10M50DAF256I7G vs 10M50DAF484I7G Karşılaştırma
Ayrıntılı yan yana karşılaştırma 10M50DAF256I7G tarafından Intel ve 10M50DAF484I7G tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | 10M50DAF256I7G | 10M50DAF484I7G |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (M9K bits) | 1,677,312 | — |
| DSP Blocks (18 x 18 multipliers) | 4 | — |
| Maximum User I/O | 178 | — |
| Paket | 256-LBGA (17 mm x 17 mm) | 484-ball FBGA (F484) |
| Configuration Memory | Internal non-volatile flash (dual-boot) | — |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs | 12-bit, 1 MSPS, up to 18 channels |
| PLLs | On-chip (4 typical for 10M50 family) | 4 |
| Core Voltage | 1.2 V | — |
| İşletim Sıcaklığı | -40C to +100C (Industrial) | — |
| Process Technology | TSMC 55 nm embedded flash | TSMC 55 nm |
| Montaj Türü | Surface Mount (BGA) | Surface Mount (FBGA) |
| Tray Quantity | 90 per tray (typical for 256-BGA) | — |
| RoHS Durumu | Compliant | Compliant |
| Configuration Mode | Internal flash (instant-on) | Single-chip (no external boot device required) |
| Embedded Memory (bits) | — | 1,677,312 |
| Embedded User Flash (bits) | — | 1,677,312 (dual configuration) |
| User I/O Count | — | 360 |
| Package Pitch | — | 1.0 mm |
| Package Body Size | — | 23 x 23 mm |
| Supply Voltage - Core | — | 1.2 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| On-die Configuration Flash | — | Yes (dual-boot) |
| DSP Blocks | — | 144 (18x18 multipliers) |
| MSL Seviyesi | — | 3 (per JEDEC J-STD-020) |
| Lead-free / Halogen-free | — | Yes / Yes |