expected in laboratory equipment, and the 676-ball FBGA provides dense routing for high signal-count boards. Designers should note MSL 3 handling - boards must be reflowed within 168 hours of bag opening or re-baked.
Recommended
Medical Diagnostic Equipment Monitoring
In medical diagnostic platforms such as lab analyzers and imaging support racks, the M1AFS1500-1FG676I supervises system rails, lamp or motor currents, and enclosure temperature using its integrated analog channels, while the 1.5M-gate fabric runs interface glue logic and safety interlock state machines. The -40C to +85C industrial grade covers cold-chain transport and autoclave-adjacent environments, and non-volatile flash configuration ensures monitoring is active from first power. Deterministic single-chip integration of sensing and control shortens IEC 60601 safety-rationale documentation compared to discrete analog-plus-CPLD stacks. Verify lead-free plating requirements for applicable markets.
Recommended
Networking and Communication Line Cards
The M1AFS1500-1FG676I serves as system-controller fabric on telecom and networking line cards, handling power sequencing across multiple rails, hot-swap supervision, and chassis management interfaces using 252 I/O and the Fusion analog monitors. The 676-ball FBGA offers ample I/O for backplane connectivity and front-panel LEDs, while flash-based configuration provides live-at-insertion behavior demanded by carrier-grade hot-pluggable equipment. Clock management circuitry synchronizes management-channel timing without external PLL devices. The 1.5V core suits card power budgets, though the leaded package should be screened against RoHS scope for commercial telecom products - consider the GGG lead-free variants where required.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS1500-1FG676I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS1500-2FG676I | M1AFS1500-1FGG676I | M1AFS1500-FG676I | M1AFS1500-FGG676I |
|---|---|---|---|---|---|
| Package | 676-Ball FBGA | 676-Ball FBGA - same | 676-Ball FBGA - same | 676-Ball FBGA - same | 676-Ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Number of Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| User I/O | 252 | 252 | 252 | 252 | 252 |
| Speed Grade | -1 | -2 (faster) | -1 | standard | standard |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | commercial range [DATA_NEEDED] | -40C to +85C |
| RoHS / Lead Status | RoHS Non-Compliant (contains lead) | leaded construction | lead-free, RoHS compliant | leaded construction | lead-free, RoHS compliant |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Industrial temperature rating with -1 speed grade (vs M1AFS1500-FG676I)
- Leaded construction for defense-exempt programs (vs M1AFS1500-1FGG676I)
- Cost-optimized speed point (vs M1AFS1500-2FG676I)
Design Notes
The 676-ball FBGA requires controlled-impedance multilayer PCB construction; plan microvia or 0.5 mm-pitch-capable fanout under the device. Because the package is MSL 3 (168 hours), boards must be reflowed within 168 hours of moisture-barrier-bag opening or baked per IPC handling practice before reflow - a 30-second peak reflow window applies. Reserve perimeter balls for power/ground star connections and dedicate internal layers to core (1.5V), I/O, and ground planes to manage simultaneous-switching noise across 252 I/O.
The 1.5V core rail must be sequenced and regulated per the Fusion family power-up requirements published in the manufacturer datasheet; follow the datasheet's recommended power-supply sequencing order for core, I/O, and analog rails to avoid latch-up. Because Fusion integrates configurable analog monitoring, use it to observe rail health during prototype bring-up rather than adding external supervision ICs. Estimate core current budget from your design utilization using Libero SoC power analysis tools before selecting the 1.5V regulator.
The most common sourcing pitfall is confusing the -1FG676I (leaded, RoHS Non-Compliant) with the -1FGG676I (lead-free, RoHS compliant) suffixes - they are electrically identical but not interchangeable for compliance purposes, and reflow profiles differ because lead-free BGA balls need higher peak temperatures. Confirm your board's reflow profile matches the chosen plating variant before dual-sourcing. Also verify speed-grade timing closure: migrating from -1 to standard grade requires re-running static timing in Libero SoC.
Compliance Information
Per DigChip datasheet records: Lead Free Status 'Contains Lead', RoHS Status 'RoHS Non-Compliant'. Common for defense-exempt Microsemi Fusion parts; lead-free GG suffix variants exist for RoHS markets.
