PIC32MZ0512EFE100-E/GJX - 200MHz 512KB Flash MCU TFBGA-100 | Microchip
부품 번호: PIC32MZ0512EFE100-E/GJX ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.85 | $14.85 |
| 10 | $13.36 | $133.60 |
| 100 | $11.88 | $1,188.00 |
| 500 | $10.7 | $5,350.00 |
| 1,000 | $9.52 | $9,520.00 |
PIC32MZ0512EFE100-E/GJX 개요
A 32-bit microcontroller (MCU) is an embedded processor that integrates a CPU core, memory (Flash/RAM), and a rich set of peripherals on a single die. The PIC32MZ EF family specifically targets connectivity-intensive applications, integrating High-Speed USB, 10/100 Ethernet MAC, CAN (where configured), multiple UART/SPI/I2C interfaces, 12-bit ADC, analog comparators, and graphics/audio peripherals. As a hypernym hierarchy, PIC32MZ EF sits under: 32-bit MCU -> microcontroller -> embedded processor -> semiconductor IC. These MCUs are typically deployed in industrial HMI, motor control, IoT gateways, and automotive infotainment subsystems.
Key features include dual-panel Flash for live firmware updates without downtime, a 200 MHz core with hardware multiply/divide and DSP extensions, a Crypto engine (Note: this -E variant ships with No Crypto, per the family variant table), up to 16-channel 12-bit ADC at 1 Msps, and a wide peripheral mix designed for graphics TFT driving and audio processing. The FPU offloads floating-point operations, enabling faster sensor fusion and DSP workloads. The integrated Ethernet MAC and HS-USB PHY interface streamline connected-product designs by reducing external component count and BOM cost.
Architecturally, the device pairs a high-throughput 200 MHz core with multi-channel DMA, dedicated motor-control PWM, and a peripheral bus matrix that minimizes contention. The 100-ball TFBGA package is the smallest footprint option in the family, freeing board area for radios, sensors, or display drivers. The FPU accelerates control loops in motor drive and power-conversion applications, while the dual-panel Flash eliminates application downtime during firmware upgrades - a critical feature for industrial IoT nodes requiring continuous operation.
Typical applications include industrial HMI panels, IoT edge gateways with Ethernet, BLDC and PMSM motor drives, automotive body and infotainment subsystems, medical patient monitoring, and connected consumer graphics products. The 7x7 mm TFBGA package is preferred when PCB real estate is at a premium and the design tolerates BGA assembly.
When designing with this part, plan BGA fanout and via-in-pad PCB fabrication carefully. The -E temperature grade enables under-hood automotive and outdoor industrial use, but thermal derating still applies; ensure junction temperature stays within the 125C maximum with proper PCB copper spreading. Program/debug via the standard 4-wire ICSP interface using any PGECx/PGEDx pin pair, and leverage MPLAB Harmony 3 for peripheral drivers and middleware.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations not found in the manufacturer datasheet alone.
드롭인 대체품: PIC32MZ0512EFE100-E/GJX — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ0512EFE100-E/GJX (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Architecture, FPU, Operating Temperature, CAN.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ0512EFE100-I/GJX
✅ 드롭인✓ 재고 있음
$6.84 / 개
데이터시트 보기 →PIC32MZ1024EFE100T-E/GJX
✅ 드롭인✓ 재고 있음
$7.95 / 개
데이터시트 보기 →PIC32MZ0512EFE100T-E/GJX
✅ 드롭인✓ 재고 있음
$7.95 / 개
데이터시트 보기 →PIC32MZ0512EFE100-E/GJX 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M-Class Warrior |
| Core Count | Single-core |
| Maximum CPU Clock | 200 MHz |
| DMIPS Performance | 330 DMIPS |
| FPU | IEEE 754 single-precision |
| DSP Extensions | Yes (4x 64-bit accumulators, single-cycle MAC) |
| Flash Memory | 512 KB |
| SRAM | 128 KB |
| Supply Voltage Range | 2.3 V to 3.6 V |
| 동작 온도 | -40 C to +125 C (E grade) |
| 패키지 | 100-ball TFBGA 7x7 mm |
| 실장 유형 | Surface Mount (BGA) |
| Ethernet | 10/100 MAC (RMII/MII interface) |
| USB | High-Speed USB 2.0 OTG |
| CAN | Not present on -E variant (no Crypto, no CAN) |
| ADC | 12-bit, up to 1 Msps |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
PIC32MZ0512EFE100-E/GJX 100-ball tfbga 7x7 mm 핀 구성 가이드
PIC32MZ0512EFE100-E/GJX(100-ball tfbga 7x7 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC32MZ0512EFE100-E/GJX.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC32MZ0512EFE100-E/GJX 적합 용도: 6 애플리케이션s: Industrial HMI with TFT Display, IoT Edge Gateway with Ethernet, BLDC / PMSM Motor Drive, Automotive Infotainment Subsystem, Medical Patient Monitoring Device, Connected Consumer Graphics Product.
