EP2AGX125DF25I3G vs EP2AGX45DF25I3G 比較

詳細並排比較 EP2AGX125DF25I3G 由 Intel 與 EP2AGX45DF25I3G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP2AGX125DF25I3G EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel

EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel

EP2AGX125DF25I3G ⚠ 最後購買機會

規格比較

參數 EP2AGX125DF25I3G EP2AGX45DF25I3G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 啟用中
Series Arria II GX —
Logic Elements 118,143 —
Embedded Memory 8,315,904 bits —
Number of I/O 260 —
封裝 572-BGA, FCBGA (Flip-Chip FineLine BGA) 572-ball FCBGA (HBGA)
Core Voltage 0.9 V —
Process Technology 40 nm —
Maximum Operating Frequency 500 MHz —
Transceivers Up to 12 (3.75 Gbps per channel) —
工作溫度 -40C to +100C (Industrial) —
安裝類型 Surface Mount Surface Mount (BGA)
供應電壓 0.9 V core —
DSP Blocks 18x18 multipliers —
MSL 等級 [DATA_NEEDED: MSL Level] 3
RoHS 狀態 Compliant Compliant
Family — Arria II GX
Logic Elements (LE) — 42,959
Adaptive Logic Modules (ALM) — 17,715
Embedded Memory Bits — 3,517,440 bits
Embedded Memory M9K Blocks — [DATA_NEEDED: M9K block count]
DSP Blocks (18x18 multipliers) — [DATA_NEEDED: DSP block count]
Maximum User I/O Pins — 252
Transceiver Channels — [DATA_NEEDED: MGT channel count]
Maximum Transceiver Data Rate — 6.375 Gbps
Package Dimensions — 25 mm x 25 mm
工作溫度範圍 — -40C to +100C (Industrial)
Speed Grade — I3
Process Node — 40 nm
Supply Voltage (Core) — [DATA_NEEDED: VCCINT]
Hard IP for PCIe — PCIe Gen1/Gen2 endpoints and root ports
Lead-Free — Yes

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