10M50DAF484I7P vs 10M50DAF484I7G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 10M50DAF484I7P sa pamamagitan ng Intel at 10M50DAF484I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 10M50DAF484I7P 10M50DAF484I7G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Product Family MAX 10 —
Logic Elements (LE) 50,000 50,000
Embedded Memory (bits) 1,677,312 1,677,312
Embedded Memory Blocks M9K (and M144K) —
18x18 Multipliers 312 —
User I/O Pins (max) 360 —
Packhaging 484-ball FineLine BGA (F484) 484-ball FBGA (F484)
Pitch 1.0 mm —
Process Node 55 nm embedded flash (TSMC) —
On-die Configuration Flash Yes (non-volatile, instant-on) Yes (dual-boot)
On-die ADC Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs —
PLLs 8 (general-purpose, fractional on selected devices) 4
Global Clock Networks 20 —
Speed Grade 7 (slowest industrial bin, highest margin) —
Temperature na Operasyon -40C to +100C (Tj, industrial) —
Configuration Modes Internal flash, JTAG, dual-boot image support —
Tindminan RoHS Compliant Compliant
Family — MAX 10
Embedded User Flash (bits) — 1,677,312 (dual configuration)
User I/O Count — 360
Package Pitch — 1.0 mm
Package Body Size — 23 x 23 mm
Process Technology — TSMC 55 nm
Supply Voltage - Core — 1.2 V
Operating Temperature Grade — Industrial (-40C to +100C)
Integrated ADC — 12-bit, 1 MSPS, up to 18 channels
DSP Blocks — 144 (18x18 multipliers)
Configuration Mode — Single-chip (no external boot device required)
Uri ng Pagpapasok — Surface Mount (FBGA)
Level ng MSL — 3 (per JEDEC J-STD-020)
Lead-free / Halogen-free — Yes / Yes

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