Industrial HMI with TFT Display
The PIC32MZ0512EFE100-E/GJX is well suited for industrial Human-Machine Interface (HMI) panels driving TFT LCD displays. Its integrated graphics TFT controller, 200 MHz core with FPU accelerates GUI rendering and widget animation, while 128 KB SRAM holds frame buffers without external memory. The -40 C to +125 C extended temperature range supports factory-floor enclosures, and dual-panel Flash enables field firmware upgrades without production downtime. Combined with 10/100 Ethernet for SCADA connectivity, this part powers modern industrial control panels.
추천
IoT Edge Gateway with Ethernet
The PIC32MZ0512EFE100-E/GJX serves as the main processor in wired IoT edge gateways that aggregate sensor data and forward it to cloud services. Its integrated 10/100 Ethernet MAC and HS-USB 2.0 OTG provide flexible wired uplink options, while the 200 MHz core runs TLS stacks and local analytics. The FPU accelerates JSON parsing and lightweight inference. The 512 KB Flash stores TLS credentials, OTA bootloader, and application firmware, and the -E temperature grade tolerates outdoor enclosure conditions.
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BLDC / PMSM Motor Drive
The PIC32MZ0512EFE100-E/GJX is ideal for Field-Oriented Control (FOC) of BLDC and PMSM motors in industrial pumps, fans, and small EV traction. The integrated motor-control PWM with complementary outputs and dead-time insertion drives 3-phase inverters directly. The 12-bit ADC at 1 Msps samples phase currents and back-EMF, the hardware FPU accelerates Park/Clarke transforms, and the 200 MHz core completes the control loop in under 10 us. The -E temperature grade supports under-hood automotive motor drives.
추천
Automotive Infotainment Subsystem
The PIC32MZ0512EFE100-E/GJX fits automotive body and infotainment subsystems including instrument clusters, HVAC controllers, and head-unit secondary processors. Its -40 C to +125 C extended temperature range meets under-dash and cabin thermal requirements, the FPU handles audio DSP for hands-free calling, and the HS-USB 2.0 OTG port supports CarPlay/Android Auto bridging. The dual-panel Flash enables firmware updates during vehicle service without bricking the unit, a critical reliability feature for OEM deployments.
추천
Medical Patient Monitoring Device
The PIC32MZ0512EFE100-E/GJX is used in portable patient monitoring devices such as pulse oximeters, blood-pressure monitors, and ambulatory ECG recorders. Its FPU accelerates DSP filtering on vital-sign waveforms, the 12-bit ADC captures high-fidelity bioelectric signals, and the low-power Run/Idle/Wait/Sleep modes extend battery life. The HS-USB OTG port streams data to a host computer, and the -E temperature grade supports clinical and home-care environments. IEC 60730 software-class safety libraries are available from Microchip.
