EP3SE260F1517I3N vs EP3SE260F1517I3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517I3N sa pamamagitan ng Intel at EP3SE260F1517I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260F1517I3N EP3SE260F1517I3G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete NRND
Family Stratix® III E Stratix III E
Logic Elements 255,000 255,000
Embedded Memory Bits 16,672,768 bits 16,672,768
Logic Array Blocks (LABs) 10,200 —
User I/O Count 976 976
Core Voltage 1.1 V 1.1 V
Process Technology 65 nm —
Packhaging 1517-ball FC-FBGA 1517-ball FC-FBGA (Flip-Chip BGA)
Uri ng Pagpapasok Surface Mount Surface Mount
Speed Grade -3 (fastest) —
Temperature Grade Industrial (I): -40 °C to +100 °C —
Temperature ng Junction na Operasyon -40 °C to +100 °C —
Configuration Method JTAG / Passive Serial / Active Serial —
Tindminan RoHS Compliant —
Lead-Free Yes —
Internal Logic Performance Up to 500 MHz —
Memory Subsystems M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers —
DSP Blocks Yes (dedicated multiply-accumulate) —
Maximum Operating Frequency — 500 MHz
Process Node — 65 nm
Embedded Multipliers — 768 (18x18)
PLL Count — 12
Transceiver Data Rate — Up to 6.375 Gbps
Operating Temperature Grade — Industrial (-40C to +100C)
Lead-Free / RoHS — Yes (RoHS compliant per DigiKey listing)
Level ng MSL — [DATA_NEEDED: MSL level]

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