EP3C55F484C6 vs EP3C55F484C8 比較

詳細並排比較 EP3C55F484C6 由 Intel 與 EP3C55F484C8 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3C55F484C6 EP3C55F484C8
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Cyclone III —
Series EP3C55 —
Logic Elements 55,856 LE —
Embedded Memory 2,396,160 bits (2.4 Mbit) —
Maximum User I/O 327 —
封裝 484-FBGA (F484) 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height
Process Technology 65 nm low-power CMOS 65 nm low-power CMOS
Core Voltage 1.2 V —
Speed Grade 6 (commercial) C8 (commercial, -8)
Number of PLLs 4 —
Global Clock Networks 20 20
Embedded 18x18 Multipliers 56 312
I/O Banks 8 —
Supported I/O Standards LVDS, LVTTL, LVCMOS, SSTL, HSTL —
Configuration JTAG, AS (EPCS), PS, FPP —
安裝類型 Surface Mount (BGA) —
RoHS 狀態 Compliant —
工作溫度 0C to +85C (commercial) Commercial (0C to +85C)
Device Family — Cyclone® III
Logic Elements (LEs) — 55,856
Logic Array Blocks (LABs) — 3,491
Embedded Memory Bits — 2,396,160 bits
User I/Os — 327
PLLs — 4
Maximum Core Frequency — 472.5 MHz
Configuration Modes — JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS)
Lead-Free / RoHS — Yes (Pb-free FBGA)
供應電壓 — Core 1.2 V typical, I/O bank dependent
I/O Standards Supported — LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others

資料表與資源

瀏覽所有產品 建立 BOM 索取報價