EP2C8F256CXNAA vs EP2C8F256I8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2C8F256CXNAA sa pamamagitan ng Intel at EP2C8F256I8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2C8F256CXNAA | EP2C8F256I8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Cyclone II | — |
| Logic Elements | 8,256 | — |
| Embedded Memory (M4K blocks) | 36 blocks (162 Kbits total) | — |
| Embedded 18x18 Multipliers | 18 | Up to 36 |
| PLLs | 4 | 2 |
| Maximum User I/O Pins | 182 | — |
| User Flash Memory | 0 Kbits | — |
| Process Technology | 90 nm | 90 nm CMOS (SRAM-based) |
| Core Supply Voltage | 1.15 V to 1.25 V | 1.2 V |
| I/O Standards | LVCMOS, LVTTL (3.3V, 2.5V, 1.8V, 1.5V) | — |
| Packhaging | 256-ball FineLine BGA (F256), 1.0 mm pitch, 17x17 mm | — |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG | — |
| Operating Temperature (Industrial) | -40C to +85C (N suffix) | — |
| RoHS Compliance | Yes (lead-free) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | 3 | — |
| Series | — | Cyclone II |
| Logic Elements (LEs) | — | 8,256 |
| Embedded Memory Bits | — | 165,888 bits |
| Total RAM Bits | — | 165,888 |
| Logic Blocks / Logic Cells | — | 540 (Logic Cells) |
| User I/O Pins | — | 182 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Global Clock Networks | — | 16 |
| I/O Supply Voltage | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Package Type | — | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch |
| Temperature na Operasyon | — | -40C to +85C (industrial) |
| Configuration Method | — | SRAM, loaded from external EPCS flash at power-up |
| Tindminan RoHS | — | Compliant (Pb-free, lead-free reflow compatible) |