EP2SGX90EF1152C4N vs EP2SGX90EF1152C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX90EF1152C4N disebabkan oleh Intel dan EP2SGX90EF1152C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
EP2SGX90EF1152C4N ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP2SGX90EF1152C4N | EP2SGX90EF1152C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90,960 | 90960 |
| LABs/CLBs | 4,548 | — |
| Total RAM Bits | 4,520,448 bits | — |
| User I/O Count | 558 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Node | 90 nm | — |
| Transceivers | Up to 20 channels, 6.375 Gbps per channel | — |
| Speed Grade | C4 | EF |
| Suhu Operasi | Commercial (0C to +85C) | 0C to +85C (Commercial) |
| Kemasan | 1152-BBGA / FC-FBGA-1152 | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | MSL-3 / MS-034AAR-1 (per package outline) | — |
| Lead-Free / RoHS | Lead free; RoHS compliance per JEDEC | Yes (RoHS compliant) |
| Series | — | Stratix II GX |
| Number of LABs/CLBs | — | 4548 |
| Total Memory Bits | — | 4520448 |
| User I/Os | — | 558 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count per family] |
| Process Technology | — | 90 nm |
| Operating Frequency (max) | — | 816.9 MHz |
| Package Type | — | FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Pin Count | — | 1152 balls |
| Package Dimensions | — | 34 mm x 34 mm |
| Temperature Grade | — | C3 (Commercial) |