1EDN7116GXTMA1 vs 1EDN7136UXTSA1 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 1EDN7116GXTMA1 disebabkan oleh Infineon dan 1EDN7136UXTSA1 disebabkan oleh Infineon. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 1EDN7116GXTMA1 | 1EDN7136UXTSA1 |
|---|---|---|
| Merek | Infineon | Infineon |
| Kategori | Power MOSFET Drivers | Power MOSFET Drivers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Fungsi | Single-channel low-side gate driver for GaN HEMTs and Si MOSFETs | High-side / Low-side gate driver IC |
| Driver Configuration | Non-inverting, single low-side | — |
| Number of Drivers | 1 | — |
| Peak Source Current | 2 A (typ) | 1 A |
| Peak Sink Current | 4 A (typ) | 2 A |
| Input Type | Truly Differential Input (TDI) | Truly Differential Input (TDI) |
| Supply Voltage (VCC) | 4.5 V to 5.5 V | — |
| Switch-Node Blocking Voltage | 200 V (max) | — |
| Propagation Delay (Typ) | 9 ns | [DATA_NEEDED: propagation delay value] |
| Rise Time (Typ) | 3 ns | — |
| Fall Time (Typ) | 3 ns | — |
| Quiescent Current (Typ) | 0.6 mA | — |
| Miller Clamp | Integrated, active | — |
| UVLO | Yes (VCC and gate-rail monitored) | — |
| Gambaran Suhu Operasi | -40 °C to +125 °C | -40 C to +150 C |
| Kemasan | PG-VSON-10-4 (3.0 mm × 3.0 mm) | TSNP-6 with exposed pad (PG-VSON-1) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Aras MSL | MSL3 | [DATA_NEEDED: MSL rating] |
| Status RoHS | Compliant | Compliant |
| Target Switch Technology | GaN HEMT (CoolGaN) or Si MOSFET | — |
| Driven Device Type | — | GaN HEMT, N-channel MOSFET |
| Bilangan Output | — | 2 (high-side and low-side) |
| Driver Supply Voltage (Max) | — | 200 V |
| Logic Supply Voltage (VCC) | — | [DATA_NEEDED: VCC range] |
| Active Miller Clamp | — | Yes (integrated) |
| Under-Voltage Lockout (UVLO) | — | Yes (driver supply and logic input) |
| Lead-Free | — | Yes |
| Boson Bebas | — | Yes (per Infineon product family convention) |