RTAX250SL-CG624E - 250K-Gate Rad-Tolerant FPGA | Microchip
부품 번호: RTAX250SL-CG624E ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1590 | $159,000.00 |
| 500 | $1480 | $740,000.00 |
| 1,000 | $1375 | $1,375,000.00 |
RTAX250SL-CG624E 개요
A radiation-tolerant FPGA is a field-programmable gate array qualified for the space-flight environment, where single-event upsets (SEUs) caused by cosmic rays and trapped-particle radiation can flip configuration or user registers. Within the power hierarchy, the RTAX250SL sits in the space-grade programmable logic category alongside Microchip's RTAX-S and RTAX-DSP families, offering densities up to four million system gates.
Key features include SEU-hardened flip-flops that eliminate the need for Triple Module Redundancy (TMR), SEU immunity up to a specified LET threshold with an SEU error rate below 10-10 errors per bit-day, embedded SRAM blocks with built-in FIFO control logic, segmentable clocks, chip-wide highway routing, and carry logic for arithmetic functions. The device is live-at-power-up thanks to its flash-based programming model used during prototyping flows, providing a true single-chip form factor for space systems.
Technically, the RTAX-SL architecture derives from the commercial Axcelerator family, using a sea-of-modules fabric with registered logic modules, combinatorial delay as low as 0.93 ns in the -1 speed grade, and 1.5V (plus/minus 0.15V) core operation for low power consumption, which is critical for orbital platforms with limited solar budget.
Typical applications include satellite payload data processing, spacecraft bus control and telemetry, sensor interface and image preprocessing on Earth-observation platforms, and radiation-exposed avionics in deep-space missions.
Design consideration: use the Microchip Libero SoC design flow with the manufacturer's SEU mitigation guidelines, and follow the application note Prototyping for RTAX-S and RTAX-SL Devices, which uses a footprint-compatible adaptor board with an EDIF netlist and pinout convertor for easy migration from prototype to flight device.
This page synthesizes verified distributor data, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: RTAX250SL-CG624E — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: RTAX250SL-CG624E (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Radiation Tolerance, Process Technology, Core Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
RTAX250SL-CG624V
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$10000 / 개
데이터시트 보기 →RTAX250SL-CG624B
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3950 / 개
데이터시트 보기 →RTAX250SL-1CG624E
✅ 드롭인✓ 재고 있음
$1 / 개
데이터시트 보기 →RTAX250SL-LG624B
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2380 / 개
데이터시트 보기 →RTAX250SL-1LG624V
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$950 / 개
데이터시트 보기 →RTAX250S-CG624E
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →RTAX250SL-CG624E 최대 정격 & 전기적 특성
| Family | RTAX-S/SL Radiation-Tolerant FPGA |
| System Gates | 250000 |
| Logic Cells (CLBs) | 2816 |
| Maximum Frequency | 649 MHz |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V |
| Supply Voltage Tolerance | +/-0.15 V |
| Maximum Combinatorial Delay | 0.93 ns |
| 패키지 | 624-Pin CCGA (Ceramic Column Grid Array) |
| 동작 온도 | -55C to +125C |
| Logic Family | CMOS |
| Radiation Tolerance | SEU-hardened registers; SEU rate < 10-10 errors/bit-day |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking | Segmentable clocks, chip-wide highway routing |
| 실장 유형 | Surface Mount |
| Programmability | Live at power-up, true single-chip |
RTAX250SL-CG624E 624-pin ccga (ceramic column grid array) 핀 구성 가이드
RTAX250SL-CG624E(624-pin ccga (ceramic column grid array) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: RTAX250SL-CG624E.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
RTAX250SL-CG624E 적합 용도: 6 애플리케이션s: Satellite Payload Data Processing, Spacecraft Bus Control and Telemetry, Earth Observation Image Preprocessing, Deep-Space Avionics, Radiation-Exposed Sensor Interface Electronics, Launch Vehicle and Reentry Electronics.
