EP3C55F484C6 vs EP3C55F484C8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F484C6 sa pamamagitan ng Intel at EP3C55F484C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C55F484C6 | EP3C55F484C8 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | — |
| Series | EP3C55 | — |
| Logic Elements | 55,856 LE | — |
| Embedded Memory | 2,396,160 bits (2.4 Mbit) | — |
| Maximum User I/O | 327 | — |
| Packhaging | 484-FBGA (F484) | 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| Speed Grade | 6 (commercial) | C8 (commercial, -8) |
| Number of PLLs | 4 | — |
| Global Clock Networks | 20 | 20 |
| Embedded 18x18 Multipliers | 56 | 312 |
| I/O Banks | 8 | — |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Configuration | JTAG, AS (EPCS), PS, FPP | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Tindminan RoHS | Compliant | — |
| Temperature na Operasyon | 0C to +85C (commercial) | Commercial (0C to +85C) |
| Device Family | — | Cyclone® III |
| Logic Elements (LEs) | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3,491 |
| Embedded Memory Bits | — | 2,396,160 bits |
| User I/Os | — | 327 |
| PLLs | — | 4 |
| Maximum Core Frequency | — | 472.5 MHz |
| Configuration Modes | — | JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) |
| Lead-Free / RoHS | — | Yes (Pb-free FBGA) |
| Volte ng Pagbibigay | — | Core 1.2 V typical, I/O bank dependent |
| I/O Standards Supported | — | LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others |