SPC5642AF2MVZ1 - 32-bit 150MHz 2MB Flash Auto MCU | NXP
부품 번호: SPC5642AF2MVZ1 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.1 | $261.00 |
| 100 | $23.4 | $2,340.00 |
| 500 | $21.2 | $10,600.00 |
| 1,000 | $19.8 | $19,800.00 |
SPC5642AF2MVZ1 개요
A 32-bit automotive MCU is a system-on-chip that integrates a processor core, flash memory, SRAM, and a rich set of peripherals such as ADCs, timers, and communication interfaces (CAN, LIN, FlexRay-capable ecosystems) onto a single die. Within the semiconductor hierarchy, it sits under microcontrollers -> embedded processors -> automotive powertrain semiconductors, serving as the central real-time control element of an electronic control unit (ECU).
Key features of the SPC5642AF2MVZ1 include the single-issue e200z4 core delivering higher performance than single-issue cores of prior MPC5600-family devices at the same frequency, a large 2 MB flash array for complex control algorithms, and operation across -40 to +105 degrees C for harsh under-hood environments. According to NXP product documentation, the MPC564xA family is designed to lower overall system cost in mid-range gasoline and direct-injection engine management, advanced transmission control, and industrial applications.
Technically, the device is a 32-bit SoC compatible with Freescale's MPC5600 family, offering performance beyond the MPC5632M devices. The Power Architecture core provides deterministic real-time response, which is essential for closed-loop combustion and gearbox control where interrupt latency directly affects emissions and drivability. Multi-supply operation at 1.2 V, 3.3 V, and 5 V domains eases integration with legacy 5 V automotive sensors.
Typical applications include mid-range gasoline engine control units, direct-injection engine ECUs, automatic transmission control modules, and demanding industrial real-time control systems where an automotive-qualified part is preferred for robustness.
A key design consideration is the 324-ball PBGA footprint: plan a multi-layer PCB with controlled impedance and adequate via fan-out for the ball field, and verify flash retention and junction temperature at maximum ambient plus self-heating under worst-case load.
This page synthesizes distributor pricing, drop-in alternatives, design notes, and AEO-structured FAQs not found together on the manufacturer datasheet, with all data verified against distributor listings as of 2026-10-18.
드롭인 대체품: SPC5642AF2MVZ1 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: SPC5642AF2MVZ1 (동일 폼 팩터 및 풋프린트) — 차이점: Core Processor, Grade, Package, Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
SPC5642AF2MVZ2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SPC5642AF2MVZ2R
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SPC5642AF2MLU1
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$21.23 / 개
데이터시트 보기 →SPC5642AF2MVZ1 최대 정격 & 전기적 특성
| Core Processor | e200z4 Power Architecture (Qorivva MPC56xx) |
| Core Size | 32-Bit |
| 최대 클록 주파수 | 150 MHz |
| Flash Memory Size | 2 MB (2M x 8) |
| 공급 전압 | 1.2 V / 3.3 V / 5 V |
| 동작 온도 범위 | -40C to +105C |
| Grade | Automotive |
| 패키지 | 324-PBGA (23 x 23 mm) |
| 실장 유형 | Surface Mount |
| Terminal Form | Ball (BGA) |
| Product Family | MPC564xA (SPC5642) |
| Application Target | Engine control, transmission control, industrial |
| Family Compatibility | Compatible with Freescale MPC5600 family |
SPC5642AF2MVZ1 324-pbga (23 x 23 mm) 핀 구성 가이드
SPC5642AF2MVZ1(324-pbga (23 x 23 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: SPC5642AF2MVZ1.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
SPC5642AF2MVZ1 적합 용도: 6 애플리케이션s: Mid-Range Gasoline Engine Control Unit, Direct-Injection Engine Management, Automatic Transmission Control, Industrial Real-Time Control Systems, Body Control and Gateway Modules, Emission-Critical Powertrain Calibration Platforms.
Mid-Range Gasoline Engine Control Unit
The SPC5642AF2MVZ1 fits mid-range gasoline ECUs because its 150 MHz e200z4 Power Architecture core executes crank-angle-synchronous combustion control loops with deterministic latency, and its 2 MB flash stores knock control, lambda closed-loop, and OBD-II emissions algorithms. Per NXP documentation the MPC564xA family explicitly addresses harsh mid-range gasoline engine environments, and the -40 to +105 degrees C automotive rating covers engine-bay mounting. In use, the MCU samples wideband oxygen, MAP, and knock sensors through its ADCs, drives injectors and ignition via timer peripherals, and communicates on CAN. Unlike a general-purpose MCU, the powertrain-focused timer subsystem reduces external components, but designers must budget flash and CPU headroom for future emissions calibration updates.
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Direct-Injection Engine Management
For gasoline direct-injection (GDI) systems, the SPC5642AF2MVZ1 provides the precise high-pressure injection timing that GDI demands: the e200z4 core at 150 MHz handles the fast injector current-control loops and rail-pressure regulation, while 2 MB flash hosts the significantly larger calibration maps GDI strategies require. NXP positions the MPC564xA family specifically for direct-injection engines in harsh environments. The 5 V-tolerant supply domain eases interfacing with legacy 5 V rail-pressure and cam-position sensors common in GDI systems. Implementation places the MCU as the ECU master driving gate drivers for the high-pressure pump and injectors; the trade-off versus smaller MPC5600 parts is power consumption and PCB complexity of the 324-ball footprint, justified by the added control sophistication.