Satellite Payload Data Processing
The RTAX250SL-CG624E fits satellite payload processing because its 250,000 system gates and 2816 CLBs provide enough fabric for high-throughput DSP pipelines, while the 649 MHz performance and 0.93 ns combinatorial delay support real-time data formatting, encryption, and compression chains. In orbit, the SEU-hardened registers eliminate TMR overhead, freeing routing resources that SRAM-based space FPGAs consume for redundancy, and the SEU rate below 10-10 errors/bit-day meets typical LEO and GEO mission error budgets. The part is placed between payload sensors/downconverters and the telemetry downlink, consuming 1.5V core power for an efficient solar-power budget. Unlike switching FPGA alternatives, it is live at power-up in a true single-chip form factor, simplifying boot sequencing in radiation-exposed electronics.
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Spacecraft Bus Control and Telemetry
Spacecraft bus controllers benefit from the RTAX250SL-CG624E's combination of deterministic performance and radiation tolerance. The embedded SRAM with built-in FIFO control logic implements telemetry buffering without external memory, while segmentable clocks allow multiple clock domains (attitude control, housekeeping, communication) on one chip with chip-wide highway routing preserving timing closure. The -55C to +125C operating range covers eclipse-cycle thermal swings on LEO platforms. At 1.5V core with a 0.15 um CMOS process, quiescent power stays low, which matters for bus electronics that run continuously. Because the device is live at power-up, boot-time telemetry is available immediately after solar-array deployment, a common mission-requirement driver. Its SEU-hardened flip-flops keep housekeeping state intact through single-event upsets without TMR.
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Earth Observation Image Preprocessing
Earth-observation payloads push high-rate sensor data through the RTAX250SL-CG624E for preprocessing tasks such as gain correction, bad-pixel replacement, and CCSDS-compliant data formatting. The 649 MHz capability and carry-logic arithmetic modules sustain multi-channel pixel pipelines, while embedded SRAM FIFOs decouple imager frame rates from downlink rates. The 624-column CCGA package provides abundant user I/O for parallel sensor interfaces, and the SEU-hardened registers preserve frame integrity under radiation without TMR resource penalties. Low 1.5V-core power consumption is essential because imaging payloads share a constrained power budget with downlink amplifiers. Designs typically pair the FPGA with precision ADCs and use the Libero SoC flow with the manufacturer's SEU-mitigation guidelines for verification.
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Deep-Space Avionics
Deep-space missions face higher radiation exposure than LEO missions, making the RTAX250SL-CG624E's SEU-hardened registers and sub-10-10 errors/bit-day rate directly relevant to avionics reliability. The device implements command decoders, fault-management state machines, and interface bridges between the flight computer and instruments. The -55C to +125C range accommodates cold-junction environments far from solar heating, and the ceramic CCGA-624 package withstands launch vibration and thermal cycling better than plastic encapsulated parts. Because it operates live at power-up from a single chip, the architecture avoids configuration-memory scrubbing hardware required by SRAM FPGAs, reducing parts count and failure modes in systems that cannot be serviced after launch. Timing margin can be improved by selecting the -1 speed grade drop-in variant.
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Radiation-Exposed Sensor Interface Electronics
Sensor interface chains in space platforms use the RTAX250SL-CG624E to condition, time-stamp, and packetize data from star trackers, inertial sensors, and particle detectors. The 2816 CLBs implement per-channel filters and serial interfaces, while segmentable clocks isolate noisy sensor timing domains from the spacecraft backplane clock. Chip-wide highway routing helps distribute high-fanout strobes with low skew across the 624-column package's wide I/O ring. SEU-hardened flip-flops keep calibration and gain tables intact through radiation events, avoiding recalibration cycles that degrade science-data uptime. The 1.5V supply and 0.15 um process keep interface electronics cool inside thermally isolating sensor housings. Designs prototype on the footprint-compatible adaptor-board methodology from the Microchip application note Prototyping for RTAX-S and RTAX-SL Devices.
