EP2C8F256CXNAA vs EP2C8F256I8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2C8F256CXNAA disebabkan oleh Intel dan EP2C8F256I8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2C8F256CXNAA | EP2C8F256I8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Cyclone II | — |
| Logic Elements | 8,256 | — |
| Embedded Memory (M4K blocks) | 36 blocks (162 Kbits total) | — |
| Embedded 18x18 Multipliers | 18 | Up to 36 |
| PLLs | 4 | 2 |
| Maximum User I/O Pins | 182 | — |
| User Flash Memory | 0 Kbits | — |
| Process Technology | 90 nm | 90 nm CMOS (SRAM-based) |
| Core Supply Voltage | 1.15 V to 1.25 V | 1.2 V |
| I/O Standards | LVCMOS, LVTTL (3.3V, 2.5V, 1.8V, 1.5V) | — |
| Kemasan | 256-ball FineLine BGA (F256), 1.0 mm pitch, 17x17 mm | — |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG | — |
| Operating Temperature (Industrial) | -40C to +85C (N suffix) | — |
| RoHS Compliance | Yes (lead-free) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | 3 | — |
| Series | — | Cyclone II |
| Logic Elements (LEs) | — | 8,256 |
| Embedded Memory Bits | — | 165,888 bits |
| Total RAM Bits | — | 165,888 |
| Logic Blocks / Logic Cells | — | 540 (Logic Cells) |
| User I/O Pins | — | 182 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Global Clock Networks | — | 16 |
| I/O Supply Voltage | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Package Type | — | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch |
| Suhu Operasi | — | -40C to +85C (industrial) |
| Configuration Method | — | SRAM, loaded from external EPCS flash at power-up |
| Status RoHS | — | Compliant (Pb-free, lead-free reflow compatible) |