10M50DAF484I7P vs 10M50DAF484I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DAF484I7P disebabkan oleh Intel dan 10M50DAF484I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50DAF484I7P | 10M50DAF484I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Family | MAX 10 | — |
| Logic Elements (LE) | 50,000 | 50,000 |
| Embedded Memory (bits) | 1,677,312 | 1,677,312 |
| Embedded Memory Blocks | M9K (and M144K) | — |
| 18x18 Multipliers | 312 | — |
| User I/O Pins (max) | 360 | — |
| Kemasan | 484-ball FineLine BGA (F484) | 484-ball FBGA (F484) |
| Pitch | 1.0 mm | — |
| Process Node | 55 nm embedded flash (TSMC) | — |
| On-die Configuration Flash | Yes (non-volatile, instant-on) | Yes (dual-boot) |
| On-die ADC | Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs | — |
| PLLs | 8 (general-purpose, fractional on selected devices) | 4 |
| Global Clock Networks | 20 | — |
| Speed Grade | 7 (slowest industrial bin, highest margin) | — |
| Suhu Operasi | -40C to +100C (Tj, industrial) | — |
| Configuration Modes | Internal flash, JTAG, dual-boot image support | — |
| Status RoHS | Compliant | Compliant |
| Family | — | MAX 10 |
| Embedded User Flash (bits) | — | 1,677,312 (dual configuration) |
| User I/O Count | — | 360 |
| Package Pitch | — | 1.0 mm |
| Package Body Size | — | 23 x 23 mm |
| Process Technology | — | TSMC 55 nm |
| Supply Voltage - Core | — | 1.2 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Integrated ADC | — | 12-bit, 1 MSPS, up to 18 channels |
| DSP Blocks | — | 144 (18x18 multipliers) |
| Configuration Mode | — | Single-chip (no external boot device required) |
| Jenis Pemasangan | — | Surface Mount (FBGA) |
| Aras MSL | — | 3 (per JEDEC J-STD-020) |
| Lead-free / Halogen-free | — | Yes / Yes |