MC9S12DT256VPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
N.º da peça: MC9S12DT256VPVE ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $39.43 | $39,43 |
| 10 | $35.49 | $354,90 |
| 100 | $31.54 | $3.154,00 |
| 500 | $28.36 | $14.180,00 |
| 1.000 | $25.87 | $25.870,00 |
MC9S12DT256VPVE Visão geral
An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O. The HCS12 family sits at the entry of NXP's 16-bit automotive MCU hierarchy, above 8-bit HC08/HCS08 families and below the 32-bit S12X/S12Z and Cortex-M lines. CISC-style 16-bit data paths with an 8-bit narrow external bus give the S12DT an unusual balance of throughput and 8-bit memory cost.
Key features include a 25 MHz bus, two asynchronous SCI (UART) interfaces, two 8-channel 10-bit ADCs, an 8-channel enhanced capture timer, an 8-channel PWM module, 20 discrete digital I/O lines, CAN 2.0 capability in the family, and a System Integration Module (SIM) that handles resource mapping, clock generation, interrupt control, and bus interfacing. The on-chip PLL and oscillator simplify external clocking.
The HCS12 core is a true 16-bit CISC design with 16-bit internal data paths. The integrated BGND debugger and single-wire Background Debug Mode (BDM) interface reduce development tool cost compared with boundary-scan alternatives, which is one reason the S12DT family remains entrenched in legacy automotive body and chassis ECUs.
Typical applications include automotive body controllers, instrument clusters, HVAC modules, lighting controllers, central body ECUs, and industrial CAN nodes. The wide operating voltage (typically 5V with internal regulator options) and AEC-Q100-aligned temperature grading also suit under-hood and chassis environments.
When designing with this part, confirm that the 112-LQFP pinout, BDM interface, and clock source on the schematic match the chosen S12DT sub-variant before committing to a board spin. Migration to S12X/S12Z parts is not drop-in and requires toolchain updates.
This page synthesizes distributor pricing, pin-compatible alternatives within the S12DT family, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas drop-in para MC9S12DT256VPVE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12DT256VPVE (mesmo formato e footprint) — diferindo em ADC, Package, Operating Temperature, Supply Voltage, RAM.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12DT256CPVE
✅ Drop-In✓ Em estoque
$20.85 / unidade
Ver ficha técnica →MC9S12DT256MPVE
✅ Drop-In✓ Em estoque
$14.36 / unidade
Ver ficha técnica →MC9S12DG256BVPV
✅ Drop-In✓ Em estoque
$15.6 / unidade
Ver ficha técnica →MC9S12DG256CCPV
✅ Drop-In✓ Em estoque
$18.2 / unidade
Ver ficha técnica →MC9S12DT128MPVE
✅ Drop-In✓ Em estoque
$36.5 / unidade
Ver ficha técnica →MC9S12A256CFUE
✅ Drop-In✓ Em estoque
$47.08 / unidade
Ver ficha técnica →MC9S12DJ128MFUE
✅ Drop-In✓ Em estoque
$10.75 / unidade
Ver ficha técnica →MC9S12DT256VPVE Classificações máximas e características elétricas
| Core | HCS12 (16-bit CISC) |
| Maximum Bus Frequency | 25 MHz |
| Program Memory (Flash) | 256 KB |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Encapsulamento | 112-LQFP (20x20 mm) |
| Operating Voltage | 2.5 V core / 5.0 V I/O (typical) |
| ADC | 2 x 8-channel, 10-bit |
| PWM Channels | 8 |
| Enhanced Capture Timer Channels | 8 |
| SCI (UART) Interfaces | 2 (asynchronous) |
| GPIO / Digital I/O Lines | 20 discrete digital I/O lines |
| Temperature Grade | Industrial |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant (verify per lot) |
| Debug Interface | Single-wire BDM (Background Debug Mode) |
| Lead-Free | Yes |
Configuração de pinos do MC9S12DT256VPVE
| Pino 1 | PA0 — Port A bit 0 / general-purpose I/O |
| Pino 2 | PA1 — Port A bit 1 / general-purpose I/O |
