W634GU6RB-12 - 4Gb DDR3L SDRAM x16 933MHz | Winbond
부품 번호: W634GU6RB-12 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $13.87 | $13.87 |
| 10 | $12.5 | $125.00 |
| 100 | $11.2 | $1,120.00 |
| 500 | $10.1 | $5,050.00 |
| 1,000 | $9.5 | $9,500.00 |
W634GU6RB-12 개요
DDR3L SDRAM is a type of double data rate synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining similar performance. It is part of the DDR3 memory family, which uses 8n-prefetch architecture and on-die termination to achieve high data rates. DDR3L is widely used in mobile, embedded, and industrial systems where power efficiency is critical.
Key features include a 4Gbit density, x16 organization, 933 MHz clock speed (DDR3L-1600), 20 ns tRCD, and a 96-ball VFBGA package. The device supports industrial temperature grades: the -12I grade guarantees -40°C to 95°C case temperature, and the -12J grade guarantees -40°C to 105°C. It is RoHS compliant and halogen-free, meeting environmental standards.
The W634GU6RB-12 utilizes advanced DRAM process technology, offering high-speed data transfer with low power consumption. The 8n-prefetch architecture enables burst lengths of 8, and the on-die termination (ODT) improves signal integrity. The device includes programmable CAS latency, burst length, and output drive strength, providing flexibility for system optimization.
Typical applications include networking equipment, industrial automation, embedded computing, and consumer electronics such as set-top boxes and smart TVs. The low voltage and high density make it ideal for space-constrained designs requiring large memory capacity.
When designing with this device, ensure proper decoupling capacitors near the VDD and VDDQ pins, and follow the PCB layout guidelines in the datasheet to minimize signal integrity issues. The device requires a 1.35V supply and a separate VDDQ supply, which should be well-regulated.
드롭인 대체품: W634GU6RB-12 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: W634GU6RB-12 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Data Rate, Operating Temperature, Supply Voltage, Organization.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
W634GU6RB-11TR
✅ 드롭인✓ 재고 있음
$32 / 개
데이터시트 보기 →W634GU6RB-09
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$9.69 / 개
데이터시트 보기 →W634GU6RB-12I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
W634GU6RB-12J
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MT41K256M16HA-125
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6.3636 / 개
데이터시트 보기 →K4B4G1646E-BYMA
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$14.3182 / 개
데이터시트 보기 →W634GU6RB-12 최대 정격 & 전기적 특성
| 메모리 유형 | SDRAM - DDR3L |
| 메모리 크기 | 4Gbit |
| 메모리 구성 | 256M x 16 |
| 인터페이스 | Parallel |
| Clock Frequency | 933 MHz |
| Access Time | 20 ns |
| 공급 전압 | 1.35V |
| 패키지 | 96-VFBGA (7.5x13) |
| Speed Grade | DDR3L-1600 (11-11-11) |
| 동작 온도 | -40°C to +95°C (12I), -40°C to +105°C (12J) |
| RoHS | Compliant |
| 할로겐 프리 | Yes |
| 실장 유형 | Surface Mount |
| 핀 수 | 96 |
| 데이터 속도 | 1600 MT/s |
W634GU6RB-12 핀 구성
| 핀 A1 | VDD — Power supply (1.35V) |
| 핀 A2 | DQ0 — Data input/output 0 |
| 핀 A3 | DQ1 — Data input/output 1 |
| 핀 A4 | VSS — Ground |
| 핀 A5 | DQ2 — Data input/output 2 |
| 핀 A6 | DQ3 — Data input/output 3 |
| 핀 A7 | VDDQ — I/O power supply |
| 핀 A8 | DQ4 — Data input/output 4 |
| 핀 A9 | DQ5 — Data input/output 5 |
| 핀 A10 | VSS — Ground |
| 핀 A11 | DQ6 — Data input/output 6 |
| 핀 A12 | DQ7 — Data input/output 7 |
일반적인 애플리케이션
W634GU6RB-12 적합 용도: 6 애플리케이션s: Networking Equipment, Industrial Automation, Embedded Computing, Consumer Electronics, Automotive Infotainment, Medical Devices.
Networking Equipment
The W634GU6RB-12 provides high-bandwidth, low-power memory for routers, switches, and network appliances. Its 4Gbit density and 933 MHz clock support high-throughput packet processing, while the 1.35V supply reduces power consumption in always-on network infrastructure. The industrial temperature grades (-12I/-12J) ensure reliable operation in uncontrolled environments. The x16 organization simplifies board layout and reduces component count, making it ideal for compact line cards and edge routers.
