MCF5214CVM66 - ColdFire V2 32-bit MCU, 256KB Flash, 66MHz | NXP
부품 번호: MCF5214CVM66 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.45 | $18.45 |
| 10 | $16.62 | $166.20 |
| 100 | $14.78 | $1,478.00 |
| 500 | $13.1 | $6,550.00 |
| 1,000 | $11.85 | $11,850.00 |
MCF5214CVM66 개요
A ColdFire V2 microcontroller is a member of the ColdFire family of reduced instruction set computing (RISC) processors developed from the original Motorola 68000 architecture. ColdFire cores are categorized by version (V1, V2, V3, V4) where V2 represents a balanced mid-tier implementation featuring the ColdFire variable-length ISA, hardware multiply/accumulate, and an enhanced MAC unit. Within the broader taxonomy, MCF5214CVM66 sits as: microcontroller -> 32-bit MCU -> ColdFire V2 -> MCF521x family -> MCF5214 sub-family -> power-managed embedded controller.
Key features include a 10/100 Ethernet MAC (FEC) with media-independent interface (MII), a USB 2.0 Full-Speed On-The-Go (OTG) controller, three UARTs, two I2C buses, a queued serial peripheral interface (QSPI), and a 4-channel 32-bit DMA. The integrated FlexBus external interface supports glueless expansion to SRAM, NOR flash, and ASIC peripherals. An 8-channel, 12-bit successive-approximation ADC and four 32-bit timers (including a 4-channel DMA timer) make the part well-suited to mixed-signal control loops. Hardware cryptography is not present on this variant; secure boot is supported through the Flash Security Module.
The MCF5214 uses a Harvard-style internal bus with separate Flash and SRAM paths, enabling near-single-cycle access to on-chip memory and deterministic interrupt latency typical of ColdFire V2 designs. Power management is handled by the on-chip Voltage Regulator and dedicated low-power modes (Wait, Doze, Stop), allowing peripheral clocks to remain active while the core halts.
Typical applications include industrial automation controllers, point-of-sale terminals, building-automation gateways, factory-floor protocol bridges (Modbus, BACnet, Profibus slave), networked sensor hubs, and graphical HMI panels. The 10/100 Ethernet MAC and USB OTG simplify connected-device designs without requiring external PHY plus MAC companions.
When designing with this device, dedicate at least four PCB layers to the 256-ball MAP-BGA, route the analog supply AVDD separately from the digital VDD, and place the 32 kHz crystal close to the RTC XTAL pins to avoid noise coupling into the Ethernet PHY reference clock.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: MCF5214CVM66 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCF5214CVM66 (동일 폼 팩터 및 풋프린트) — 차이점: RAM Size, Mounting Type, Operating Temperature, Package / Case, Connectivity.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCF5216CVM66J
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCF5281CVM66
✅ 드롭인✓ 재고 있음
$32.77 / 개
데이터시트 보기 →MCF5281CVM80
✅ 드롭인✓ 재고 있음
$36.8 / 개
데이터시트 보기 →MCF5213LCVM80
✅ 드롭인✓ 재고 있음
$9.75 / 개
데이터시트 보기 →MCF5214CVM150
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCF5214CVM66 최대 정격 & 전기적 특성
| Core Architecture | ColdFire V2 (32-bit RISC) |
| Core Clock Speed | 66 MHz |
| Program Memory Size | 256 KB (256K x 8) Flash |
| Program Memory Type | FLASH, interleaved and securable |
| RAM Size | 64 KB (64K x 8) SRAM |
| Supply Voltage (Vcc/Vdd) | 2.7 V to 3.6 V |
| 동작 온도 | -40 C to +85 C (TA) |
| 패키지 / 케이스 | 256-MAPBGA (17x17 mm) |
| 실장 유형 | Surface Mount (BGA) |
| ADC | 8 channels, 12-bit SAR |
| Ethernet MAC | 10/100 Mbps (FEC) with MII |
| USB | USB 2.0 Full-Speed OTG |
| UART | 3 |
| I2C | 2 |
| QSPI | 1 (queued, up to 4 peripherals) |
| DMA | 4-channel, 32-bit |
| Timers | 4 x 32-bit (including 4-channel DMA timer) |
| External Bus | FlexBus (16-bit data, glueless SRAM/NOR/ASIC) |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
MCF5214CVM66 256-mapbga (17x17 mm) 핀 구성 가이드
MCF5214CVM66(256-mapbga (17x17 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCF5214CVM66.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCF5214CVM66 적합 용도: 6 애플리케이션s: Industrial Automation Controller, Point-of-Sale Terminal, Building-Automation Gateway, Factory-Floor Protocol Bridge, Networked Sensor Hub, Graphical HMI Panel.
