EP3SE260H780C2N vs EP3SE260F1152C2N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780C2N disebabkan oleh Intel dan EP3SE260F1152C2N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP3SE260H780C2N | EP3SE260F1152C2N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Obsolete |
| Series | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | — |
| LABs / CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 488 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | — |
| Kemasan | 780-BGA FCBGA | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Gambaran Suhu Operasi | Commercial (0C to +85C) | — |
| Speed Grade | C2 | — |
| Aras MSL | 3 (168 hours) | [DATA_NEEDED: MSL rating] |
| Reflow Peak Time Max | 40 s | — |
| Status RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 780 | — |
| Process Node | 40 nm | — |
| Family | — | FPGA - Field Programmable Gate Array |
| Number of Logic Elements | — | 255000 |
| Number of LABs/CLBs | — | 10200 |
| Total Memory Bits | — | 16672768 |
| Number of I/O | — | 744 |
| Voltage - Supply | — | 1.1 V |
| Suhu Operasi | — | [DATA_NEEDED: operating temperature grade] |
| Kemasan / Case | — | 1152-BBGA, FCBGA |
| Process Technology | — | 65 nm |
| Maximum Frequency | — | 600 MHz |
| Supplier Device Package | — | 1152-FCBGA |
| Lead Free | — | Yes (per EP3SE260F1152C2G comparison) |
| ECCN | — | [DATA_NEEDED: ECCN code] |
| Moisture Sensitivity | — | [DATA_NEEDED: MSL level] |