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Automatic Transmission Control
Advanced transmission control units benefit from the SPC5642AF2MVZ1's real-time determinism: solenoid current control for shift quality, adaptive shift-point learning, and torque-request coordination with the engine ECU all run as time-triggered tasks on the e200z4 core at 150 MHz. The 2 MB flash supports adaptive and self-learning transmission calibrations, and the -40 to +105 degrees C rating suits transmission-mounted controllers exposed to sustained heat and vibration. Per NXP, the MPC564xA family targets advanced transmissions explicitly. The MCU interfaces with wheel-speed and turbine-speed sensors, drives proportional solenoids via PWM timers, and exchanges torque requests over CAN. Compared with the SPC5553, this part offers lower cost for mid-range boxes; verify flash endurance against expected reflash count over vehicle life.
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Industrial Real-Time Control Systems
Beyond automotive, NXP notes the MPC564xA family addresses industrial applications, and the SPC5642AF2MVZ1's automotive-grade construction gives industrial designers a robustness margin: -40 to +105 degrees C operation, Power Architecture real-time performance at 150 MHz, and 2 MB flash for protocol stacks and control algorithms. Typical uses include motor drives, inverters, and industrial automation controllers where deterministic interrupt response matters more than peak MIPS. The 324-ball PBGA provides ample GPIO and peripheral pins for multi-axis control, while the 1.2/3.3/5 V supply domains simplify mixing legacy 5 V I/O with modern 3.3 V logic. The consideration is availability: industrial buyers should secure long-term supply agreements since this part is primarily an automotive program component.
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Body Control and Gateway Modules
The SPC5642AF2MVZ1 can serve as the gateway or central controller in body-domain architectures where its 150 MHz core handles CAN routing, diagnostics (UDS), and flash bootloader functions simultaneously, while the 2 MB flash stores multiple protocol stacks and OTA-update images. Its automotive qualification and -40 to +105 degrees C range suit modules mounted in the engine compartment or under the dashboard near heat sources. In a gateway role, the part's abundant I/O from the 324-ball package bridges multiple CAN channels and LIN networks; NXP's MPC5600-family compatibility means existing CAN driver software ports directly. Trade-off: lower-cost S12-based MCUs suffice for pure body functions, so reserve this part for modules that also perform compute-heavy gateway or security tasks.
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Emission-Critical Powertrain Calibration Platforms
Development and calibration ECUs for powertrain programs exploit the SPC5642AF2MVZ1's 2 MB flash and 150 MHz e200z4 core to run instrumented firmware with measurement hooks, ASAP2/CCP/XCP calibration protocols, and bypass-model implementations during dynamometer testing. Because the device is the same silicon as the production ECU, calibration data generated on this platform transfers directly to series hardware, eliminating silicon-behavior mismatch. NXP's MPC5600-family compatibility means existing calibration toolchains and debugger configurations carry over from MPC5632M projects. Practical setup pairs the MCU with a JTAG/Nexus debug probe and dual CAN channels for CCP traffic; designers should reserve flash sectors for the calibration monitor and verify that measurement overhead stays within real-time budget at 150 MHz.
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추천 제품 요약
엔지니어링 참조 데이터: SPC5642AF2MVZ1 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | SPC5642AF2MVZ2 | SPC5642AF2MVZ2R | SPC5642AF2MLU1 |
|---|---|---|---|---|
| Package | 324-PBGA (23 x 23 mm) | 324-PBGA - same | 324-PBGA - same | 324-PBGA - same (verify ball map) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | e200z4 Power Architecture, 32-bit | e200z4, 32-bit | e200z4, 32-bit | e200z4, 32-bit |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB |
| Operating Temperature | -40C to +105C (automotive) | -40C to +105C (automotive) | -40C to +105C (automotive) | -40C to +105C (automotive) |
| Primary Application | Engine and transmission control | Engine and transmission control | Engine and transmission control | Engine and transmission control |
주요 차별점
- 150 MHz e200z4 performance headroom (vs MPC5632M)
- Identical footprint drop-in within family (vs SPC5642AF2MVZ2)
- Full I/O complement of 324 balls (vs SPC5642AF2MLU1)
설계 노트
The 324-ball PBGA (23 x 23 mm) requires a minimum 8-layer PCB with via-in-pad or dog-bone fan-out on a 1.0 mm or finer ball pitch. Plan power and ground ball assignments to a dedicated internal power plane, and reserve outer layers for the wide address/data and peripheral buses. Specify X-ray inspection at contract manufacture, since BGA solder joints cannot be visually inspected. Follow NXP's package handling and reflow recommendations for organic-substrate PBGA packages to avoid warpage during lead-free reflow.
The device operates from 1.2 V (core), 3.3 V, and 5 V domains. Estimate: at 150 MHz, core current draw of tens to hundreds of milliamps on the 1.2 V rail is typical for this class - derive the exact figure from the manufacturer datasheet current-consumption tables for your clock configuration, and size the core regulator with at least 50% margin. Sequence the 1.2 V core rail relative to the 3.3/5 V I/O rails per the datasheet power-up requirements, and add local decoupling (100 nF per power ball group plus bulk 10 uF) close to each supply domain.
Common pitfalls with MPC564xA designs: (1) forgetting the flash programming/erase voltage requirements during in-application reprogramming, which can corrupt calibration sectors; (2) underestimating watchdog timing - the e200z4 core clock configuration must be validated before enabling the internal watchdog; (3) migrating code from MPC5632M without checking peripheral clock differences, since the SPC5642 runs at 150 MHz versus lower MPC5600 frequencies. Always run NXP's clock-configuration utility and validate flash retention across the full -40 to +105 degrees C range during qualification.
규정 준수 정보
Listed as Automotive Grade in distributor data (Mouser, DigiKey, Vyrian), implying automotive qualification; specific RoHS/REACH/lead-free declarations should be confirmed on the NXP product page compliance documents.