Industrial Automation Controller
The MCF5214CVM66 fits industrial automation because it integrates a 10/100 Ethernet MAC for Modbus TCP, BACnet/IP, or EtherNet/IP fieldbus connectivity, three UARTs for legacy RS-485 sensor chains, and an 8-channel 12-bit ADC for closed-loop analog sensing. Its 66 MHz ColdFire V2 core executes typical PLC scan cycles under 5 ms while the 64 KB SRAM holds protocol stacks without external memory. Designers place the part on a four-layer PCB with separate AVDD filtering, route the MII signals as 50-ohm impedance-matched pairs to an external PHY, and use the FlexBus to glue a 16-bit NOR flash for non-volatile log storage. Versus a Cortex-M3 alternative, the ColdFire V2 MAC unit accelerates deterministic bit-banging and DSP-style filtering in motor-control firmware.
추천
Point-of-Sale Terminal
Point-of-sale terminals benefit from the MCF5214CVM66's combined Ethernet, USB OTG, and QSPI resources. The Ethernet MAC drives the LAN backbone for transaction authorization, the USB OTG controller connects to a magnetic-stripe or NFC reader, and the QSPI drives a TFT LCD with frame buffer in external SPI flash. The 256 KB Flash stores the payment application and EMV kernel, while the 64 KB SRAM serves as a transaction scratchpad. ColdFire V2 deterministic interrupts ensure sub-100 ms response under network jitter. The 256-MAPBGA package fits beneath a compact POS housing with a 4-layer FR4 stack-up, and the on-chip voltage regulator simplifies the 3.3 V-only power tree.
추천
Building-Automation Gateway
For BACnet, LonWorks, or KNX gateway designs the MCF5214CVM66 provides simultaneous Ethernet plus multi-UART connectivity to field devices. Two I2C buses manage sensor front-ends (temperature, humidity, CO2) while the FlexBus extends to a parallel companion NOR for device firmware. The integrated 10/100 MAC with MII connects to a standard transformerless PHY for PoE-powered gateway deployments. ColdFire V2 power-management modes (Wait, Doze, Stop) cut average current below 30 mA during idle polling, important for always-on gateway duty cycles. The 256-MAPBGA routes cleanly on a 4-layer board with the Ethernet PHY placed within 25 mm of the MAC pins to keep MII skew under 250 ps.
추천
Factory-Floor Protocol Bridge
The MCF5214CVM66 is well-matched to protocol bridges that translate between Profibus, Modbus RTU, and Ethernet/IP because it offers three UARTs, one Ethernet MAC, and a queued SPI to drive a Profibus ASIC. The ColdFire V2 core executes protocol conversion in firmware at line rate without offloading to a companion CPU, and the 4-channel 32-bit DMA sustains simultaneous UART RX, UART TX, and Ethernet traffic without CPU intervention. The 256 KB Flash holds multiple protocol stacks side-by-side. The BGA package needs a 4-layer minimum PCB with continuous ground beneath the die to keep thermal resistance below 25 C/W; the on-chip voltage regulator removes the need for an external 1.5 V LDO in the bridge BOM.
