EP3SE260H780I4L vs EP3SE260H780C4L Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780I4L disebabkan oleh Intel dan EP3SE260H780C4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE260H780I4L EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE260H780I4L EP3SE260H780C4L
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli NRND
Family Stratix III E (Enhanced) Stratix III E
Logic Elements 255,000 255,000
Total Memory Bits 16,672,640 —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
User I/O Count 488 488
Core Voltage 0.9 V 0.9 V (nominal)
Process Technology 65 nm —
Package Type 780-pin FC-HFBGA (flip-chip BGA) —
Jenis Pemasangan Surface Mount (flip-chip) Surface Mount (flip-chip BGA)
Number of Transceivers 24 (family-level maximum, per-pin count depends on variant) —
Max Transceiver Data Rate 6.375 Gbps (Stratix III E family spec) —
Number of 18x18 Multipliers [DATA_NEEDED: per-package multiplier count] —
Suhu Operasi Industrial, -40C to +85C —
Status RoHS Compliant (lead-free) Compliant (lead-free per datasheet)
Configuration Mode JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel PS, FPP, JTAG with EPCS/EPCQ
Pin/Package 780-BBGA, FCBGA (flip-chip) —
LABs/CLBs — 10,200
Total RAM Bits — 16,672,768 (16.7 Mbit)
Kemasan — 780-ball FCBGA (HBGA 33x33 mm)
Speed Grade — C4 (middle/slow tier)
Suhu Hubungan Operasi — 0C to +85C (commercial)
Aras MSL — [DATA_NEEDED: MSL level]
Transceivers — Up to 24 multi-gigabit transceivers
Memory Interface — DDR3, DDR2, QDRII+, RLDRAM II controllers

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