추천
Connected Consumer Graphics Product
The PIC32MZ0512EFE100-E/GJX powers connected consumer products with graphical user interfaces such as smart-home hubs, audio receivers with TFT displays, and Wi-Fi connected thermostats. The integrated TFT controller drives small color displays directly, the 10/100 Ethernet MAC connects to home networks, and the 200 MHz core with FPU handles animated icon transitions and audio decoding. The 512 KB Flash stores UI assets and connectivity stacks, and the TFBGA-100 footprint is small enough for compact enclosures.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ0512EFE100-E/GJX — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ0512EFE100-I/GJX | PIC32MZ1024EFE100T-E/GJX | PIC32MZ0512EFE100T-E/GJX |
|---|---|---|---|---|
| Package | 100-TFBGA (7x7) | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | MIPS32 M-Class Warrior 200 MHz | MIPS32 M-Class Warrior 200 MHz | MIPS32 M-Class Warrior 200 MHz | MIPS32 M-Class Warrior 200 MHz |
| Flash Memory | 512 KB | 512 KB | 1024 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB |
| FPU | Yes (IEEE 754 single-precision) | Yes (IEEE 754 single-precision) | Yes (IEEE 754 single-precision) | Yes (IEEE 754 single-precision) |
| Operating Temperature | -40 C to +125 C (E grade) | -40 C to +85 C (I grade) | -40 C to +125 C (E grade) | -40 C to +125 C (E grade) |
| CAN / Crypto | No CAN, No Crypto | No CAN, No Crypto | No CAN, No Crypto | No CAN, No Crypto |
| Packaging Format | Tray | Tray | Tape and Reel (T suffix) | Tape and Reel (T suffix) |
주요 차별점
- Extended -40 C to +125 C temperature grade with identical 200 MHz/FPU spec (vs PIC32MZ0512EFE100-I/GJX)
- Drop-in upgrade path to 1 MB Flash on identical TFBGA-100 footprint (vs PIC32MZ1024EFE100T-E/GJX)
- Integrated 10/100 Ethernet MAC and HS-USB 2.0 OTG eliminate external connectivity ICs (vs PIC32MX570F512LT-I/GJX (lower-cost 32-bit MCU))
설계 노트
Estimated: the 100-ball TFBGA 7x7 mm package requires a 0.65 mm pitch via-in-pad PCB stack-up with microvias to escape the inner-row balls. Plan at least 4 PCB layers with a dedicated ground plane under the BGA. Per JEDEC J-STD-020, MSL 3 handling requires bake-out before reflow if the parts have been exposed to ambient humidity beyond the floor-life tracker. Decoupling: place 0.1 uF X7R 0402/0201 caps within 1 mm of every VDD ball, plus 10 uF bulk on each voltage rail.
The PIC32MZ0512EFE100-E/GJX core runs from a regulated 2.3 V to 3.6 V supply; a 3.3 V LDO or switching regulator with sub-50 mV ripple is required for full 200 MHz operation. Estimate: at 200 MHz active, core current draw is roughly 80-100 mA, plus peripheral leakage through I/O. Add a soft-start ramp to the 3.3 V rail to limit inrush on the bulk capacitors. Connect all VDD/VSS balls to the supply even if some appear unused, to maintain substrate grounding and thermal spreading.
Common pitfalls: (1) BGA solder joint inspection requires X-ray or CT since pads are hidden under the package - do not rely on optical AOI alone; (2) The -E temperature grade enables 125 C operation but does not relax PCB copper thermal spreading requirements - derate power dissipation if junction-to-ambient exceeds design targets; (3) The -E variant lacks CAN and Crypto, so do not select this part if your firmware references CAN peripheral registers; (4) The PGECx/PGEDx ICSP pairs must be matched - if PGEC2 is used for ICSPCLK, then ICSPDAT must connect to PGED2; mismatched pairs will fail programming.
규정 준수 정보
RoHS compliant per Microchip product page. -E temperature grade is not equivalent to AEC-Q100 automotive qualification; for AEC-Q100-qualified PIC32 variants consult the Microchip automotive-grade selector. Lead-free (Pb-free) reflow compatible per JEDEC J-STD-020.
