EP3SE260F1517I3N vs EP3SE260F1517I3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1517I3N disebabkan oleh Intel dan EP3SE260F1517I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE260F1517I3N | EP3SE260F1517I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Family | Stratix® III E | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits | 16,672,768 |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/O Count | 976 | 976 |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm | — |
| Kemasan | 1517-ball FC-FBGA | 1517-ball FC-FBGA (Flip-Chip BGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Speed Grade | -3 (fastest) | — |
| Temperature Grade | Industrial (I): -40 °C to +100 °C | — |
| Suhu Hubungan Operasi | -40 °C to +100 °C | — |
| Configuration Method | JTAG / Passive Serial / Active Serial | — |
| Status RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Internal Logic Performance | Up to 500 MHz | — |
| Memory Subsystems | M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers | — |
| DSP Blocks | Yes (dedicated multiply-accumulate) | — |
| Maximum Operating Frequency | — | 500 MHz |
| Process Node | — | 65 nm |
| Embedded Multipliers | — | 768 (18x18) |
| PLL Count | — | 12 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Lead-Free / RoHS | — | Yes (RoHS compliant per DigiKey listing) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |