EP3SE260F1517I3N vs EP3SE260F1517I3G 比較

詳細並排比較 EP3SE260F1517I3N 由 Intel 與 EP3SE260F1517I3G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE260F1517I3N EP3SE260F1517I3G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete NRND
Family Stratix® III E Stratix III E
Logic Elements 255,000 255,000
Embedded Memory Bits 16,672,768 bits 16,672,768
Logic Array Blocks (LABs) 10,200 —
User I/O Count 976 976
Core Voltage 1.1 V 1.1 V
Process Technology 65 nm —
封裝 1517-ball FC-FBGA 1517-ball FC-FBGA (Flip-Chip BGA)
安裝類型 Surface Mount Surface Mount
Speed Grade -3 (fastest) —
Temperature Grade Industrial (I): -40 °C to +100 °C —
工作接面溫度 -40 °C to +100 °C —
Configuration Method JTAG / Passive Serial / Active Serial —
RoHS 狀態 Compliant —
Lead-Free Yes —
Internal Logic Performance Up to 500 MHz —
Memory Subsystems M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers —
DSP Blocks Yes (dedicated multiply-accumulate) —
Maximum Operating Frequency — 500 MHz
Process Node — 65 nm
Embedded Multipliers — 768 (18x18)
PLL Count — 12
Transceiver Data Rate — Up to 6.375 Gbps
Operating Temperature Grade — Industrial (-40C to +100C)
Lead-Free / RoHS — Yes (RoHS compliant per DigiKey listing)
MSL 等級 — [DATA_NEEDED: MSL level]

資料表與資源

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