EP3C25F324C8N vs EP3C25F324I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F324C8N sa pamamagitan ng Intel at EP3C25F324I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C25F324C8N | EP3C25F324I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Cyclone III | — |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 24,624 | 24,624 |
| Total Memory Bits | 608,256 bits | — |
| Embedded Memory (Kbits) | 608 Kbits | — |
| Number of I/O | 215 | — |
| Packhaging | 324-BGA (FineLine) | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Supply Voltage - Core | 1.2 V | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0 C to +85 C (commercial, suffix C) | — |
| Speed Grade | 8 | — |
| Total RAM Bits | 608,256 | — |
| Process Node | 60 nm low-power CMOS | — |
| Number of Multipliers (18x18) | 66 | — |
| Number of PLLs | 4 | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Array Blocks (LABs) | — | 1,539 |
| Embedded Memory | — | 608,256 bits (594 Kbits M9K blocks) |
| Embedded 18x18 Multipliers | — | 66 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum User I/O | — | 215 |
| Process Technology | — | TSMC 65 nm low-power CMOS |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (per bank) |
| Temperature ng Junction na Operasyon | — | -40 °C to +100 °C (industrial) |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |