EP3SE260H780C4L vs EP3SE260H780I4 比較

詳細並排比較 EP3SE260H780C4L 由 Intel 與 EP3SE260H780I4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE260H780C4L EP3SE260H780I4
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Stratix III E Stratix III Enhanced (Stratix III E)
Logic Elements 255,000 255,000
LABs/CLBs 10,200 —
Total RAM Bits 16,672,768 (16.7 Mbit) —
User I/O Count 488 —
封裝 780-ball FCBGA (HBGA 33x33 mm) 780-ball FC-HFBGA (HBGA)
Speed Grade C4 (middle/slow tier) 4
Core Voltage 0.9 V (nominal) 1.1 V
工作接面溫度 0C to +85C (commercial) —
安裝類型 Surface Mount (flip-chip BGA) Surface Mount (BGA)
MSL 等級 [DATA_NEEDED: MSL level] —
RoHS 狀態 Compliant (lead-free per datasheet) [DATA_NEEDED: RoHS compliance status]
Transceivers Up to 24 multi-gigabit transceivers —
Memory Interface DDR3, DDR2, QDRII+, RLDRAM II controllers —
Configuration Mode PS, FPP, JTAG with EPCS/EPCQ —
Logic Cells — 255,000
Logic Array Blocks (LABs) — 10,200
Adaptive Logic Modules (ALMs) — approximately 203,200
Maximum User I/Os — 488
Process Technology — 65 nm CMOS
Embedded RAM (total) — approximately 14.4 Mbit (M9K/M144K blocks)
DSP Blocks — approximately 768 (18x18 multipliers)
Maximum Operating Frequency — up to 450 MHz core / 717 MHz per Partstack record
工作溫度 — -40C to +100C (industrial, 'I' grade)
Configuration Schemes — JTAG, Passive Serial, Fast Passive Parallel, Active Serial

資料表與資源

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