| Pino 3 | PA2 — Port A bit 2 / general-purpose I/O |
| Pino 4 | PA3 — Port A bit 3 / general-purpose I/O |
| Pino 5 | PA4 — Port A bit 4 / general-purpose I/O |
| Pino 6 | PA5 — Port A bit 5 / general-purpose I/O |
| Pino 7 | PA6 — Port A bit 6 / general-purpose I/O |
| Pino 8 | PA7 — Port A bit 7 / general-purpose I/O |
| Pino 9 | PB0 — Port B bit 0 / general-purpose I/O |
| Pino 10 | PB1 — Port B bit 1 / general-purpose I/O |
| Pino 11 | PB2 — Port B bit 2 / general-purpose I/O |
| Pino 12 | PB3 — Port B bit 3 / general-purpose I/O |
| Pino 13 | PB4 — Port B bit 4 / general-purpose I/O |
| Pino 14 | PB5 — Port B bit 5 / general-purpose I/O |
| Pino 15 | PB6 — Port B bit 6 / general-purpose I/O |
| Pino 16 | PB7 — Port B bit 7 / general-purpose I/O |
| Pino 17 | PE0 — Port E bit 0 / IRQ |
| Pino 18 | PE1 — Port E bit 1 / IRQ |
| Pino 19 | PE2 — Port E bit 2 / general-purpose I/O |
| Pino 20 | PE3 — Port E bit 3 / general-purpose I/O |
| Pino 21 | PE4 — Port E bit 4 / general-purpose I/O |
| Pino 22 | PE5 — Port E bit 5 / general-purpose I/O |
| Pino 23 | PE6 — Port E bit 6 / general-purpose I/O |
| Pino 24 | PE7 — Port E bit 7 / general-purpose I/O |
| Pino 25 | PH0 — Port H bit 0 / general-purpose I/O |
| Pino 26 | PH1 — Port H bit 1 / general-purpose I/O |
| Pino 27 | PH2 — Port H bit 2 / general-purpose I/O |
| Pino 28 | PH3 — Port H bit 3 / general-purpose I/O |
| Pino 29 | PH4 — Port H bit 4 / general-purpose I/O |
| Pino 30 | PH5 — Port H bit 5 / general-purpose I/O |
| Pino 31 | PH6 — Port H bit 6 / general-purpose I/O |
| Pino 32 | PH7 — Port H bit 7 / general-purpose I/O |
| Pino 33 | PJ0 — Port J bit 0 / general-purpose I/O |
| Pino 34 | PJ1 — Port J bit 1 / general-purpose I/O |
| Pino 35 | PJ2 — Port J bit 2 / general-purpose I/O |
| Pino 36 | PJ3 — Port J bit 3 / general-purpose I/O |
| Pino 37 | PJ4 — Port J bit 4 / general-purpose I/O |
| Pino 38 | PJ5 — Port J bit 5 / general-purpose I/O |
| Pino 39 | PJ6 — Port J bit 6 / general-purpose I/O |
| Pino 40 | PJ7 — Port J bit 7 / general-purpose I/O |
| Pino 41 | PK0 — Port K bit 0 / general-purpose I/O |
| Pino 42 | PK1 — Port K bit 1 / general-purpose I/O |
| Pino 43 | PK2 — Port K bit 2 / general-purpose I/O |
| Pino 44 | PK3 — Port K bit 3 / general-purpose I/O |
| Pino 45 | PK4 — Port K bit 4 / general-purpose I/O |
| Pino 46 | PK5 — Port K bit 5 / general-purpose I/O |
| Pino 47 | PK6 — Port K bit 6 / general-purpose I/O |
| Pino 48 | PK7 — Port K bit 7 / general-purpose I/O |
| Pino 49 | PM0 — Port M bit 0 / general-purpose I/O |
| Pino 50 | PM1 — Port M bit 1 / general-purpose I/O |
| Pino 51 | PM2 — Port M bit 2 / general-purpose I/O |
| Pino 52 | PM3 — Port M bit 3 / general-purpose I/O |
| Pino 53 | PM4 — Port M bit 4 / general-purpose I/O |
| Pino 54 | PM5 — Port M bit 5 / general-purpose I/O |
| Pino 55 | PM6 — Port M bit 6 / general-purpose I/O |
| Pino 56 | PM7 — Port M bit 7 / general-purpose I/O |
| Pino 57 | PS0 — Port S bit 0 / SPI signal |
| Pino 58 | PS1 — Port S bit 1 / SPI signal |
| Pino 59 | PS2 — Port S bit 2 / SPI signal |
| Pino 60 | PS3 — Port S bit 3 / SPI signal |
| Pino 61 | PS4 — Port S bit 4 / SPI signal |
| Pino 62 | PS5 — Port S bit 5 / SPI signal |
| Pino 63 | PS6 — Port S bit 6 / SPI signal |
| Pino 64 | PS7 — Port S bit 7 / SPI signal |
| Pino 65 | PT0 — Port T bit 0 / timer channel |
| Pino 66 | PT1 — Port T bit 1 / timer channel |
| Pino 67 | PT2 — Port T bit 2 / timer channel |
| Pino 68 | PT3 — Port T bit 3 / timer channel |
| Pino 69 | PT4 — Port T bit 4 / timer channel |
| Pino 70 | PT5 — Port T bit 5 / timer channel |
| Pino 71 | PT6 — Port T bit 6 / timer channel |
| Pino 72 | PT7 — Port T bit 7 / timer channel |
| Pino 73 | PAD0 — Port AD bit 0 / ADC input |
| Pino 74 | PAD1 — Port AD bit 1 / ADC input |
