EP2C8F256CXNAA vs EP2C8F256I8N 比較

詳細並排比較 EP2C8F256CXNAA 由 Intel 與 EP2C8F256I8N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2C8F256CXNAA EP2C8F256I8N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Cyclone II —
Logic Elements 8,256 —
Embedded Memory (M4K blocks) 36 blocks (162 Kbits total) —
Embedded 18x18 Multipliers 18 Up to 36
PLLs 4 2
Maximum User I/O Pins 182 —
User Flash Memory 0 Kbits —
Process Technology 90 nm 90 nm CMOS (SRAM-based)
Core Supply Voltage 1.15 V to 1.25 V 1.2 V
I/O Standards LVCMOS, LVTTL (3.3V, 2.5V, 1.8V, 1.5V) —
封裝 256-ball FineLine BGA (F256), 1.0 mm pitch, 17x17 mm —
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG —
Operating Temperature (Industrial) -40C to +85C (N suffix) —
RoHS Compliance Yes (lead-free) —
安裝類型 Surface Mount (BGA) Surface Mount (BGA)
MSL 等級 3 —
Series — Cyclone II
Logic Elements (LEs) — 8,256
Embedded Memory Bits — 165,888 bits
Total RAM Bits — 165,888
Logic Blocks / Logic Cells — 540 (Logic Cells)
User I/O Pins — 182
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
Global Clock Networks — 16
I/O Supply Voltage — 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent)
Package Type — 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch
工作溫度 — -40C to +85C (industrial)
Configuration Method — SRAM, loaded from external EPCS flash at power-up
RoHS 狀態 — Compliant (Pb-free, lead-free reflow compatible)

資料表與資源

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