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Industrial Automation
In industrial automation, the W634GU6RB-12 offers reliable memory for PLCs, robotics controllers, and HMI systems. Its wide temperature range (-40°C to 105°C for -12J) ensures operation in factory floors without climate control. The low 1.35V supply reduces heat generation, critical in sealed enclosures. The 4Gbit capacity supports complex control algorithms and data logging. The 96-ball VFBGA package withstands vibration and thermal cycling, making it suitable for harsh industrial environments.
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Embedded Computing
The W634GU6RB-12 is ideal for embedded computing modules, single-board computers, and IoT gateways. Its 4Gbit density provides ample memory for Linux-based applications, while the 1.35V supply extends battery life in portable devices. The 933 MHz clock enables fast data processing for real-time analytics. The compact VFBGA package fits space-constrained designs. The industrial temperature grades support outdoor deployments, and the RoHS compliance meets environmental standards for global markets.
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Consumer Electronics
For consumer electronics like set-top boxes, smart TVs, and gaming consoles, the W634GU6RB-12 delivers high-speed memory at low power. The 4Gbit capacity supports HD video streaming and multitasking. The 1.35V supply reduces energy consumption, meeting energy-efficiency standards. The x16 interface simplifies PCB design, reducing BOM cost. The 96-ball VFBGA package is compact enough for slim devices. The -12 speed grade ensures smooth performance for multimedia applications.
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Automotive Infotainment
The W634GU6RB-12 supports automotive infotainment systems, providing reliable memory for navigation, audio, and display applications. Its industrial temperature grades (-12I/-12J) ensure operation in vehicle environments. The low 1.35V supply reduces heat and power draw, critical for battery-powered vehicles. The 4Gbit capacity handles map data and multimedia content. The VFBGA package is resistant to vibration, making it suitable for in-vehicle electronics. Note: AEC-Q100 qualification should be verified for strict automotive requirements.
추천
Medical Devices
In medical devices, the W634GU6RB-12 provides high-reliability memory for patient monitors, imaging systems, and diagnostic equipment. Its wide temperature range and RoHS compliance meet medical standards. The 4Gbit capacity supports large data sets for imaging and patient records. The low 1.35V supply reduces heat, important for portable devices. The industrial temperature grades ensure reliable operation in clinical environments. The compact package fits space-constrained medical instruments.
추천
추천 제품 요약
엔지니어링 참조 데이터: W634GU6RB-12 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | W634GU6RB-11 | W634GU6RB-09 | MT41K256M16HA-125 | K4B4G1646E-BYMA |
|---|---|---|---|---|---|
| Package | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-FBGA (7.5x13) | 96-FBGA (7.5x13) |
| Brand | Winbond Electronics | Winbond Electronics | Winbond Electronics | Micron Technology | Samsung Electronics |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | 4Gbit | 4Gbit |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Clock Frequency | 933 MHz | 933 MHz | 1066 MHz | 933 MHz | 933 MHz |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| Operating Temperature | -40°C to +95°C (12I), -40°C to +105°C (12J) | -40°C to +95°C (11I), -40°C to +105°C (11J) | -40°C to +95°C (09I), -40°C to +105°C (09J) | 0°C to +95°C (commercial) | 0°C to +95°C (commercial) |
| Speed Grade | DDR3L-1600 (11-11-11) | DDR3L-1333 (9-9-9) | DDR3L-1866 (13-13-13) | DDR3L-1600 (11-11-11) | DDR3L-1600 (11-11-11) |
주요 차별점
- Industrial temperature grades available (vs MT41K256M16HA-125)
- Higher speed grade option (vs W634GU6RB-11)
- Cross-brand compatibility (vs K4B4G1646E-BYMA)
설계 노트
The W634GU6RB-12 requires a 1.35V VDD supply and a separate VDDQ supply. Use low-impedance decoupling capacitors (e.g., 0.1uF and 1uF) close to each VDD and VDDQ pin to minimize voltage ripple. Ensure the power supply can handle peak current during refresh and burst operations.
Follow the PCB layout guidelines in the Winbond datasheet. Route DQ, DQS, and address lines with matched lengths to maintain signal integrity. Use ground planes under the VFBGA package to reduce noise. Place termination resistors for ODT as recommended.
The industrial temperature grades (-12I/-12J) allow operation up to 105°C case temperature. Ensure adequate airflow or heatsinking if the device is placed near other heat sources. The VFBGA package has a thermal resistance that should be considered in thermal design.
규정 준수 정보
RoHS compliant and halogen-free per Winbond datasheet. AEC-Q100 not specified in provided data.