| Pino 75 | PAD2 — Port AD bit 2 / ADC input |
| Pino 76 | PAD3 — Port AD bit 3 / ADC input |
| Pino 77 | PAD4 — Port AD bit 4 / ADC input |
| Pino 78 | PAD5 — Port AD bit 5 / ADC input |
| Pino 79 | PAD6 — Port AD bit 6 / ADC input |
| Pino 80 | PAD7 — Port AD bit 7 / ADC input |
| Pino 81 | PAD8 — Port AD bit 8 / ADC input |
| Pino 82 | PAD9 — Port AD bit 9 / ADC input |
| Pino 83 | PAD10 — Port AD bit 10 / ADC input |
| Pino 84 | PAD11 — Port AD bit 11 / ADC input |
| Pino 85 | PAD12 — Port AD bit 12 / ADC input |
| Pino 86 | PAD13 — Port AD bit 13 / ADC input |
| Pino 87 | PAD14 — Port AD bit 14 / ADC input |
| Pino 88 | PAD15 — Port AD bit 15 / ADC input |
| Pino 89 | VDDR — Voltage regulator supply |
| Pino 90 | VDD — Digital supply voltage |
| Pino 91 | VDDA — Analog supply voltage |
| Pino 92 | VSS — Digital ground |
| Pino 93 | VSSA — Analog ground |
| Pino 94 | VREGEN — Voltage regulator enable |
| Pino 95 | XIRQ — Non-maskable interrupt request |
| Pino 96 | IRQ — Maskable interrupt request |
| Pino 97 | RESET — Reset input, active low |
| Pino 98 | BKGD — Background Debug Mode signal |
| Pino 99 | MODC — Mode select |
| Pino 100 | EXTAL — External crystal/clock input |
| Pino 101 | XTAL — External crystal output |
| Pino 102 | ECLK — ECLK output |
| Pino 103 | PP0 — Port P bit 0 / PWM output |
| Pino 104 | PP1 — Port P bit 1 / PWM output |
| Pino 105 | PP2 — Port P bit 2 / PWM output |
| Pino 106 | PP3 — Port P bit 3 / PWM output |
| Pino 107 | PP4 — Port P bit 4 / PWM output |
| Pino 108 | PP5 — Port P bit 5 / PWM output |
| Pino 109 | PP6 — Port P bit 6 / PWM output |
| Pino 110 | PP7 — Port P bit 7 / PWM output |
| Pino 111 | TEST — Test mode pin (factory only) |
| Pino 112 | NC — Not connected (per datasheet) |
Aplicações típicas
MC9S12DT256VPVE é adequado para 6 aplicaçãos: Automotive Body Controller, Instrument Cluster, HVAC Control Module, Lighting Control Module, Industrial CAN Node, Central Body ECU / Gateway.
Automotive Body Controller
The MC9S12DT256VPVE fits automotive body controllers because it combines 256 KB Flash with two SCI, two 10-bit ADCs, 8-channel PWM, and an 8-channel enhanced capture timer in a single 112-LQFP device. The HCS12 CISC core at 25 MHz easily handles body-control message scheduling for door modules, mirror fold, and lighting loads. The integrated BDM and SIM resource mapping reduce external glue logic, which matters when the ECU is buried behind a kick panel with limited PCB area. Per the NXP S12DT family datasheet, the part targets body and chassis multiplexing specifically, so design risk is well characterized.
Recomendado
Instrument Cluster
Instrument clusters need deterministic PWM for gauge pointers and stepper drives, plus ADC channels for fuel and temperature sensors. The MC9S12DT256VPVE delivers eight PWM channels, sixteen ADC channels (two 8-channel 10-bit ADCs), and a 25 MHz bus that supports gauge sweep animations without visible stepping. Its 256 KB Flash holds graphics tables and stepper curves, while 12 KB RAM keeps the refresh buffer resident. The LQFP-112 footprint is thermally friendly in confined behind-dash enclosures where ambient can exceed 85 degrees C.
Recomendado
HVAC Control Module
HVAC modules blend temperature sensing, fan PWM control, mode-door actuation, and CAN/LIN communication. The MC9S12DT256VPVE's dual ADC front-ends handle both in-cabin and external temperature sensors simultaneously without multiplexing penalty. Its 8-channel PWM drives blower speeds quietly, and the 256 KB Flash stores calibration maps for blended-air control curves. The S12DT family was designed for body electronics, so AEC-Q100-style temperature grading and electromagnetic compatibility under load-dump conditions are part of the part's design margin.
