EP2A25F672I6 vs EP2A25F672C7N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A25F672I6 disebabkan oleh Intel dan EP2A25F672C7N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2A25F672I6 EP2A25F672C7N
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Obsolete
Family APEX II APEX II
Logic Elements (typical gates) 25,000 —
Fabric Architecture SRAM-based LUT —
Process Technology 0.18 µm CMOS 0.15 µm all-layer copper (up to 8 metal layers)
Kemasan 672-ball FineLine BGA (FBGA-672) —
Core Voltage 1.5 V —
Configuration Method External SRAM configuration device (EPC series) —
Temperature Grade Industrial (-40 °C to +100 °C ambient) —
Speed Grade 6 —
Embedded Memory Embedded System Blocks (ESB), dual-port RAM / CAM Embedded System Blocks (ESB) configurable as dual-port RAM/ROM
DSP Blocks MultiCore dedicated multipliers —
Boundary Scan JTAG (IEEE 1149.1) compliant —
Clock Management Dedicated PLL / clock tree circuitry —
I/O Bank Count [DATA_NEEDED: number of user I/O banks] —
Status RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance]
Lead-Free [DATA_NEEDED: lead-free status] —
Aras MSL [DATA_NEEDED: moisture sensitivity level] —
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Logic Elements — 24,320 cells
System Gates — Approximately 900,000
User I/Os — 492
Propagation Delay (tPD) — 1.69 ns
Internal Operating Frequency — Up to 500 MHz
Core Voltage (VCCINT) — 1.5 V
Logic Family — CMOS
Package Type — 672-ball FC-FBGA (FineLine BGA)
Package Body Size — 27 x 27 mm
Ball Pitch — 1.0 mm
Suhu Operasi — 0 °C to 85 °C (commercial)
High-Speed I/O Support — True-LVDS, LVPECL, PCML, HyperTransport up to 1 Gbps
Programmable Logic Type — Loadable PLD (in-system programmable)
PLLs — Up to 4

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