10M50DAF256I7G vs 10M50DAF484I7G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 10M50DAF256I7G sa pamamagitan ng Intel at 10M50DAF484I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 10M50DAF256I7G 10M50DAF484I7G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family MAX 10 MAX 10
Logic Elements (LE) 50,000 50,000
Adaptive Logic Modules (ALM) [DATA_NEEDED: ALM count] —
Embedded Memory (M9K bits) 1,677,312 —
DSP Blocks (18 x 18 multipliers) 4 —
Maximum User I/O 178 —
Packhaging 256-LBGA (17 mm x 17 mm) 484-ball FBGA (F484)
Configuration Memory Internal non-volatile flash (dual-boot) —
Integrated ADC 12-bit SAR, up to 17 analog inputs 12-bit, 1 MSPS, up to 18 channels
PLLs On-chip (4 typical for 10M50 family) 4
Core Voltage 1.2 V —
Temperature na Operasyon -40C to +100C (Industrial) —
Process Technology TSMC 55 nm embedded flash TSMC 55 nm
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (FBGA)
Tray Quantity 90 per tray (typical for 256-BGA) —
Tindminan RoHS Compliant Compliant
Configuration Mode Internal flash (instant-on) Single-chip (no external boot device required)
Embedded Memory (bits) — 1,677,312
Embedded User Flash (bits) — 1,677,312 (dual configuration)
User I/O Count — 360
Package Pitch — 1.0 mm
Package Body Size — 23 x 23 mm
Supply Voltage - Core — 1.2 V
Operating Temperature Grade — Industrial (-40C to +100C)
On-die Configuration Flash — Yes (dual-boot)
DSP Blocks — 144 (18x18 multipliers)
Level ng MSL — 3 (per JEDEC J-STD-020)
Lead-free / Halogen-free — Yes / Yes

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