추천
Networked Sensor Hub
For wireless or wired sensor hubs aggregating data from multiple end nodes, the MCF5214CVM66's combination of low-power modes, Ethernet, USB OTG, and 8-channel 12-bit ADC is well-aligned. The ADC reads analog sensors (4-20 mA, 0-10 V) while UARTs receive RS-485 sensor chains; the integrated DMA offloads streaming data into the 64 KB SRAM without waking the CPU. ColdFire V2 Stop mode reduces quiescent draw to allow battery-backed operation. The 256-MAPBGA's thermal performance keeps the junction under 100 C at full 66 MHz plus ADC sampling, and the on-chip Flash Security Module protects provisioning keys stored in firmware.
추천
Graphical HMI Panel
Graphical HMI panels benefit from the MCF5214CVM66's external FlexBus for connecting a 16-bit parallel TFT controller and the QSPI for SPI-based touch controllers. The 66 MHz core drives mid-resolution WVGA panels with frame buffering in the 64 KB SRAM plus an external SRAM bank on FlexBus. The Ethernet MAC streams recipe data from a SCADA host while the USB OTG accepts firmware updates from a USB stick during commissioning. The on-chip 12-bit ADC reads backlight current and panel temperature for brightness compensation. The 256-MAPBGA footprint requires a 6-layer PCB with controlled-impedance routing for the parallel display bus to avoid ghosting artifacts.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCF5214CVM66 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCF5216CVM66J | MCF5281CVM66 | MCF5281CVM80 | MCF5213LCVM80 | MCF5214CVM150 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-MAPBGA (17x17 mm) | 256-MAPBGA - same | 256-MAPBGA - same | 256-MAPBGA - same | 256-MAPBGA - same | 256-MAPBGA - same |
| Core Clock | 66 MHz | 66 MHz | 80 MHz | 80 MHz | 80 MHz | 150 MHz |
| Flash Memory | 256 KB | 512 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Hardware Encryption | No | No | Yes | Yes | No | No |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
주요 차별점
- Lowest-cost entry into 256-MAPBGA ColdFire V2 family (vs MCF5281CVM80)
- Doubled Flash on identical footprint (vs MCF5216CVM66J)
- Hardware encryption absent vs present in MCF5281 family (vs MCF5281CVM66)
설계 노트
The 256-MAPBGA (17x17 mm) package requires a minimum 4-layer PCB with a continuous ground plane directly beneath the die to keep the thermal resistance low. Microvia-in-pad is recommended for the BGA breakouts; place 0402 decoupling caps on the opposite side of each VDD/VSS pair within 1.5 mm of the balls to suppress switching transients from the ColdFire V2 core.
The MCF5214CVM66 integrates a 1.5 V core LDO; designers route only the external 3.3 V rail to VDD pins while isolating AVDD with a ferrite bead plus 10 uF + 100 nF LC network. Enable the on-chip voltage regulator only after VDD has stabilized for at least 10 ms to avoid inrush into the internal regulator; this preserves the 256 KB Flash endurance specification during power-up.
Do not confuse MCF5214CVM66 with the higher-clock MCF5214CVM150 variant - both share the 256-MAPBGA but the system clock PLL divider and Flash wait-state settings differ. Re-targeting firmware from one to the other requires updating the ColdFire initialization table; otherwise the 256 KB Flash will return bus errors at full speed.
Route the Ethernet MII signals as 50-ohm differential pairs with matched lengths within 25 mm of the PHY; place the 25 MHz PHY reference clock within 5 mm of the ETH_RX_CLK pin to keep skew under 250 ps. Keep the analog ADC inputs away from the FlexBus switching activity by at least 8 mm of ground-guard trace, and add a 10 kHz RC anti-alias filter on each AIN channel.
규정 준수 정보
RoHS and REACH compliance per NXP product page. Not AEC-Q100 qualified - choose MCF51AC or MPC56xx for automotive. Lead-free reflow profile per JEDEC J-STD-020 MSL-3.