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Launch Vehicle and Reentry Electronics
Launch vehicles and reentry systems demand electronics that survive extreme vibration, shock, and brief thermal excursions; the RTAX250SL-CG624E's ceramic column grid array package and -55C to +125C rating address these constraints. The FPGA implements sequencer logic, flight-termination interface logic, and telemetry encoding with deterministic 0.93 ns combinatorial paths and 649 MHz capability. Single-chip, live-at-power-up operation eliminates boot-latency concerns in systems that must respond within milliseconds of ignition commands. The SEU-hardened registers resist high-altitude radiation exposure during ascent through the South Atlantic Anomaly and polar trajectories without external scrubbing. Designers typically select the -1 speed grade variant (RTAX250SL-1CG624E) for additional timing margin on safety-critical paths, and verify column attachment per the datasheet CCGA mounting guidelines.
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추천 제품 요약
엔지니어링 참조 데이터: RTAX250SL-CG624E — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | RTAX250SL-CG624V | RTAX250SL-1CG624E | RTAX250S-CG624E | RTAX250SL-1LG624V |
|---|---|---|---|---|---|
| Package | CCGA-624 | CCGA-624 - same | CCGA-624 - same | CCGA-624 - same | 624-pin ceramic (L variant) |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250000 | 250000 | 250000 | 250000 | 250000 |
| Logic Cells (CLBs) | 2816 | 2816 | 2816 | 2816 | 2816 |
| Speed Grade | Standard | Standard | -1 (faster) | Standard | -1 (faster) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| SEU Hardening | SEU-hardened registers, rate < 10-10 errors/bit-day | Same SEU hardening | Same SEU hardening | Same SEU hardening | Same SEU hardening |
주요 차별점
- SEU-hardened registers eliminate TMR overhead (vs SRAM-based space FPGAs)
- Live-at-power-up single-chip operation (vs RTAX250SL-1CG624E)
- Same-footprint speed-grade and flow flexibility (vs RTAX250S-CG624E)
- Trade-off: single-source space-grade device (vs RTAX250SL-1LG624V)
설계 노트
Provide a clean 1.5V core supply within +/-0.15V tolerance per the Microchip USA and datasheet requirements. Use a low-noise point-of-load regulator or LDO with local bulk and 0.1 uF ceramic decoupling at each VCCI column group on the CCGA-624 footprint. The separate VCCA analog supply for PLLs should be filtered (ferrite + capacitors) to keep jitter low for the 649 MHz-class timing paths. Estimated: noise-induced jitter grows with supply ripple, so keep rail ripple well below 1% for the 0.93 ns combinatorial paths of the -1 speed grade.
The CCGA-624 ceramic column grid array requires careful land-pattern design and rework planning: columns are not reflowed like BGA balls, so follow the Microchip datasheet CCGA mounting and column-attachment guidelines, and use X-ray or acoustic inspection to verify column joints under the package. Avoid board warpage across the 624-column array; specify high-Tg laminate and balanced copper. Plan test access since column joints cannot be probed directly; boundary-scan JTAG coverage should be exercised during design.
Do not assume TMR is required everywhere: the RTAX-SL SEU-hardened registers already eliminate most TMR needs per the datasheet, but configuration-sequence and I/O-related mitigation requirements in the Microchip SEU mitigation guidelines still apply. For prototyping, use the manufacturer's application note Prototyping for RTAX-S and RTAX-SL Devices, which employs a footprint-compatible adaptor board and an EDIF netlist and pinout convertor for easy migration - do not hand-remap pins between prototype and flight devices.
Although the 0.15 um process at 1.5V is low-power, thermal design still matters inside sealed avionics boxes. Estimated: junction temperature must be kept within the -55C to +125C rating; compute internal dissipation from your actual toggle rates in the Libero power estimator and verify that the CCGA-to-heat-sink path (often through a thermal wedge-lock in conduction-cooled spaceflight enclosures) keeps Tj below the limit at worst-case hot conditions.
규정 준수 정보
Compliance data not present in retrieved web data. Space-grade ceramic CCGA packages may carry high-lead solder exemptions; confirm via Microchip product page and compliance certificates before procurement.
