EP3SE260H780C4L vs EP3SE260H780I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C4L sa pamamagitan ng Intel at EP3SE260H780I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260H780C4L | EP3SE260H780I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 255,000 | 255,000 |
| LABs/CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 (16.7 Mbit) | — |
| User I/O Count | 488 | — |
| Packhaging | 780-ball FCBGA (HBGA 33x33 mm) | 780-ball FC-HFBGA (HBGA) |
| Speed Grade | C4 (middle/slow tier) | 4 |
| Core Voltage | 0.9 V (nominal) | 1.1 V |
| Temperature ng Junction na Operasyon | 0C to +85C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Tindminan RoHS | Compliant (lead-free per datasheet) | [DATA_NEEDED: RoHS compliance status] |
| Transceivers | Up to 24 multi-gigabit transceivers | — |
| Memory Interface | DDR3, DDR2, QDRII+, RLDRAM II controllers | — |
| Configuration Mode | PS, FPP, JTAG with EPCS/EPCQ | — |
| Logic Cells | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Adaptive Logic Modules (ALMs) | — | approximately 203,200 |
| Maximum User I/Os | — | 488 |
| Process Technology | — | 65 nm CMOS |
| Embedded RAM (total) | — | approximately 14.4 Mbit (M9K/M144K blocks) |
| DSP Blocks | — | approximately 768 (18x18 multipliers) |
| Maximum Operating Frequency | — | up to 450 MHz core / 717 MHz per Partstack record |
| Temperature na Operasyon | — | -40C to +100C (industrial, 'I' grade) |
| Configuration Schemes | — | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |