RTAX250SL-CG624E - 250K-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX250SL-CG624E ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1590 | $159,000.00 |
| 500 | $1480 | $740,000.00 |
| 1,000 | $1375 | $1,375,000.00 |
Drop-in alternatives for RTAX250SL-CG624E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX250SL-CG624V
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$10000 / Unit
View Datasheet →RTAX250SL-CG624B
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3950 / Unit
View Datasheet →RTAX250SL-1CG624E
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$1 / Unit
View Datasheet →RTAX250SL-LG624B
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2380 / Unit
View Datasheet →RTAX250SL-1LG624V
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$950 / Unit
View Datasheet →RTAX250S-CG624E
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →RTAX250SL-CG624E Maximum Ratings & Electrical Characteristics
| Family | RTAX-S/SL Radiation-Tolerant FPGA |
| System Gates | 250000 |
| Logic Cells (CLBs) | 2816 |
| Maximum Frequency | 649 MHz |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V |
| Supply Voltage Tolerance | +/-0.15 V |
| Maximum Combinatorial Delay | 0.93 ns |
| Package | 624-Pin CCGA (Ceramic Column Grid Array) |
| Operating Temperature | -55C to +125C |
| Logic Family | CMOS |
| Radiation Tolerance | SEU-hardened registers; SEU rate < 10-10 errors/bit-day |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking | Segmentable clocks, chip-wide highway routing |
| Mounting Type | Surface Mount |
| Programmability | Live at power-up, true single-chip |
RTAX250SL-CG624E 624-pin ccga (ceramic column grid array) Pin Configuration Guide
Complete pinout information for RTAX250SL-CG624E (624-pin ccga (ceramic column grid array) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX250SL-CG624E.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX250SL-CG624E is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Bus Control and Telemetry, Earth Observation Image Preprocessing, Deep-Space Avionics, Radiation-Exposed Sensor Interface Electronics, Launch Vehicle and Reentry Electronics.
Satellite Payload Data Processing
The RTAX250SL-CG624E fits satellite payload processing because its 250,000 system gates and 2816 CLBs provide enough fabric for high-throughput DSP pipelines, while the 649 MHz performance and 0.93 ns combinatorial delay support real-time data formatting, encryption, and compression chains. In orbit, the SEU-hardened registers eliminate TMR overhead, freeing routing resources that SRAM-based space FPGAs consume for redundancy, and the SEU rate below 10-10 errors/bit-day meets typical LEO and GEO mission error budgets. The part is placed between payload sensors/downconverters and the telemetry downlink, consuming 1.5V core power for an efficient solar-power budget. Unlike switching FPGA alternatives, it is live at power-up in a true single-chip form factor, simplifying boot sequencing in radiation-exposed electronics.
Recommended
Spacecraft Bus Control and Telemetry
Spacecraft bus controllers benefit from the RTAX250SL-CG624E's combination of deterministic performance and radiation tolerance. The embedded SRAM with built-in FIFO control logic implements telemetry buffering without external memory, while segmentable clocks allow multiple clock domains (attitude control, housekeeping, communication) on one chip with chip-wide highway routing preserving timing closure. The -55C to +125C operating range covers eclipse-cycle thermal swings on LEO platforms. At 1.5V core with a 0.15 um CMOS process, quiescent power stays low, which matters for bus electronics that run continuously. Because the device is live at power-up, boot-time telemetry is available immediately after solar-array deployment, a common mission-requirement driver. Its SEU-hardened flip-flops keep housekeeping state intact through single-event upsets without TMR.
Recommended
Earth Observation Image Preprocessing
Earth-observation payloads push high-rate sensor data through the RTAX250SL-CG624E for preprocessing tasks such as gain correction, bad-pixel replacement, and CCSDS-compliant data formatting. The 649 MHz capability and carry-logic arithmetic modules sustain multi-channel pixel pipelines, while embedded SRAM FIFOs decouple imager frame rates from downlink rates. The 624-column CCGA package provides abundant user I/O for parallel sensor interfaces, and the SEU-hardened registers preserve frame integrity under radiation without TMR resource penalties. Low 1.5V-core power consumption is essential because imaging payloads share a constrained power budget with downlink amplifiers. Designs typically pair the FPGA with precision ADCs and use the Libero SoC flow with the manufacturer's SEU-mitigation guidelines for verification.
Recommended
Deep-Space Avionics
Deep-space missions face higher radiation exposure than LEO missions, making the RTAX250SL-CG624E's SEU-hardened registers and sub-10-10 errors/bit-day rate directly relevant to avionics reliability. The device implements command decoders, fault-management state machines, and interface bridges between the flight computer and instruments. The -55C to +125C range accommodates cold-junction environments far from solar heating, and the ceramic CCGA-624 package withstands launch vibration and thermal cycling better than plastic encapsulated parts. Because it operates live at power-up from a single chip, the architecture avoids configuration-memory scrubbing hardware required by SRAM FPGAs, reducing parts count and failure modes in systems that cannot be serviced after launch. Timing margin can be improved by selecting the -1 speed grade drop-in variant.
Recommended
Radiation-Exposed Sensor Interface Electronics
Sensor interface chains in space platforms use the RTAX250SL-CG624E to condition, time-stamp, and packetize data from star trackers, inertial sensors, and particle detectors. The 2816 CLBs implement per-channel filters and serial interfaces, while segmentable clocks isolate noisy sensor timing domains from the spacecraft backplane clock. Chip-wide highway routing helps distribute high-fanout strobes with low skew across the 624-column package's wide I/O ring. SEU-hardened flip-flops keep calibration and gain tables intact through radiation events, avoiding recalibration cycles that degrade science-data uptime. The 1.5V supply and 0.15 um process keep interface electronics cool inside thermally isolating sensor housings. Designs prototype on the footprint-compatible adaptor-board methodology from the Microchip application note Prototyping for RTAX-S and RTAX-SL Devices.
Recommended
Launch Vehicle and Reentry Electronics
Launch vehicles and reentry systems demand electronics that survive extreme vibration, shock, and brief thermal excursions; the RTAX250SL-CG624E's ceramic column grid array package and -55C to +125C rating address these constraints. The FPGA implements sequencer logic, flight-termination interface logic, and telemetry encoding with deterministic 0.93 ns combinatorial paths and 649 MHz capability. Single-chip, live-at-power-up operation eliminates boot-latency concerns in systems that must respond within milliseconds of ignition commands. The SEU-hardened registers resist high-altitude radiation exposure during ascent through the South Atlantic Anomaly and polar trajectories without external scrubbing. Designers typically select the -1 speed grade variant (RTAX250SL-1CG624E) for additional timing margin on safety-critical paths, and verify column attachment per the datasheet CCGA mounting guidelines.
Recommended
Recommended Products Summary
Engineering reference data for RTAX250SL-CG624E — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX250SL-CG624V | RTAX250SL-1CG624E | RTAX250S-CG624E | RTAX250SL-1LG624V |
|---|---|---|---|---|---|
| Package | CCGA-624 | CCGA-624 - same | CCGA-624 - same | CCGA-624 - same | 624-pin ceramic (L variant) |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250000 | 250000 | 250000 | 250000 | 250000 |
| Logic Cells (CLBs) | 2816 | 2816 | 2816 | 2816 | 2816 |
| Speed Grade | Standard | Standard | -1 (faster) | Standard | -1 (faster) |
| Max Combinatorial Delay | [DATA_NEEDED] | [DATA_NEEDED] | 0.93 ns | [DATA_NEEDED] | 0.93 ns (-1 grade) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| SEU Hardening | SEU-hardened registers, rate < 10-10 errors/bit-day | Same SEU hardening | Same SEU hardening | Same SEU hardening | Same SEU hardening |
Key Differentiators
- SEU-hardened registers eliminate TMR overhead (vs SRAM-based space FPGAs)
- Live-at-power-up single-chip operation (vs RTAX250SL-1CG624E)
- Same-footprint speed-grade and flow flexibility (vs RTAX250S-CG624E)
- Trade-off: single-source space-grade device (vs RTAX250SL-1LG624V)
Design Notes
Provide a clean 1.5V core supply within +/-0.15V tolerance per the Microchip USA and datasheet requirements. Use a low-noise point-of-load regulator or LDO with local bulk and 0.1 uF ceramic decoupling at each VCCI column group on the CCGA-624 footprint. The separate VCCA analog supply for PLLs should be filtered (ferrite + capacitors) to keep jitter low for the 649 MHz-class timing paths. Estimated: noise-induced jitter grows with supply ripple, so keep rail ripple well below 1% for the 0.93 ns combinatorial paths of the -1 speed grade.
The CCGA-624 ceramic column grid array requires careful land-pattern design and rework planning: columns are not reflowed like BGA balls, so follow the Microchip datasheet CCGA mounting and column-attachment guidelines, and use X-ray or acoustic inspection to verify column joints under the package. Avoid board warpage across the 624-column array; specify high-Tg laminate and balanced copper. Plan test access since column joints cannot be probed directly; boundary-scan JTAG coverage should be exercised during design.
Do not assume TMR is required everywhere: the RTAX-SL SEU-hardened registers already eliminate most TMR needs per the datasheet, but configuration-sequence and I/O-related mitigation requirements in the Microchip SEU mitigation guidelines still apply. For prototyping, use the manufacturer's application note Prototyping for RTAX-S and RTAX-SL Devices, which employs a footprint-compatible adaptor board and an EDIF netlist and pinout convertor for easy migration - do not hand-remap pins between prototype and flight devices.
Although the 0.15 um process at 1.5V is low-power, thermal design still matters inside sealed avionics boxes. Estimated: junction temperature must be kept within the -55C to +125C rating; compute internal dissipation from your actual toggle rates in the Libero power estimator and verify that the CCGA-to-heat-sink path (often through a thermal wedge-lock in conduction-cooled spaceflight enclosures) keeps Tj below the limit at worst-case hot conditions.
Compliance Information
Compliance data not present in retrieved web data. Space-grade ceramic CCGA packages may carry high-lead solder exemptions; confirm via Microchip product page and compliance certificates before procurement.
