RTAX250S-CG624B - 250K Gate Rad-Tolerant FPGA CCGA-624 | Microchip
부품 번호: RTAX250S-CG624B ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3500 | $3,500.00 |
| 10 | $3325 | $33,250.00 |
| 100 | $3150 | $315,000.00 |
| 500 | $2975 | $1,487,500.00 |
| 1,000 | $2800 | $2,800,000.00 |
RTAX250S-CG624B 개요
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the heavy-ion and proton environments encountered in Earth-orbiting and deep-space missions. Within the space-grade programmable logic hierarchy, the RTAX-S family sits alongside one-time-programmable antifuse architectures, providing a true single-chip, live-at-power-up solution that does not require external configuration devices such as flash or PROM memories.
Key features include SEU-hardened flip-flops that eliminate the need for triple-module redundancy (TMR) in many designs, immunity to single-event upsets to a specified LET threshold with SEU rates below 10^-10 errors per bit-day, embedded SRAM blocks with built-in FIFO control logic, segmentable clock structures, and chip-wide routing highways. The CCGA-624 ceramic package provides the mechanical robustness and thermal performance required for launch vibration and vacuum operation.
The architecture is derived from the commercial Axcelerator family, giving designers proven logic fabric with a speed grade option (the -1 grade is approximately 15% faster than standard) and operating temperature of -55C to +125C. CMOS 0.15 um technology delivers low static power, an important consideration for power-budget-limited spacecraft buses.
Typical applications include payload data processing, spacecraft bus controllers, telemetry and telecommand interfaces, and sensor front-end glue logic on LEO, GEO, and interplanetary missions where radiation tolerance and live-at-power-up behavior are mission-critical.
A key design consideration is that RTAX-S antifuse devices are one-time programmable: programming is final, so designers prototype on commercial Axcelerator parts or Microchip extender boards (per application note AC170) before committing flight hardware.
This page adds value beyond the manufacturer datasheet by consolidating drop-in package-compatible alternatives, cross-reference options, and pricing tiers for supply-chain planning.
드롭인 대체품: RTAX250S-CG624B — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: RTAX250S-CG624B (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Family, Package, Logic Cells (CLBs), Radiation Tolerance.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
RTAX250SL-1CG624B
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →RTAX250S-1CG624B
✅ 드롭인✓ 재고 있음
$1 / 개
데이터시트 보기 →RTAX250S-1CG624E
✅ 드롭인✓ 재고 있음
$960 / 개
데이터시트 보기 →RTAX250SL-CG624V
✅ 드롭인✓ 재고 있음
$10000 / 개
데이터시트 보기 →RTAX250SL-CG624E
✅ 드롭인✓ 재고 있음
$1375 / 개
데이터시트 보기 →RTAX250SL-1CG624B
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →RTAX250S-CG624B 최대 정격 & 전기적 특성
| System Gates | 250000 gates |
| Logic Cells (CLBs) | 2816 cells |
| Maximum System Frequency | 649 MHz |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V |
| Package Type | CCGA-624 (Ceramic Column Grid Array, 624 pins) |
| Logic Family | CMOS |
| 동작 온도 | -55C to +125C |
| Radiation Tolerance | SEU rate < 10^-10 errors/bit-day; SEU-hardened registers |
| Configuration | One-time programmable antifuse, live at power-up |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Product Family | RTAX-S / RTAX-SL Radiation-Tolerant FPGA |
| Architecture Basis | Microsemi Axcelerator commercial family |
| TMR Requirement | Eliminated for registers via SEU hardening |
| 실장 유형 | Surface Mount |
| Speed Grade Option | Standard; -1 grade approximately 15% faster |
RTAX250S-CG624B ccga-624 (ceramic column grid array, 624 pins) 핀 구성 가이드
RTAX250S-CG624B(ccga-624 (ceramic column grid array, 624 pins) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: RTAX250S-CG624B.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
RTAX250S-CG624B 적합 용도: 6 애플리케이션s: Payload Data Processing, Spacecraft Bus Control, Telemetry and Telecommand Interfaces, Instrument and Sensor Front Ends, Attitude Determination and Control, Rad-Hard Glue Logic Replacement.
Payload Data Processing
The RTAX250S-CG624B fits onboard payload processing where 250,000 gates and 2,816 CLBs provide enough fabric for image compression, packetization, and FFT acceleration while drawing minimal static power from the 1.5 V core on a 0.15 um CMOS process. Its SEU-hardened registers allow single-chip implementation without blanket TMR, keeping timing closure feasible at speeds up to 649 MHz for internal paths. Designers typically implement high-throughput datapaths in the core fabric and use embedded SRAM with built-in FIFO control for buffering between sensor interfaces and downlink formatters, exploiting the single-chip, live-at-power-up antifuse architecture to eliminate external configuration memory in the payload bay.
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Spacecraft Bus Control
For command and data handling (C&DH) units, the RTAX250S-CG624B implements MIL-STD-1553, SpaceWire, and CAN-style bus controllers within its 2,816-cell fabric, surviving the -55C to +125C military temperature range typical of bus electronics. Live-at-power-up antifuse configuration ensures the FPGA is functional immediately after a brownout or safe-mode power cycle, which is essential for autonomous fault recovery. The CCGA-624 ceramic package provides the column-array mechanical reliability and board-level testability demanded by launch environments, and SEU rates below 10^-10 errors per bit-day keep control-plane corruption risk within typical mission assurance budgets without triple module redundancy on every register.
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Telemetry and Telecommand Interfaces
The RTAX250S-CG624B suits TM/TC front ends that must decode uplink commands and format downlink frames deterministically. Its segmentable clock structures let designers isolate the telecommand decoder clock domain from the payload clock domain, while chip-wide highway routing simplifies frame-buffer interconnect across the 250K-gate die. Embedded SRAM blocks with FIFO control logic stage telemetry packets without external SRAM, reducing part count on a radiation-sensitive board. Because the device is one-time programmable and live at power-up, the command decoder is available within microseconds of switch-on - a requirement for acquiring beacon signals immediately after launch vehicle separation and first Sun-point.
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Instrument and Sensor Front Ends
Scientific instruments on LEO and interplanetary missions use the RTAX250S-CG624B to time-stamp, decimate, and buffer high-rate sensor streams before compression. The 649 MHz-class fabric performance supports pipelined accumulation and correlation engines, and the 624 available user I/O columns interface dense detector arrays through the wide CCGA-624 ballout. SEU-hardened registers protect accumulation results in proton-rich orbits up to the family's specified LET threshold, and the -55C to +125C operating range covers cryo-instrument warm electronics compartments. Designers prototype the algorithm on commercial Axcelerator silicon using Microchip extender boards per application note AC170 before committing flight antifuse devices.
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Attitude Determination and Control
Attitude control electronics benefit from the RTAX250S-CG624B's deterministic single-chip implementation of star-tracker preprocessing, gyro co-addition, and PWM drive interfaces. The low static power of 0.15 um CMOS at a 1.5 V core helps meet the tight power budgets of small reaction-wheel controllers, while SEU rates below 10^-10 errors per bit-day keep control-loop state corruption negligible across a 5-year LEO mission without per-register TMR. The CCGA-624 ceramic package withstands launch vibration and thermal cycling from -55C to +125C, and live-at-power-up operation guarantees the safe-hold controller boots before ground contact during contingency recovery scenarios.
추천
Rad-Hard Glue Logic Replacement
Many legacy spacecraft boards replace dozens of rad-hard ASICs and SSI/MSI parts with a single RTAX250S-CG624B, cutting board area, mass, and assembly radiation screening cost. With 2,816 CLBs and up to 649 MHz internal performance, address decoders, bus bridges, interrupt controllers, and watchdog logic consolidate into one antifuse device that is live at power-up - eliminating PROM-based configuration that would otherwise fail single-event latch-up screening. The 624-pin CCGA provides ample I/O for legacy backplane interfaces, and because the fabric is derived from the commercial Axcelerator family, design reuse and timing sign-off flows carry over directly from prior programs.
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추천 제품 요약
엔지니어링 참조 데이터: RTAX250S-CG624B — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | RTAX250SL-1CG624B | RTAX250S-1CG624B | RTAX250S-1CG624E | RTAX250SL-CG624V | RTAX250SL-CG624E |
|---|---|---|---|---|---|---|
| Package | CCGA-624 | CCGA-624 - same | CCGA-624 - same | CCGA-624 - same | CCGA-624 - same | CCGA-624 - same |
| Brand | Microchip Technology (Actel/Microsemi legacy) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Cells (CLBs) | 2,816 | 2,816 | 2,816 | 2,816 | 2,816 | 2,816 |
| Speed Grade | Standard | -1 (approx. 15% faster) | -1 (approx. 15% faster) | -1 (approx. 15% faster) | Standard | Standard |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Silicon / Qualification Flow | S silicon, B flow | SL silicon, B flow | S silicon, B flow | S silicon, E flow | SL silicon, V flow | SL silicon, E flow |
주요 차별점
- Standard speed grade at lower cost (vs RTAX250S-1CG624B)
- Improved radiation performance option (vs RTAX250SL-1CG624B)
- Single-chip live-at-power-up configuration (vs SRAM-based space FPGAs (e.g., Xilinx Virtex families))
설계 노트
RTAX-S antifuse FPGAs are one-time programmable - a programming error consumes a flight device costing thousands of dollars. Prototype the complete design on commercial Axcelerator silicon using Microchip extender circuit boards that map commercial packages to RTAX-S footprints (per Microchip application note AC170), and run full timing sign-off in Libero before programming flight parts. Also confirm whether your mission assurance plan requires the B, E, or V qualification flow, since these are not interchangeable after the fact.
The 1.5 V core supply of the RTAX250S must be decoupled with low-ESR ceramics placed at the CCGA-624 power columns, and the I/O bank supplies must be sequenced per the RTAX-S/SL datasheet power-up requirements to avoid latch-up during hot launch-pad conditions. Estimated: verify core current against your design's utilization in Libero SmartPower rather than assuming datasheet typicals, since antifuse static current scales with used routing resources, not raw gate count.
Ceramic column grid arrays require different land patterns than BGA balls: columns tolerate Z-axis thermal expansion mismatch with the PCB, which is why the CG624 package is preferred for flight boards. Follow the datasheet mechanical drawing for pad geometry and use nominal 0.4-0.5 mm sequence-resistant solder mask defined pads; inspect with X-ray after reflow since columns hide cold joints. Plan test access to the JTAG columns for programming before final board coating.
With 624 I/O columns on a 1.27 mm pitch array, power-integrity planning matters: distribute ground columns to minimize return-path loops and assign each I/O bank a local decoupling network. Simultaneous switching output noise on wide buses should be checked in Libero; stagger output edges or use slew-limited I/O standards on high fanout strobes. Segmentable clock resources allow isolated clock domains - route each domain's clock through its own segment to limit crosstalk-sensitive skew.
규정 준수 정보
Space-grade ceramic CCGA package; hermetic ceramic packaging is typically exempt from some commercial RoHS constraints but XAIPART has no verified compliance data for this MPN - consult Microchip for flight-lot compliance certificates.