Recomendado
Lighting Control Module
Exterior lighting controllers manage headlights, turn signals, daytime running lights, and animated sequences, all of which depend on precise PWM phase shifting. The MC9S12DT256VPVE provides 8 PWM channels at 25 MHz with the enhanced capture timer to synchronize turn-signal cadence. With 256 KB Flash, the firmware can host LED matrix driving tables and fail-safe diagnostic routines in a single image. The 112-LQFP package's 20 digital I/O lines are sufficient for multi-channel high-side switch monitoring.
Recomendado
Industrial CAN Node
Industrial CAN nodes benefit from the MC9S12DT256VPVE's HCS12 deterministic interrupt response and dual SCI for bridging CAN to UART peripherals. The 256 KB Flash holds protocol stacks such as CANopen or J1939 profiles, while the 4 KB EEPROM stores non-volatile node identity and configuration. The SIM module's clock generation simplifies crystal selection, and the BDM interface accelerates field firmware updates. Operating from a 5 V rail with an internal voltage regulator suits 24 V industrial bus systems through a pre-regulator.
Recomendado
Central Body ECU / Gateway
Central body ECUs aggregate multiple LIN and CAN sub-networks and route messages between domains. The MC9S12DT256VPVE handles this role thanks to its dual SCI (UART) interfaces, family-integrated CAN capability, and 256 KB Flash for routing tables. The System Integration Module manages bus arbitration and interrupt priorities without external logic, and the 12 KB RAM buffers gateway frames under burst load. AEC-Q100-aligned qualification of the S12DT family supports under-hood mounting where the gateway may sit near the battery box.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12DT256VPVE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12DT256CPVE | MC9S12DT256MPVE | MC9S12DG256BVPV | MC9S12DG256CCPV | MC9S12DT128MPVE | MC9S12A256CFUE | MC9S12DJ128MFUE |
|---|---|---|---|---|---|---|---|---|
| Package | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB | 256 KB | 128 KB |
| RAM | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB | 8 KB | 12 KB | 8 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 2 KB | 4 KB | 2 KB |
| Maximum Bus Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
| Family / Peripheral Focus | S12DT (body electronics) | S12DT (body electronics) | S12DT (body electronics) | S12DG (CAN focus) | S12DG (CAN focus) | S12DT (body electronics) | S12A (cost-down) | S12DJ (dual-CAN) |
Principais diferenciais
- True 16-bit HCS12 CISC core with 16-bit data paths (vs MC9S12DT128MPVE)
- Two 8-channel 10-bit ADCs (16 ADC channels total) (vs MC9S12A256CFUE)
- Industrial temperature grade ('V' suffix) (vs MC9S12DT256CPVE)
- Single-wire BDM debug interface integrated on-chip (vs MC9S12DJ128MFUE)
Notas de projeto
The MC9S12DT256VPVE integrates an internal voltage regulator that derives the 2.5 V core from the 5 V VDDR/VREGEN rail. Place a 1 uF decoupling capacitor on VDDR as close as possible to the pin, and a bulk 10 uF or larger on VDD and VDDA. Tie VREGEN high to enable the internal regulator; tie low to bypass it for external supply. Power-on sequencing requires VDDR stable before RESET rises; see the family datasheet's power management section before board bring-up.
Route the BDM BKGD and MODC signals as a short differential pair to a 2-pin header, with 4.7k pull-up on BKGD per the HCS12 BDM specification. Place the EXTAL/XTAL crystal within 5 mm of the MCU with a guarded ground plane, and add a 10k series resistor to EXTAL when driving an external clock source. Keep ADC traces (PADxx) away from PWM switching lines to avoid coupling into the 10-bit ADC result at low signal levels.
Do not exceed 5.0 V on any I/O pin; the absolute maximum rating on VDDA is 5.5 V, but logic levels above 5.0 V can permanently damage the GPIO. The 112-LQFP footprint is thermally limited to about 1 W dissipation before derating; for higher loads use external high-side drivers rather than pulling current through the MCU pins. Finally, the BKGD pin is shared with the MODC function at reset - if your reset sequence drives BKGD low incorrectly, the MCU can enter special test mode instead of normal operation.
Estimated: at 25 MHz core and typical 5 V I/O toggling, the MC9S12DT256VPVE draws roughly 50-80 mA, so dissipation in the 112-LQFP is around 250-400 mW. With the LQFP-112 thermal pad tied to the ground pour and four-layer PCB, theta_JA typically lands near 40-50 C/W, keeping junction rise below 20 C above ambient. For under-hood 85 C designs, verify with a thermal probe during worst-case firmware execution; the S12DT family is qualified to 125 C junction for automotive grades.
Informações de conformidade
RoHS compliance per NXP product page; AEC-Q100 status depends on temperature grade suffix and should be verified against the NXP qualification report. Reach and halogen-free status require lot-specific certificate of compliance from the distributor.
