EP3C55F484C6 vs EP3C55F484C8 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C55F484C6 disebabkan oleh Intel dan EP3C55F484C8 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3C55F484C6 EP3C55F484C8
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Cyclone III —
Series EP3C55 —
Logic Elements 55,856 LE —
Embedded Memory 2,396,160 bits (2.4 Mbit) —
Maximum User I/O 327 —
Kemasan 484-FBGA (F484) 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height
Process Technology 65 nm low-power CMOS 65 nm low-power CMOS
Core Voltage 1.2 V —
Speed Grade 6 (commercial) C8 (commercial, -8)
Number of PLLs 4 —
Global Clock Networks 20 20
Embedded 18x18 Multipliers 56 312
I/O Banks 8 —
Supported I/O Standards LVDS, LVTTL, LVCMOS, SSTL, HSTL —
Configuration JTAG, AS (EPCS), PS, FPP —
Jenis Pemasangan Surface Mount (BGA) —
Status RoHS Compliant —
Suhu Operasi 0C to +85C (commercial) Commercial (0C to +85C)
Device Family — Cyclone® III
Logic Elements (LEs) — 55,856
Logic Array Blocks (LABs) — 3,491
Embedded Memory Bits — 2,396,160 bits
User I/Os — 327
PLLs — 4
Maximum Core Frequency — 472.5 MHz
Configuration Modes — JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS)
Lead-Free / RoHS — Yes (Pb-free FBGA)
Tegangan Pemberi Arus — Core 1.2 V typical, I/O bank dependent
I/O Standards Supported — LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others

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