EP2AGX125DF25I3G vs EP2AGX45DF25I3G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX125DF25I3G disebabkan oleh Intel dan EP2AGX45DF25I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP2AGX125DF25I3G EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel

EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel

EP2AGX125DF25I3G ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP2AGX125DF25I3G EP2AGX45DF25I3G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Aktif
Series Arria II GX —
Logic Elements 118,143 —
Embedded Memory 8,315,904 bits —
Number of I/O 260 —
Kemasan 572-BGA, FCBGA (Flip-Chip FineLine BGA) 572-ball FCBGA (HBGA)
Core Voltage 0.9 V —
Process Technology 40 nm —
Maximum Operating Frequency 500 MHz —
Transceivers Up to 12 (3.75 Gbps per channel) —
Suhu Operasi -40C to +100C (Industrial) —
Jenis Pemasangan Surface Mount Surface Mount (BGA)
Tegangan Pemberi Arus 0.9 V core —
DSP Blocks 18x18 multipliers —
Aras MSL [DATA_NEEDED: MSL Level] 3
Status RoHS Compliant Compliant
Family — Arria II GX
Logic Elements (LE) — 42,959
Adaptive Logic Modules (ALM) — 17,715
Embedded Memory Bits — 3,517,440 bits
Embedded Memory M9K Blocks — [DATA_NEEDED: M9K block count]
DSP Blocks (18x18 multipliers) — [DATA_NEEDED: DSP block count]
Maximum User I/O Pins — 252
Transceiver Channels — [DATA_NEEDED: MGT channel count]
Maximum Transceiver Data Rate — 6.375 Gbps
Package Dimensions — 25 mm x 25 mm
Gambaran Suhu Operasi — -40C to +100C (Industrial)
Speed Grade — I3
Process Node — 40 nm
Supply Voltage (Core) — [DATA_NEEDED: VCCINT]
Hard IP for PCIe — PCIe Gen1/Gen2 endpoints and root ports
Lead-Free — Yes

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