EP3C25F324C8N vs EP3C25F324I7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C25F324C8N disebabkan oleh Intel dan EP3C25F324I7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C25F324C8N | EP3C25F324I7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Cyclone III | — |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 24,624 | 24,624 |
| Total Memory Bits | 608,256 bits | — |
| Embedded Memory (Kbits) | 608 Kbits | — |
| Number of I/O | 215 | — |
| Kemasan | 324-BGA (FineLine) | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Supply Voltage - Core | 1.2 V | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | 0 C to +85 C (commercial, suffix C) | — |
| Speed Grade | 8 | — |
| Total RAM Bits | 608,256 | — |
| Process Node | 60 nm low-power CMOS | — |
| Number of Multipliers (18x18) | 66 | — |
| Number of PLLs | 4 | — |
| Status RoHS | Compliant | Compliant |
| Logic Array Blocks (LABs) | — | 1,539 |
| Embedded Memory | — | 608,256 bits (594 Kbits M9K blocks) |
| Embedded 18x18 Multipliers | — | 66 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum User I/O | — | 215 |
| Process Technology | — | TSMC 65 nm low-power CMOS |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (per bank) |
| Suhu Hubungan Operasi | — | -40 °C to +100 °C (industrial) |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |