EP3SE260H780C4L vs EP3SE260H780I4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780C4L disebabkan oleh Intel dan EP3SE260H780I4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE260H780C4L | EP3SE260H780I4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 255,000 | 255,000 |
| LABs/CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 (16.7 Mbit) | — |
| User I/O Count | 488 | — |
| Kemasan | 780-ball FCBGA (HBGA 33x33 mm) | 780-ball FC-HFBGA (HBGA) |
| Speed Grade | C4 (middle/slow tier) | 4 |
| Core Voltage | 0.9 V (nominal) | 1.1 V |
| Suhu Hubungan Operasi | 0C to +85C (commercial) | — |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | Compliant (lead-free per datasheet) | [DATA_NEEDED: RoHS compliance status] |
| Transceivers | Up to 24 multi-gigabit transceivers | — |
| Memory Interface | DDR3, DDR2, QDRII+, RLDRAM II controllers | — |
| Configuration Mode | PS, FPP, JTAG with EPCS/EPCQ | — |
| Logic Cells | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Adaptive Logic Modules (ALMs) | — | approximately 203,200 |
| Maximum User I/Os | — | 488 |
| Process Technology | — | 65 nm CMOS |
| Embedded RAM (total) | — | approximately 14.4 Mbit (M9K/M144K blocks) |
| DSP Blocks | — | approximately 768 (18x18 multipliers) |
| Maximum Operating Frequency | — | up to 450 MHz core / 717 MHz per Partstack record |
| Suhu Operasi | — | -40C to +100C (industrial, 'I' grade) |
| Configuration Schemes | — | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |