10M50DAF256I7G vs 10M50DAF484I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DAF256I7G disebabkan oleh Intel dan 10M50DAF484I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50DAF256I7G | 10M50DAF484I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (M9K bits) | 1,677,312 | — |
| DSP Blocks (18 x 18 multipliers) | 4 | — |
| Maximum User I/O | 178 | — |
| Kemasan | 256-LBGA (17 mm x 17 mm) | 484-ball FBGA (F484) |
| Configuration Memory | Internal non-volatile flash (dual-boot) | — |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs | 12-bit, 1 MSPS, up to 18 channels |
| PLLs | On-chip (4 typical for 10M50 family) | 4 |
| Core Voltage | 1.2 V | — |
| Suhu Operasi | -40C to +100C (Industrial) | — |
| Process Technology | TSMC 55 nm embedded flash | TSMC 55 nm |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (FBGA) |
| Tray Quantity | 90 per tray (typical for 256-BGA) | — |
| Status RoHS | Compliant | Compliant |
| Configuration Mode | Internal flash (instant-on) | Single-chip (no external boot device required) |
| Embedded Memory (bits) | — | 1,677,312 |
| Embedded User Flash (bits) | — | 1,677,312 (dual configuration) |
| User I/O Count | — | 360 |
| Package Pitch | — | 1.0 mm |
| Package Body Size | — | 23 x 23 mm |
| Supply Voltage - Core | — | 1.2 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| On-die Configuration Flash | — | Yes (dual-boot) |
| DSP Blocks | — | 144 (18x18 multipliers) |
| Aras MSL | — | 3 (per JEDEC J-STD-020) |
| Lead-free / Halogen-free | — | Yes / Yes |